Did You Know...
...that it was melting ice cream that inspired the invention of the outboard motor? It was a lovely August day and Ole Evinrude was rowing his boat to his favorite island picnic spot. As he rowed, he watched his ice cream melt and wished he had a faster way to get to the island. At that moment the idea for the outboard motor was born!
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| Number | Title | Issue Date |
| 7208834 | Bonding structure with pillar and cap A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylind... | 04/24/2007 |
| 7135766 | Integrated power devices and signal isolation structure A flip chip power device having an integrated low inductance ground and heat sink path and an isolation structure is provided. A substrate is formed having transistors and an ohmic contact region circumscribing the transistors. Dielectric layers are formed on the su... | 11/14/2006 |
| 7067916 | Extension of fatigue life for C4 solder ball to chip connection A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a con... | 06/27/2006 |
| 6994920 | Fusion welding method and welded article A fusion welding method is provided for fusion welding at juxtaposed interface surfaces a first member, for example made of a first metal based on at least one of Ru, Rh, Pd, and Pt, with a second member made of a second metal, for example a high temperature alloy b... | 02/07/2006 |
| 6681982 | Pillar connections for semiconductor chips and method of manufacture A flip chip interconnect system comprises and elongated pillar comprising two elongated portions, one portion including copper and another portion including solder. The portion including copper is in contact with the semiconductor chip and has a length pr... | 01/27/2004 |
| 6592019 | Pillar connections for semiconductor chips and method of manufacture A flip chip interconnect system comprises an elongated pillar comprising two elongated portions, a first portion including solder with or without lead and a second portion including copper or gold or other material having a higher reflow temperature than ... | 07/15/2003 |
| 6241145 | Lead-free solder joining method and electronic module manufactured by using the method A joining method using lead-free solder which can produce a good joint through a heating process. A first lead-free alloy layer is formed on surfaces of all parts to be mounted on a board at a temperature equal to or lower than the melting point of the fi... | 06/05/2001 |
| 6221506 | Bushing base with mounted nozzles The invention relates to a method of manufacturing a bushing baseplate, and to a bushing baseplate. The bushing baseplate is characterized in that it comprises tips (18) constituted by hollow tubular elements of outside diameter slightly smaller than the ... | 04/24/2001 |
| 5482580 | Joining of metals using a bulk amorphous intermediate layer Two pieces of metal are joined together using an amorphous metallic joining element. In the joining operation, the joining element is placed between the two pieces to be joined. The joining element and adjacent regions of the pieces being joined are given... | 01/09/1996 |
| 5464146 | Thin film brazing of aluminum shapes An improved method of brazing of two unclad aluminum shapes, particularly for automotive heat exchangers, which brazing joint does not leave a physically apparent layer of brazing material and which effects a stronger, sounder autogenous joint. A thin fil... | 11/07/1995 |
| 5221038 | Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature A solder connection (30) is formed based upon a tinindium or tin-bismuth alloy, but having a melting temperature greater than the melting temperature of the initial solder alloy. A deposit (26) of solder alloy is placed against a tin plate (24) applied, p... | 06/22/1993 |
| 4988036 | Vacuum braze cycle for clad aluminum sheet An improved heating cycle for brazing an assembly of clad aluminum sheet components having a hypoeutectic aluminum-silicon braze alloy cladding comprises a dwell at a temperature slightly above the eutectic melting point and effective to partially melt th... | 01/29/1991 |
| 4798932 | Solid phase edge bonding of metal strips A continuous process for solid-phase edge bonding a plurality of dissimilar metal strips to form a composite edge-bonded strip. A plurality of elongated metal strips of equal thickness are heated and aligned in a substantially planar, edge-to-edge relatio... | 01/17/1989 |
| 4625400 | Method of making a strip for an electrical contact terminal A method of producing a strip adapted for use as an electrical contact terminal comprising the following steps. First, a strip of relatively flexible substrate material is provided. Then, a substantially continuous strip of powdered metal or metal alloy i... | 12/02/1986 |
| 4386959 | Method for compound sintering Joined connections between a metallic compact body made by melting metallurgy and a body made by powder metallurgy are prepared by providing a pre-formed, unsintered pressed body having at least one component which forms a liquid phase at the sintering te... | 06/07/1983 |
