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| Number | Title | Issue Date |
| 7364622 | Method and apparatus for fabricating a device, and the device and an electronic equipment The invention provides an apparatus for fabricating a device, in which a high operation efficiency is maintained in a drying treatment for a multilayer-interconnection device. The device can also be fabricated inexpensively. An apparatus for fabricating a device has... | 04/29/2008 |
| 7356942 | Gas hot air gun A gas hot air gun includes a main body, an ignition device, a switch set and a safety switch. The main body includes a blower, a nozzle, a barrel and a handle. A heating chamber and a mixing chamber are on the inner front of the barrel. A gas can is inside the handl... | 04/15/2008 |
| 7350686 | Method for supplying solder Obtained are fine-pitched pad electrodes and also solder bumps with a large amount of solder and a less difference in the amount. First, in an inert liquid in a liquid tank, a substrate is positioned with a surface facing up. Subsequently, the inert liquid containin... | 04/01/2008 |
| 7325714 | Solder heating system This invention provides a system capable of melting solder and removing the melted solder from a substrate. The heating system includes a desoldering tool having at least two handles, a first handle and a second handle. This way, an operator may grip the first handl... | 02/05/2008 |
| 7121107 | Continuous transfer type freezer A continuous transfer type freezer for cooling or freezing articles such as foodstuffs transferred on a conveyor belt by spraying chilled air from slit nozzles on the articles is provided in which chilled air jets rectified to have long spray travel is produced, thi... | 10/17/2006 |
| 7100813 | System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication A system (10) and method (30) for precisely depositing a solder compound onto a substrate (18). The system (10) generally includes a receiving member (20) having a rotatable portion (21) adapted to receive a planar substrate... | 09/05/2006 |
| 7037104 | Device and method for exposing a candle wick embedded in candle wax A device and method for exposing the ignitable end of a candle wick embedded in wax leaving an area around the wick to facilitate future lighting. The device includes an elongate hollow heated tube, heated by a heating source which heats the elongate hollow tube to ... | 05/02/2006 |
| 6913183 | Selective gas knife for wave soldering Selective gas knives for wave soldering provide for targeted gas flow at a particular location on a substrate, such as a printed circuit board. Both the temperature and flow rate of gas through a segment of a gas knife can be independently controlled. ... | 07/05/2005 |
| 6906924 | Temperature-controlled rework system A temperature-controlled rework system comprises a manifold assembly adapted to direct a cooling gas flow toward an area of a printed circuit board adjacent a rework zone to reduce a temperature of the adjacent area to below a temperature of the rework zone. The sys... | 06/14/2005 |
| 6761304 | Heating head for soldering and de-soldering of SMD components A heating head for soldering and de-soldering surface mount devices (SMD's) using hot inert gas or air is comprised of a handle in which there is placed a heater sub-assembly on which there is secured a quick connect mechanism for mounting a heating nozzle. The heat... | 07/13/2004 |
| 6755339 | Fluxing apparatus for applying powdered flux A fluxer applies powdered flux to an object. The fluxer includes an enclosure that defines a chamber where the object is fluxed. The enclosure includes an inlet for receiving the object into the chamber prior to application of the flux and an outlet for discharging ... | 06/29/2004 |
| 6705509 | Method of recovering lead-free solder from printed circuit boards Discarded printed circuit boards are sorted according to the alloying elements in solder used on the printed circuit boards. After sorting, the printed circuit boards are heated to melt the solder, and the molten solder is collected. ... | 03/16/2004 |
| 6622902 | Nozzle apparatus for surface mount device A nozzle device of a surface mounting device including a holder mounted and adhered closely to socket shafts by an elastic force of elastic members connected to both ends of the socket shafts, and a holder shaft formed on the bottom surface of the holder ... | 09/23/2003 |
| 6585145 | Die bonder and/or wire bonder with a device for holding down a substrate A Die Bonder or a Wire Bonder contains a device for holding down a substrate. The device comprises a table with drill holes. The drill holes are mechanically programmable with regard to whether vacuum can be applied to them or not. The mechanical programm... | 07/01/2003 |
| 6550669 | Integral heating nozzle and pickup tube An integral heating nozzle and a syringe needle pickup vacuum tube where the nozzle moves relative to the pickup tube, FIG. 4, and where the nozzle does not move relative to the pickup tip, FIG. 1. The relative movement allows the heating gas to be direct... | 04/22/2003 |
| 6533159 | Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. A ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solde... | 03/18/2003 |
| 6499644 | Rework and underfill nozzle for electronic components A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor ... | 12/31/2002 |
| 6467671 | Solder recovering method and solder recovering apparatus A solder receiving method for a printed circuit board having electronic components soldered thereon includes the steps of forming, in a recovering apparatus body, a solder alloy layer, a metal particle layer and a liquid heat medium layer according to dif... | 10/22/2002 |
| 6464124 | Electrically conductive elevation shaping tool The present invention relates to a solder ball shaping tool and a method for using the tool. In a substrate there is formed a series of depressions. The tool is pressed onto a ball grid array and the ball grid array is realigned either with simple pressur... | 10/15/2002 |
| 6457628 | Safety switch device for gas jet soldering gun A safety switch device for a gas jet soldering gun includes a ignition push button having an outer periphery provided with a locking drive block, a housing having an inner wall defining an L-shaped drive slot mating with the locking drive block, and a spr... | 10/01/2002 |
| 6440215 | Fluid knife Air knives 109,110 for a solder leveller each comprises an air knife tip 111. The tip has a nozzle slot 114, up-and down-stream lands 119, 115, which are parallel to a back surface 130. Beyond the lands, the tip has a wing 120 and a lip 117, with a wing f... | 08/27/2002 |
| 6435401 | Apparatus and a method for removing solder from an object A solder-removing apparatus includes a heating portion for heating the object having the solder adhered thereto, a measuring portion for measuring the distance from the measuring portion to the object, a solder-drawing portion for drawing the molten solde... | 08/20/2002 |
| 6360940 | Method and apparatus for removing known good die Preferred embodiments for methods of removing an integrated circuit ("IC") from a substrate, where the IC is attached to the substrate by multiple solder connections are disclosed. One preferred embodiment of the inventive methods provides the steps of he... | 03/26/2002 |
| 6357648 | Method and apparatus for removal of solder The invention relates to a method and an apparatus (22) for removing solder from a circuit board (5) from which electrical or electronic components have been removed at soldering points. The invention is addressed to the problem of offering a method and a... | 03/19/2002 |
| 6349871 | Process for reworking circuit boards A method and apparatus is described for reworking a printed circuit board having plugged vias and plated through holes. The printed circuit board, supported by a movable local support, is heated from only the bottom side by a heating device near the area ... | 02/26/2002 |
| 6347734 | Methods and apparatus for installing a module on a circuit board using heating and cooling techniques The invention is directed to techniques for installing a module on a circuit board by simultaneously heating a perimeter portion of the module, and bringing an inner portion of the module to temperature that is lower than that of the perimeter portion. He... | 02/19/2002 |
| 6305596 | Apparatus and method for soldering through-hole components on circuit board A method for breaking off solder bridges between pins of a through-hole component on a printed circuit board, comprises the following steps: (1) providing a soldering apparatus, the apparatus having an opening corresponding to the through-hole component, ... | 10/23/2001 |
| 6282812 | Multi air-knife box and method of use An apparatus is provided for the drying of electronic components. The invention provides multiple holes through which air is passed before striking the components. This provides the apparatus of the invention with multiple air knives, thereby breaking maj... | 09/04/2001 |
| 6258165 | Heater in a conveyor system In a conveyor system with a radiant heating system, convection is provided with hollow elongated tubes having small holes for providing a gentle air flow toward a workpiece to heat the workpiece with convection and radiation.... | 07/10/2001 |
| 6257478 | Soldering/unsoldering arrangement A soldering/desoldering device, in particular for integrated circuits with electric/electronic components, comprises a heater nozzle having a substantially bell-shaped housing formed with a lower nozzle opening. A heat distribution plate which can be acte... | 07/10/2001 |
| 6247630 | Apparatus and method for uniformly melting the solder attaching a surface mount device to a printed circuit board A flow control nozzle for hot gases includes an input end to receive a hot gas. An output end of the flow control nozzle delivers the hot gas to a surface mount device attached with solder to a printed circuit board. A gas distribution mechanism is positi... | 06/19/2001 |
| 6216938 | Machine and process for reworking circuit boards A method and apparatus is described for reworking a printed circuit board having plugged vias and plated through holes. The printed circuit board, supported by a movable local support, is heated from only the bottom side by a heating device near the area ... | 04/17/2001 |
| 6186387 | Solder collecting capsule and solder extracting desoldering tool using same A disposable solder receiving capsule for a hand held vacuum solder extracting desoldering tool is formed of an outer tube which is closed at one end by a porous filter and is open at its opposite end, and a hollow solder collection chamber part having a ... | 02/13/2001 |
| 6182884 | Method and apparatus for reworking ceramic ball grid array or ceramic column grid array on circuit cards A nozzle is provided for the reworking of printed circuit boards with CBGA and CCGA solder containing chips comprising a housing having an internal hot gas chamber and configured to hold at the lower end of the nozzle a chip to be attached to the printed ... | 02/06/2001 |
| 6168065 | Movable selective debridging apparatus for debridging soldered joints on printed circuit boards A debridging tool incorporated into an automated wave soldering system adjacent to and after a wave soldering station removes bridges and/or excess solder formed during the wave soldering process by emitting, at a desired temperature which can be set usin... | 01/02/2001 |
| 6164515 | Movable selective debridging apparatus and method of debridging soldered joints on printed circuit boards using same A debridging tool incorporated into an automated wave soldering system adjacent to and after a wave soldering station removes bridges and/or excess solder formed during the wave soldering process by emitting a pressurized stream of air, inert gas or other... | 12/26/2000 |
| 6131794 | Shaving blade for chip site dressing A shaving or shearing blade utilized in dressing solder joint chip technologies without the use of heat or a copper block wicking process. In essence, any solder debris resulting from the solder shaving process as implemented by the shaving blade is remov... | 10/17/2000 |
| 5934540 | Horizontal soldering system with oil blanket A solder immersion chamber in a solder crater/leveler includes a solder manifold having upper and lower solder chambers, from which solder is directed onto the top and bottom surfaces of printed circuit boards conveyed therebetween. The solder immersion c... | 08/10/1999 |
| 5911355 | Method and device for mechanically removing solder beads on the surface of the printed circuit boards The invention relates to a method for mechanically removing solder beads (14) from the surface of printed circuit boards (10) directly after they pass through the solder flow during flow soldering of printed circuit boards in a soldering plant. In order t... | 06/15/1999 |
| 5826779 | Warm air bath for reworking circuit boards In one aspect, a device for attaching a component to a circuit board is provided, comprising a circuit board held in a holder and a contact heater that heats the component on the circuit board by contact and by conducting heat through the component. In a ... | 10/27/1998 |
