Did You Know...
...In 1790, the cost to obtain a patent was between $4 and $5.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7288471 | Bumping electronic components using transfer substrates A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic compo... | 10/30/2007 |
| 7240717 | Multiple ignition source exothermic reaction mold device A multiple ignition source exothermic reaction mold device. The mold device includes a crucible in a block with an open top for receiving exothermic reaction powder. A lid covering the open top has an opening therethrough. A receptacle in the lid is in communication... | 07/10/2007 |
| 7205032 | Controlled thermal expansion of welds to enhance toughness A method is provided for forming a metallic overlay having enhanced toughness. The metallic overlay may be a weld, a metallic coating, or similar application. The method includes applying a glass forming metallic alloy to a substrate while the alloy is in a molten o... | 04/17/2007 |
| 7201304 | Multi-functional solder and articles made therewith, such as microelectronic components Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a seco... | 04/10/2007 |
| 7124507 | Method of manufacturing a heat pipe wick with structural enhancement Heat pipe wick structure wherein a stout sheet of perforated material overlays a high performance wick material such as stainless steel felt affixed to a substrate. The inventive structure provides a good flow path for working fluid while maintaining durability and ... | 10/24/2006 |
| 7066375 | Aluminum coating for the corrosion protection of welds A method for coating and an associated assembly including such a coating are provided. The assembly includes a workpiece defining a weld portion, such as a friction weld joint and a heat affected zone. A coating is disposed on the weld portion to at least partially ... | 06/27/2006 |
| 7040804 | Method for measuring diffusion coefficient in conductive melts, and apparatus for measuring the same Two conductive solid materials with their respective different compositions are joined in parallel with a gravity direction thereof, and then, heated and melted under static magnetic field orthogonal to the gravity direction to form two conductive melts with their r... | 05/09/2006 |
| 7007833 | Forming solder balls on substrates A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverte... | 03/07/2006 |
| 6946364 | Integrated circuit having a device wafer with a diffused doped backside layer Integrated circuits, semiconductor devices and methods for making the same are described. Each embodiment shows a diffused, doped backside layer in a device wafer that is oxide bonded to a handle wafer. The diffused layer may originate in the device handle, in the h... | 09/20/2005 |
| 6921583 | Al-Cu bonded structure and method for making the same With an Al—Cu bonded structure, an Ag layer can be remained at the Al—Cu bonding interlayer providing ductile deformation behavior and a tensile strength at the bonded interlayer similar to that of the Al base material. This results in superior bonding character... | 07/26/2005 |
| 6820795 | Joined article of a supporting member for a semiconductor wafer and a method of producing the same A method for producing a joined body comprising a supporting member made of a ceramic material for supporting a semiconductor wafer, a metal member and a joining layer for joining the supporting and metal members is provided. A first metal film is formed on a joinin... | 11/23/2004 |
| 6534194 | Method of making reactive multilayer foil and resulting product In accordance with the invention a reactive multilayer foil is fabricated by providing an assembly (stack or multilayer) of reactive layers, inserting the assembly into a jacket, deforming the jacketed assembly to reduce its cross sectional area, flatteni... | 03/18/2003 |
| 6316125 | Aluminum welding process and composition for use in same The invention provides a new and improved process and exothermic reaction mixture for producing molten weld metal. The molten weld metal is used in joining one metallic piece with at least one other metallic piece. The process and exothermic reaction mixt... | 11/13/2001 |
| 6199751 | Polymer with transient liquid phase bondable particles A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point consti... | 03/13/2001 |
| 6089444 | Process of bonding copper and tungsten Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the... | 07/18/2000 |
| 6066219 | Process for producing a ceramic substrate and a ceramic substrate The invention relates to a novel ceramic substrate with at least one layer essentially of aluminum nitride which is provided on at least one surface side with an intermediate or auxiliary layer which contains aluminum oxide and which has a thickness in th... | 05/23/2000 |
| 5988488 | Process of bonding copper and tungsten Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the... | 11/23/1999 |
| 5985464 | Composite structure, and method of making same A composite structure includes a first nonmetallic component and a second mponent of metal or nonmetal, with the first and second components being joined together by a bonding material which is so introduced by way of a casting process as to permeate to a... | 11/16/1999 |
| 5788142 | Process for joining, coating or repairing parts made of intermetallic material A process for joining two parts of which at least one is made of an intermetallic material comprises: mixing elemental powders to form an intermetallic compound of the same type as that of the intermetallic part or parts; compacting and forming an intermediate... | 08/04/1998 |
| 5679464 | Joined product of heat-resisting alloys and method for joining heat-resisting alloys The present invention provides a joined product of heat-resisting alloys, comprising heat-resisting alloy sheets or foils optionally having an oxide film on their surfaces, said heat-resisting alloy sheets or foils being joined to each other at their surf... | 10/21/1997 |
| 5628448 | Process for bonding a contact layer of silver-metal oxide material and metal contact base, and suitable contact layer A contact facing is normally bonded to the carrier by brazing or welding, for which purpose, the bonding side has to have a suitable layer. According to the invention, prior to the bonding operation, the contact facings are treated without fusion in such ... | 05/13/1997 |
| 5574629 | Solderless printed wiring devices In a printed wiring device, the combination of a substrate having a metal-plateable member and an electrical component having a metal plateable lead connected with the metal-plateable member, the lead and the member being electrically interconnected by a ... | 11/12/1996 |
| 5564620 | Forming metal-intermetallic or metal-ceramic composites by self-propagating high-temperature reactions Industrial applications of composites often require that the final product have a complex shape. In this invention intermetallic or ceramic phases are formed from sheets of unreacted elemental metals. The process described in this invention allows the fin... | 10/15/1996 |
| 5549335 | Solderless metallurgical joint A metallurgical joint between a copper tube and an aluminum tube is disclosed. The metallurgical joint between the tubes is elongated and extends along the length of the telescoping tubes and is substantially free of materials other than copper and alumin... | 08/27/1996 |
| 5521150 | Method of joining Y-based oxide superconductors Disclosed is a method of joining Y-based oxide superconductors on joining two or more Y-based oxide superconductors made by melting process under pressure, characterized by incorporating REBa2 Cu3 O7-δ (RE=Y, Ho, Er, Tm ... | 05/28/1996 |
| 5503698 | Bonding method employing organometallic interconnectors A chemical solder is described that includes an organometallic complex or compound which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the ... | 04/02/1996 |
| 5490627 | Direct bonding of copper composites to ceramics A ceramic member (52) is direct-bonded to a copper composite substrate (58) by heating to diffuse copper to the surface (56) of the copper composite substrate, oxidizing the surface of the copper composite substrate following heating, placing a ceramic me... | 02/13/1996 |
| 5425496 | Method for joining ceramic and metal-ceramic heating elements to electrical terminals by micropyretic synthesis, compositions for electrical terminals and heaters comprising the same A method for joining a ceramic or metal ceramic electrical heating element to a electrical terminal is disclosed, the heating element having been manufactured using micropyretic synthesis, the method for joining comprising the steps of preparing the elect... | 06/20/1995 |
| 5425494 | Method for forming infiltrated fiber-reinforced metallic and intermetallic alloy matrix composites Reinforced metallic or intermetallic alloy matrix composite materials which are reinforced by the incorporation of preferably small-diameter ceramic fibers infiltrated within a metal bonding layer. The bonding layer comprises a foil, such as copper, which... | 06/20/1995 |
| 5421507 | Au-Sn transient liquid bonding in high performance laminates A method is disclosed of simultaneously laminating circuitized dielectric layers to form a multilayer high performance circuit board and making interlevel electrical connections. The method selects two elements which will form a eutectic at one low temper... | 06/06/1995 |
| 5419484 | Apparatus and process for aluminothermic welding The disclosure relates to a multi-part mold for aluminothermic welding without preheating of metal parts, said mold having internally employed a welding cavity and two rising channels with variable cross-sections along their height, the central part of we... | 05/30/1995 |
| 5383594 | Radiation-shielding transport and storage container A radiation-shielding storage/transport container has a cast-iron vessel having an open end defining an end face, a steel ring engaging the end face and forming at least one annular seat, a weld unitarily bonding the ring to the end face, and a cover secu... | 01/24/1995 |
| 5372295 | Solder material, junctioning method, junction material, and semiconductor device A solder material comprises a first solder plate and a second solder plate having a thickness equal to or larger than 1 micron provided at the both surfaces of the first solder plate comprising material having a lower melting point than the first solder o... | 12/13/1994 |
| 5350107 | Iron aluminide alloy coatings and joints, and methods of forming A method of joining two bodies together, at least one of the bodies being predominantly composed of metal, the two bodies each having a respective joint surface for joining with the joint surface of the other body, the two bodies having a respective melti... | 09/27/1994 |
| 5340014 | Combustible slurry for joining metallic or ceramic surfaces or for coating metallic, ceramic and refractory surfaces A slurry for joining metallic or ceramic surfaces or for coating metallic or ceramic and refractory surfaces, comprising a liquid suspending medium and at least two constituents in particulate form suspended in the medium, the constituents being so select... | 08/23/1994 |
| 5338072 | Gastight connection between tubes of small diameter The invention relates to a gastight connection between tubes of small diameter of metals or metal alloys having different melting points, more particularly copper and aluminium, wherein the end zone of the first tube (1) is opened out and the second tube ... | 08/16/1994 |
| 5316863 | Self-brazing aluminum laminated structure A novel self-brazing aluminum laminated structure is described, as well as a method of making the laminated structure and a brazed product produced therefrom. The laminated structure consists of a thin layer of a powder mixture consisting of eutectic-form... | 05/31/1994 |
| 5292057 | Fixture for, and method of, welding grounding connector to structural steel member A fixture for welding a grounding connector to a structural steel member is disclosed. Such fixture is formed of a magnetic material so that the fixture is attracted to, and retained upon, the steel member. A chamber is defined within the rectangular body... | 03/08/1994 |
| 5273203 | Ceramic-to-conducting-lead hermetic seal A hermetic seal is provided for a conductive feedthrough through a thin ceramic component by a platinum or palladium lead by sealing the gap between the lead and the ceramic with a copper-copper oxide eutectic. The lead may have a copper coating on it pri... | 12/28/1993 |
| 5259549 | Method to attach a plate to a steel substrate Shown is a method to attach a plate to a steel substrate. An iron or ferr alloy disk is fixed at one end of a pipe and wafers of aluminum or other iron reducing agent are stacked in the pipe on the disk. An oxygen lance in the pipe starts a reaction in w... | 11/09/1993 |
