Quotables
"That the automobile has practically reached the limit of its development is suggested by the fact that during the past year no improvements of a radical nature have been introduced."
Scientific American ; Jan. 2 edition, 1909
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7735717 | Method of manufacturing semiconductor apparatus and method of forming viscous liquid layer A method of manufacturing a semiconductor apparatus including a process of applying viscous liquid. The method applies viscous liquid onto a principal surface of a substrate, coats the viscous liquid closely with flexible coating material having a higher bonding str... | 06/15/2010 |
| 7407085 | Apparatus and method for attaching a semiconductor die to a heat spreader Embodiments of an apparatus and method for attaching a semiconductor die to a heat spreader (or other thermal component) are disclosed. The apparatus includes a substantially flat surface to receive a number of die, and the die may be held in place on the surface by... | 08/05/2008 |
| 7401724 | Brazing flux for dry application A flux based on alkali fluoroaluminate is described which is highly suitable for dry application (“dry fluxing”). This is a flux which is free of fine-grained fraction, which is defined by a range of grain-size distribution. ... | 07/22/2008 |
| 7361983 | Semiconductor device and semiconductor assembly module with a gap-controlling lead structure In a semiconductor device (1), semiconductor elements (2) and (3) are mounted on a lead frame (5) having leads (4). The semiconductor elements (2) and (3) are connected with the leads (4) by metallic wires (... | 04/22/2008 |
| 7337941 | Flux coated brazing sheet A brazing flux mixture comprised of brazing flux, a polyvinyl butyral resin binder, and an organic solvent which can be applied over an entire aluminum alloy brazing sheet, or can be applied on the brazing sheet only where metallurgical bonds or joints are required,... | 03/04/2008 |
| 7293692 | Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method A structure of solder joint structure formed of zinc-based lead-free solder having excellent characteristics is disclosed. Between a first lead-free solder layer and a soldering pad, the following layers are formed: a tin-copper alloy layer formed on the pad; a firs... | 11/13/2007 |
| 7288471 | Bumping electronic components using transfer substrates A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic compo... | 10/30/2007 |
| 7168607 | Method and device for cleaning and then bonding substrates The invention relates to a method and to a device for cleaning and then bonding substrates. According to the invention, at least two opposite substrates are obliquely or vertically sprayed with a cleansing liquid by means of at least one nozzle and are preferably dr... | 01/30/2007 |
| 7143928 | Flux and method for joining dissimiliar metals Disclosed herein is a method for joining dissimilar metals without a need for a separate welding process. The method comprises applying a flux on a metal to be joined, inserting the metal into a mold, and injecting a molten metal into the mold. Thus, the base metal ... | 12/05/2006 |
| 7108755 | Simplification of ball attach method using super-saturated fine crystal flux A method for preparing a metal surface (34) for a soldering operation is provided. In accordance with the method, the metal surface is treated with a solder flux (31) comprising a supersaturated solution of a carboxylic acid. ... | 09/19/2006 |
| 7101782 | Method of making a circuitized substrate A circuitized substrate and a method of making the circuitized substrate are provided. The circuitized substrate includes a substrate having a conductive pad thereon. A first layer of solder enhancing material is positioned on the conductive pad, the first layer of ... | 09/05/2006 |
| 7091581 | Integrated circuit package and process for fabricating the same A process for fabricating an integrated circuit package includes: selectively etching a leadframe strip to define a die attach pad and at least one row of contact pads; mounting a semiconductor die to one side of the leadframe strip, on the die attach pad; wire bond... | 08/15/2006 |
| 7070085 | Water soluble protective paste for manufacturing printed circuit boards An improved water soluble protective paste and a method for protecting metal circuits and pads on the surface of an electronic board during the manufacturing steps. A densifier is added to the paste making it easier and more efficient the dispensing of the paste. Af... | 07/04/2006 |
| 7052558 | Solder paste flux composition A soldering paste flux for use in soldering copper and copper alloy piping and the like is formed of 40–70% nonylphenol ethoxylate (preferably Tergitol NO-10® made by Dow Chemical), 10–30% glyceryl monostearate, 3–10% acid activator, 3–10% water, and 4–15... | 05/30/2006 |
| 7048172 | Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on... | 05/23/2006 |
| 7041385 | Composite sheet material for brazing The invention relates to a coiled composite sheet material far brazing, the composite sheet material having a structure comprising a substrate, the substrate including an aluminium substrate and/or an aluminium alloy substrate, on at least one side coupled to a carr... | 05/09/2006 |
| 7037819 | Method of making a circuitized substrate A circuitized substrate and a method of making the circuitized substrate are provided. The circuitized substrate includes a substrate having a conductive pad thereon. A first layer of solder enhancing material is positioned on the conductive pad, the first layer of ... | 05/02/2006 |
| 7032807 | Solder contact reworking using a flux plate and squeegee Solder contacts can be formed on the conductive sites of a substrate by placing preformed solder balls on the conductive sites and then reflowing the solder balls to bond the solder balls to the conductive sites. After formation of the solder contacts, solder flux c... | 04/25/2006 |
| 7007833 | Forming solder balls on substrates A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverte... | 03/07/2006 |
| 7004374 | Process of making a shaped product A process of making a shaped product consisting of aluminium or an aluminium alloy comprising the steps of producing an intermediate object by extrusion or rolling and having at least one flat surface, coating the at least one flat surface with a brazing flux retain... | 02/28/2006 |
| 6994803 | Ball grid array module The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is acc... | 02/07/2006 |
| 6957759 | Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on... | 10/25/2005 |
| 6953146 | Low-temperature flux for soldering nickel-titanium alloys and other metals A low-temperature flux is described which dissolves the refractory oxide layer from a shape memory alloy containing both nickel and titanium, such as Nitinol, and from other metals like stainless steel. The flux is particularly useful for preparing shape memory allo... | 10/11/2005 |
| 6924440 | Printed wiring board, apparatus for electrically connecting an electronic element and a substrate, and method for manufacturing a printed wiring board An apparatus for electrically connecting an electronic element and a base includes an electrode region and a terminal region proximate the electrode region. A conductive paste is deposited on at least a portion of the terminal region. The conductive paste has an oxi... | 08/02/2005 |
| 6915942 | Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy A method of manufacturing a mount structure according to the present invention which forcedly cools down a melted solder paste on a printed circuit board at a cooling speed of 1.5° C./second or higher to solidify the solder paste when an electronic part is mounted ... | 07/12/2005 |
| 6910615 | Solder reflow type electrical apparatus packaging having integrated circuit and discrete components In a solder reflow type building of modular electrical apparatus involving integrated circuit and discrete components, fabrication operations are arranged to include the providing of a general type series of steps for each component element involving a reflow or joi... | 06/28/2005 |
| 6904673 | Control of flux by ink stop line in chip joining Ink jet printing apparatus is employed to form a non-polar ink stop line around a chip site on the polar surface of an organic laminate substrate. The non-polar ink stop line acts to confine polar liquid flux from spreading after application of the flux to the chip ... | 06/14/2005 |
| 6902097 | Electrically conductive wire A method of soldering comprises disposing first and second balls of solder adjacent one another on a wire; disposing flux on the wire between and in contact with both of the first and second balls and so as to substantially fill a space between the first and second ... | 06/07/2005 |
| 6854633 | System with polymer masking flux for fabricating external contacts on semiconductor components A polymer masking flux for fabricating external contacts on semiconductor components includes a polymer resin, a fluxing agent and a curing agent. The flux is configured to clean contact pads for the external contacts, and to hold the external contacts on the contac... | 02/15/2005 |
| 6832715 | Guidewire distal tip soldering method A guidewire manufacturing assembly and method of forming an improved distal tip on a guidewire are disclosed. A guidewire may be an elongate shaft, a coil disposed along the length of the shaft, a holding fixture coupled to the shaft, a solder ball disposed to flux,... | 12/21/2004 |
| 6808103 | Method for continuous high-speed welding of double-ply metal tubes and welding furnace for performing the same The present invention is a method and apparatus for making a double-ply metal tube such as those used for automobile brake tubes by producing the tube continuously in a single process. The present invention is characterized by using a high-temperature reducing molte... | 10/26/2004 |
| 6796482 | Phase separated system for fluxing A solder flux composition (19) is provided which comprises active ingredients and a carrier. The solder flux composition undergoes a phase separation during solder reflow to form at least a first phase (21) and a second phase (23), such that the... | 09/28/2004 |
| 6786391 | Method of controlling solder deposition utilizing two fluxes and preform Method for controlling the deposition of solder on a base metal or substrate is disclosed. The method comprises applying an attaching flux and finishing flux to a substrate, placing a preform thereon and subjecting the same to reflow conditions. The finishing flux i... | 09/07/2004 |
| 6769598 | Method of connecting circuit boards The invention provides metal connecting composition for connecting metal to metal with removing oxide film on the mother metal surface. The metal connecting composition contains metal particles and hydrocarbon compound having C—H bonding dissociation energy of a v... | 08/03/2004 |
| 6758389 | Composition for preventing creeping of a flux for soldering and use thereof A composition for preventing creeping for a flux for soldering, which is free from a problem from the viewpoint of the global environment or working environment is provided. The composition comprising a polymer (A) containing the polymer units (a1) derive... | 07/06/2004 |
| 6752309 | Water soluble fluxes and methods of using the same The present invention relates to water soluble fluxes which comprise at least one wax carrier, at least one surfactant and at least one activator. The present water soluble fluxes are easily applicable with a brush. They have excellent pull through of solder in the ... | 06/22/2004 |
| 6752310 | Electrically conductive wire The invention relates to an electrically conductive wire (1) comprising two spaced solder balls (2) thereon and flux (4) in the space (3) between the solder balls for making a circuit connection between electrically conductive members on ... | 06/22/2004 |
| 6722557 | Flux cleaning method and method of manufacturing semiconductor device An effective method for cleaning flux residues produced in process of fabricating semiconductor devices, and a method of fabricating the semiconductor devices including this cleaning method are provided. The flux cleaning method for cleaning the solder bump electrod... | 04/20/2004 |
| 6712262 | Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board The invention provides a water-soluble preflux that can solve problems with a soldering land array having a narrow spacing in that fused solder is likely to cause soldering bridges with defective soldering, a printed circuit board with its film formed thereon, and a... | 03/30/2004 |
| 6648212 | Components coated with an aluminum-silicon alloy Components composed of aluminum or an aluminum alloy with a coating comprising an aluminum-silicon alloy deposited thereon by applying an alkali metal fluorosilicate and heating the resulting treated material. The alloy layer is effectively protected agai... | 11/18/2003 |
