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Pillow with retractable umbrella
A pillow assembly having a supporting assembly and a retractable umbrella assembly that is easily transportable and allows a user to support his/her head while covering their face from sunlight.
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| Number | Title | Issue Date |
| 7267259 | Method for enhancing the solderability of a surface A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty a... | 09/11/2007 |
| 7134199 | Fluxless bumping process A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. P... | 11/14/2006 |
| 7064065 | Silver under-layers for electroless cobalt alloys In one embodiment, a method for depositing a capping layer on a substrate surface containing a copper layer is provided which includes exposing the substrate surface to a zinc solution, exposing the substrate surface to a silver solution to form a silver layer there... | 06/20/2006 |
| 7056597 | Brazing sheet product and method of its manufacture Disclosed is a brazing sheet product comprising a core metal sheet, on at least one side of the core sheet a clad layer of an aluminium brazing alloy comprising silicon in an amount in the range of 4 to 14% by weight, and further comprising on at least one outersurf... | 06/06/2006 |
| 6923875 | Solder precipitating composition According to present invention, there is provided a lead-free solder precipitating composition comprising a tin powder, and a complex of silver ions and/or copper ions and aryl phosphines, alkyl phosphine, phosphines or azoles. The solder precipitating composition c... | 08/02/2005 |
| 6905587 | Method for enhancing the solderability of a surface A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty a... | 06/14/2005 |
| 6814276 | Process for soldering and connecting structure A barrier metal layer is provided on at least one electrodes, wherein one electrode is formed on a substrate and another is connected to an electronic component, so as to coat a base material of the electrode. The base material is made of a material containing Cu. S... | 11/09/2004 |
| 6783867 | Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the same A highly reliable member for a semiconductor device, in which a high melting point metallizing layer, which consists mainly of a high melting point metal such as W and/or Mo, and an intervening metal layer, which has a melting point of not greater than 1,000° C. an... | 08/31/2004 |
| 6783056 | Method and apparatus for applying flux for use in brazing aluminum material Fluoride-based flux is uniformly dispersed in and mixed with synthetic resin, which has fluidity at room temperature and sublimes at a temperature lower than a brazing temperature, so as to constitute 40 to 70 wt. % of the mixture, thereby producing coating material... | 08/31/2004 |
| 6779711 | Self-aligned corrosion stop for copper C4 and wirebond A self-aligned process for fabricating a corrosion-resistant conductive pad on a substrate, and a structure that includes an interconnect to allow a terminal connection to the pad. The process generates a metallic layer on an initially exposed metal layer. The metal... | 08/24/2004 |
| 6691912 | Methods of avoiding blowhole formation by conditioning through holes and glass A composition and method for cleaning and conditioning a non-conductive surface defined by a through hole in a printed circuit board (PCB) is disclosed. The through hole surface is contacted with the composition of the invention to provide a cleaned and c... | 02/17/2004 |
| 6613397 | Method and apparatus for manufacturing an aluminum clad product In a method for manufacturing an Al clad product, first, cladding material is fused and coated on base material having Al. Then, slurry material is coated on the cladding material coated on the base material, the slurry material including mixture of a flu... | 09/02/2003 |
| 6575355 | Solder application technique A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal ... | 06/10/2003 |
| 6572010 | Integrated solder bump deposition apparatus and method An integrated solder bump deposition method and apparatus that enables solder bumps to be lithographically formed on a substrate. The apparatus comprises a plurality of electrolyte cells, and etch/clean/passthrough station and a reflow chamber.... | 06/03/2003 |
| 6474536 | Flux composition and corresponding soldering method A new soldering flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards is disclosed. The new flux composition includes chemical reducing agents such as hydrazine, hydroxylamine, dimethylamine boran... | 11/05/2002 |
| 6428911 | Soldering method and soldered joint The present invention provides a soldering method and a soldered joint securing a strength of joint equivalent to soldering using a conventional Pb--Sn solder alloy without having a detrimental effect on the environment and without causing a rise in cost.... | 08/06/2002 |
| 6375822 | Method for enhancing the solderability of a surface A process for enhancing the solderability of a surface, particularly copper surfaces upon printed circuit boards, is disclosed. The surface is plated using a silver plating solution. The plated surface is then further treated with a solution that comprise... | 04/23/2002 |
| 6317913 | Method of depositing flux or flux and metal onto a metal brazing substrate The present invention is directed to a means for the surface preparation of a metal or metal alloy substrate. In the process of the present invention, a stream of a mixture of flux particles and metal particles is hurled at the substrate at velocities eff... | 11/20/2001 |
| 6283360 | Composition for preventing creeping of a flux for soldering The present invention relates to a composition for preventing creeping of a flux for soldering, which is free from a problem from the viewpoint of the global environment or working environment. The present invention provides a composition for preventing c... | 09/04/2001 |
| 6234379 | No-flow flux and underfill dispensing methods A method for attaching a semiconductor die or flip chip to a substrate to form a printed circuit board. A dispensing apparatus is spaced away from a substrate so that the dispenser does not contact the substrate. Droplets of no-flow flux and underfill mat... | 05/22/2001 |
| 6204490 | Method and apparatus of manufacturing an electronic circuit board Electronic components are bonded to an electronic circuit board with a lead-free solder. The bonded structure is cooled from a temperature close to the liquids temperature of the solder to a temperature close to the solids temperature of the solder at a f... | 03/20/2001 |
| 6073829 | Method and arrangement for attaching a component The invention is related to a method of fabricating an attachment bump of a component (11). In accordance with the invention, a flexible preform (13a) is fabricated, which is plated with materials (13b) appropriate for metallurgical bonding. The invention... | 06/13/2000 |
| 5967400 | Method of forming metal matrix fiber composites The method provides a process for fabricating metal matrix composites. First the process coats the fibers with nickel by electrodeposition or gaseous deposition to form nickel-coated fibers. Over-plating the nickel-coated fibers with aluminum by either el... | 10/19/1999 |
| 5960251 | Organic-metallic composite coating for copper surface protection Copper-containing surfaces of substrates such as laminated electronic circuit boards are protected by organometallic coatings comprising organic compounds selected from the group consisting of benzimidazoles, alkylimidazoles, benzotriazozles and alkyltria... | 09/28/1999 |
| 5759379 | Solder method A soldering method for soldering electronic components onto a copper (Cu) substrate using a tin (Sn) solder alloy. The method comprises in pretreating the Cu substrate by depositing a thin layer of zinc (Zn) before the deposition of the Sn solder alloy. T... | 06/02/1998 |
| 5672261 | Method for brazing an end plate within an open body end, and brazed article A method for preparing a Ni base superalloy inner wall surface of a body open end, such as an end of a turbomachinery blade, and an end plate, such as a blade tip cap, for brazing together at a rim of the end plate includes electrochemically removing oxid... | 09/30/1997 |
| 5626279 | Method for fastening a first substrate on a second substrate and employment of said method for manufacturing a three-dimensional circuit arrangement For fastening a first substrate (11) on a second substrate (21), gallium is selectively deposited on the surface of electrically conductive structures (18) located on the first substrate (11), being deposited in a CVD process upon employment of a metalloo... | 05/06/1997 |
| 5601228 | Solder-precipitating composition and mounting method using the composition The invention provides a solder-precipitating composition containing Sn-Pb alloy powder and an organic acid salt of Pb as essential components, and capable of precipitating solder as a result of substitution between Sn contained in the Sn-Pb alloy powder ... | 02/11/1997 |
| 5428889 | Method for manufacturing composite lead frame An outer lead of a metal lead frame is connected to an inner lead of a flexible lead-patterned substrate via a Au--Sn alloy layer. The Au--Sn alloy layer contains Au of 10 to 40 weight %. An inner lead of a metal lead frame is connected to a patterned lea... | 07/04/1995 |
| 5411199 | Method for attaching a shield A method for attaching a shield (102) to a an electronic assembly (116) having a heat sink (110) includes applying solder on the inner walls (104) of the shield (102). Next, the shield (102) is placed over the electronic assembly (116) such that the elect... | 05/02/1995 |
| 5402926 | Brazing method using patterned metallic film having high wettability with respect to low-wettability brazing metal between components to be bonded together A method of brazing a plurality of components by heating the components superposed on each other with a brazing material interposed between adjacent bonding surfaces of the components, wherein the brazing material has a relatively low degree of wettabilit... | 04/04/1995 |
| 5318217 | Method of enhancing bond joint structural integrity of spray cast article In a method of making a load-bearing article by spray casting a molten metal onto a metal substrate, the substrate surface receiving the spray cast deposit is treated by vacuum cleaning, boronizing and/or knurling to enhance the structural integrity of th... | 06/07/1994 |
| 5316788 | Applying solder to high density substrates Process is described for applying large quantities of solder to small areas, such as the lands in a high density card, to which it is intended to surface mount electronic devices or directly attach circuitized chips. The land area is temporarily extended ... | 05/31/1994 |
| 5275328 | Methods of joining components This method enables two components (1, 3) to be joined by soldering using heat generated by a laser beam, without the use of flux. A layer (5) of a material which has a lower melting point than the material of one of the components (3) is formed on that c... | 01/04/1994 |
| 5253797 | Method of bonding molybdenum to steel A thin layer of silver metal is formed between a molybdenum surface and a eel surface. The silver metal layer is diffusion bonded to the molybdenum surface and diffusion bonded to the steel surface, thus bonding the molybdenum and steel surfaces together.... | 10/19/1993 |
| 5209388 | Process for bonding carbonaceous bodies A diffusion bonding process for bonding one rhenium-coated carbonaceous body to another. The rhenium-coat surfaces 18,20 of the bodies are coated with ruthenium, and the bodies are diffusion bonded at the interface formed by adjoining ruthenium coats 22,2... | 05/11/1993 |
| 5132351 | Chemical solder comprising a metal salt, polyphthalaldehyde and a solvent A chemical solder is described that includes an organometallic which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature ran... | 07/21/1992 |
| 5110035 | Method for improving the solderability of corrosion resistant heat exchange tubing Methods for fabricating and repairing heat exchange tubing are provided including depositing an integral solderable coating onto a surface oxide of a tubular member and then soldering a plurality of spaced fins onto the integral solderable coating. The me... | 05/05/1992 |
| 5058799 | Metallized ceramic substrate and method therefor A metallized ceramic substrate having an enhanced bond strength between the ceramic substrate and a conductive metal layer bonded thereto is disclosed. The metallized ceramic substrate includes a heterogeneous juncture band between a ceramic workpiece and... | 10/22/1991 |
| 5044546 | Process for bonding aluminum sheets with cadmium and product thereof First and second aluminum members are joined by the steps of (a) dissolving and removing completely the aluminum oxide layer from the surface of each of the first and second members to be joined and replacing each of the aluminum oxide layers with a layer cons... | 09/03/1991 |
