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| Number | Title | Issue Date |
| 8042726 | Method for bonding work pieces made of stainless steel, nickel or nickel alloys, using a bonding layer consisting of nickel-phosphorous, method for producing a micro-structured component using such method; micro-structured component obtained by such method To form high performance bonding connections suitable for producing micro-structured components made of a plurality of individual layers, bonding by the steps; providing at least two work pieces; forming a metal bonding layer on at least one side of at least one of ... | 10/25/2011 |
| 7407715 | Method of brazing and article made therefrom A method of brazing stainless steel components to form a complex shape such as an impeller. The method includes the steps of providing the stainless steel components shaped and formed from a selected stainless steel alloy; providing a brazing alloy having a selected... | 08/05/2008 |
| 7367489 | Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps A solder bump reflow process includes raising the temperature of an aligned die-substrate assembly to a temperature and for a time sufficient to cause a first reflow; allowing the temperature of the assembly to fall to a first cooling temperature and for a time suff... | 05/06/2008 |
| 7232053 | Seam-welded air hardenable steel constructions The present invention provides seam-welded, air hardenable steel tubes, methods of manufacturing seam-welded air hardenable steel tubes, tube mills for practicing such methods and applications for using seam-welded, air hardenable steel tubing of the present inventi... | 06/19/2007 |
| 7156279 | System and method for mounting electronic components onto flexible substrates A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24 | 01/02/2007 |
| 7156283 | Method for making a solder between metallic balls of an electronic component and mounting lands of a circuit and soldering furnace therefor A method for producing a soldered joint between the metal balls present in either a ball grid array or a chip-scale package, and the receiving pads for a circuit printed on a substrate or the receiving pads of an integrated circuit. Solder cream or an adhesive flux ... | 01/02/2007 |
| 7032809 | Seam-welded metal pipe and method of making the same without seam anneal An apparatus and method for making a seam-welded steel pipe free of untempered martensite without seam anneal. The method includes selecting a steel containing a carbon concentration below a predetermined level, for example, 0.14% or 0.12% by weight. The method also... | 04/25/2006 |
| 7014092 | Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate The present invention provides a bump forming apparatus which can prevent charge appearance semiconductor substrates from pyroelectric breakdown and physical failures, a method carried out by the bump forming apparatus for removing charge of charge appearance semico... | 03/21/2006 |
| 6935555 | Method of brazing and article made therefrom A method of brazing stainless steel components to form a complex shape such as an impeller. The method includes the steps of providing the stainless steel components shaped and formed from a selected stainless steel alloy; providing a brazing alloy having a selected... | 08/30/2005 |
| 6923364 | Method for manufacturing air compressor assembly A method for manufacturing an air compressor assembly including, between a tank welding step and a final assembling step, a step of submerging a welded tank into a dip tank that contains cooling liquid treated with a corrosion inhibitor. In a preferred embodiment, i... | 08/02/2005 |
| 6915942 | Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy A method of manufacturing a mount structure according to the present invention which forcedly cools down a melted solder paste on a printed circuit board at a cooling speed of 1.5° C./second or higher to solidify the solder paste when an electronic part is mounted ... | 07/12/2005 |
| 6906924 | Temperature-controlled rework system A temperature-controlled rework system comprises a manifold assembly adapted to direct a cooling gas flow toward an area of a printed circuit board adjacent a rework zone to reduce a temperature of the adjacent area to below a temperature of the rework zone. The sys... | 06/14/2005 |
| 6889890 | Brazing-filler material and method for brazing diamond When a diamond is brazed to a metal substrate, while obtaining a stable joining strength, a joined interface of the diamond is not eroded to provide a good joint with a beautiful view. A brazing-filler material containing at least one selected from a group consistin... | 05/10/2005 |
| 6857559 | System and method of soldering electronic components to a heat sensitive flexible substrate with cooling for a vector transient reflow process A method of soldering electronic components to a heat sensitive flexible substrate with cooling for a vector transient reflow process is disclosed. The method comprises applying solder paste to the substrate and placing electronic components to the substrate to form... | 02/22/2005 |
| 6802444 | Heat treatment of friction stir welded 7X50 aluminum A method for treating alloy before and after friction stir welding, the method comprising the following steps. First solution heat treating a multiplicity of aluminum-zinc alloy engineered components for a first time period at a first temperature. First air cooling ... | 10/12/2004 |
| 6796483 | Method and device for producing a soldered joint A method and device is provided for thermal treatment of workpieces or components, in particular for producing a soldered joint between a solder material and at least one component or workpiece which is used as a carrier for said solder material, by melting of the s... | 09/28/2004 |
| 6793120 | Apparatus and method for mounting an electrical connector to a glass sheet of a vehicle window An electrical connector is soldered or affixed to a conductive element of a glass sheet of a vehicular window via radiation heating of a layer of solder with an infrared radiative heating device. The heating device may include an infrared lamp and a reflector, which... | 09/21/2004 |
| 6793125 | Solder shaping process and apparatus A process and apparatus for forming fusible solder material mounted on a substrate with the use of a tool having a treatment surface with selected shape. The solder material is heated sufficiently to cause fusing after which the tool is moved such that the treatment... | 09/21/2004 |
| 6772935 | Method and device for friction stir welding with simultaneous cooling A method for friction stir welding using liquid cooling. The method includes the steps of moving a pin tool across a welding location, spraying a cooling liquid in a localized manner from a cooling ring moving with the pin tool onto a trailing region and onto latera... | 08/10/2004 |
| 6732910 | Device and process for producing a soldered joint between two joining partners which can be by means of a common contact surface A device for producing a soldered joint between two joining partners which can be joined via a common contact surface (7), using a solder material which can be introduced between the two joining partners. At least one joining partner (1), in the region... | 05/11/2004 |
| 6702175 | Method of soldering using lead-free solder and bonded article prepared through soldering by the method There are provided a method of soldering a lead-free solder which lowers a melting point of the lead-free solder and prevents deterioration of a joining strength at a portion joined by the lead-free solder, and a joined object soldered with the use of the... | 03/09/2004 |
| 6691910 | Method of joining different metal materials by friction welding A rod material made of Ti alloy has a larger diameter portion at the end, which is joined with the end of material made of Ti--Al intermetallic compound, by friction welding, to form a poppet valve for an internal combustion engine. Instead of providing s... | 02/17/2004 |
| 6648216 | Process and apparatus for flow soldering A flow soldering process for mounting an electronic component onto a board by means of a lead-free solder material. Molten solder material is supplied and attached to a predetermined portion of the board in a solder material supplying zone, and the board ... | 11/18/2003 |
| 6533577 | Compartmentalized oven An oven compartment in an oven for subjecting items to a selected heating sequence having a compartment container with a transport opening therein to permit selectively entering such items adjacent to first plenum structure at a perforated surface to allo... | 03/18/2003 |
| 6534195 | Connection structure for metallic members and connecting method therefor Sn--Zn alloy is plated on at least one of a first metallic member and a second metallic member, Sn--Ag alloy is used as a solder, the first metallic member and the second metallic member are connected by the solder, and a connection structure of metallic ... | 03/18/2003 |
| 6510603 | Rotor production method including assembling a slot insulator and coil trunk into a set prior to insertion into an armature core A production method of a rotor in which a lower layer slot insulator is held at a slot insulator holding portion of a combining jig, a lower layer coil bar is inserted into a coil inserting path of the combining jig and is combined integrally with the low... | 01/28/2003 |
| 6402011 | Reflow method and reflow device For reflow soldering, radiant heating is applied to one surface of a printed circuit board on which electronic components are placed and onto which cream solder is supplied and at the same time hot air is blown locally and roughly perpendicular to to-be-c... | 06/11/2002 |
| 6371361 | Soldering alloy, cream solder and soldering method The present invention relates to a soldering alloy composed mainly of Sn and free from lead, a toxic substance. Adding a small quantity of Ag to the soldering alloy can make the alloy structure fine, minimize structural changes of the alloy and increase i... | 04/16/2002 |
| 6347734 | Methods and apparatus for installing a module on a circuit board using heating and cooling techniques The invention is directed to techniques for installing a module on a circuit board by simultaneously heating a perimeter portion of the module, and bringing an inner portion of the module to temperature that is lower than that of the perimeter portion. He... | 02/19/2002 |
| 6230962 | Process for cooling soldered objects A process for cooling soldered objects, according to which a liquid is applied onto the soldered object and is evaporated in an accelerated manner. According to a preferred embodiment the soldered object is cooled in a vapor phase soldering apparatus dire... | 05/15/2001 |
| 6059177 | Welding method and welding material A welding method for two members adapted to be welded and formed of a low-alloy steel for structural purposes causing the weld metal to develop martensite transformation during cooling after welding, so that the weld metal becomes expanded to a greater de... | 05/09/2000 |
| 5918795 | Soldering alloy, cream solder and soldering method The present invention relates to a soldering alloy composed mainly of Sn and free from lead which is a toxic substance. An addition of a small quantity of Ag to the soldering alloy can fine the alloy structure, minimize structural changes of the alloy and... | 07/06/1999 |
| 5911355 | Method and device for mechanically removing solder beads on the surface of the printed circuit boards The invention relates to a method for mechanically removing solder beads (14) from the surface of printed circuit boards (10) directly after they pass through the solder flow during flow soldering of printed circuit boards in a soldering plant. In order t... | 06/15/1999 |
| 5842627 | Soldering apparatus and a method thereof A printed board, to which cream solders are applied on lands at the position where leads of electronic parts are to be soldered and the leads of the electronic parts are provided to the lands, is fed to a soldering position and, the cream solders of the f... | 12/01/1998 |
| 5813595 | Method for wave-soldering printed circuit boards A method is provided for wave-soldering printed circuit boards. In order to obtain wave-soldered printed circuit boards with smallest possible number of solder globules, after the passage on the wave of solder, the printed circuit boards are further artif... | 09/29/1998 |
| 5769308 | Welding material for use in hard-facing and method of determining components thereof The composition of a hard-facing welding material to be overlaid onto a cast iron base metal followed by a supercooling treatment for hardening must lie above a line LA in a Schaeffler's structure diagram which is represented by a Cr equivalent and a Ni e... | 06/23/1998 |
| 5745977 | Method of manufacturing rotary electric machine An armature core composed of a plurality of thin plates having a plurality of slots and a center hole is provided. Then, lower coil bars and subsequently upper coil bars are placed in the respective slots with insulators so that a coil end portion of one ... | 05/05/1998 |
| 5641341 | Method for minimizing the clogging of a cooling zone heat exchanger in a reflow solder apparatus A method for minimizing the clogging of a cooling zone heat exchanger of a reflow solder apparatus that includes the steps of: removing a gas/flux mixture from an exhaust zone (20) that is located adjacent a heated zone and/or a cooling zone; conducting t... | 06/24/1997 |
| 5639012 | Process and device for the posttreatment of welded compound panels In a compound panel welding line, the compound panels discharged from a welding machine are cooled by means of a cooling unit. In the cooling unit, the welded seam is treated with a cooling fluid, in particular a rust-preventative oil. This allows the pan... | 06/17/1997 |
| 5462626 | Method of bonding an external lead and a tool therefor A bonding method of for external leads which includes the steps of registering the external leads of an IC component with electrodes of a circuit substrate, setting an external lead retaining surface of a bonding tool on a flat outer tab obtained by coati... | 10/31/1995 |
