Bizarre Patents
Wearable Device For Feeding and Observing Birds and Other Flying Animals
A device for feeding and observing flying animals comprising a hat, a support mounted on the hat and extending outward from the hat, and a feeder mounted on the support.
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| Number | Title | Issue Date |
| 7896222 | Manufacture of shape memory alloy cellular materials and structures by transient-liquid reactive joining This invention discloses a method, using pure niobium as a transient liquid reactive braze material, for fabrication of cellular or honeycomb structures, wire space-frames or other sparse builtup structures or discrete articles using Nitinol (near equiatomic titaniu... | 03/01/2011 |
| 7331499 | Manufacturing method for a ceramic to metal seal A method of bonding a ceramic part to a metal part by heating a component assembly including the metal part, the ceramic part, and a thin essentially pure interlayer material placed between the two parts heated at a temperature that is greater than the temperature o... | 02/19/2008 |
| 7165712 | Transient liquid phase bonding to cold-worked surfaces A joint having bond line grains that nucleate in the joint region and grow into the adjoined solid substrates. The resulting bond line grains have a size that is greater than a thickness of a molten region. The surfaces of the substrates are cold worked to a desired... | 01/23/2007 |
| 7143512 | Method of making a brazed metal heat exchanger core with self-shearing reinforcement A radiator core reinforcement self shears in the braze oven as strategically placed voids in the reinforcement erode away under the flowing action of the melted surface braze layer. ... | 12/05/2006 |
| 7132721 | Bonding for a micro-electro-mechanical system (MEMS) and MEMS based devices A method of bonding and packaging components of Micro-Electro-Mechanical Systems (MEMS) and MEMS based devices using a Solid-Liquid InterDiffusion (SLID) process is provided. A micro-machine is bonded to a micro-machine chip using bonding materials. A layer of chrom... | 11/07/2006 |
| 6820795 | Joined article of a supporting member for a semiconductor wafer and a method of producing the same A method for producing a joined body comprising a supporting member made of a ceramic material for supporting a semiconductor wafer, a metal member and a joining layer for joining the supporting and metal members is provided. A first metal film is formed on a joinin... | 11/23/2004 |
| 6800169 | Method for joining conductive structures and an electrical conductive article Embodiments of the invention include a method comprising disposing a thin metallic layer having a low melting temperature between one end of a conductive post on a substrate and a conducting structure on an opposing substrate. Heated platens in contact with the subs... | 10/05/2004 |
| 6760396 | Coated metal articles and method of making The method of protectively coating metallic uranium which comprises dipping the metallic uranium in a molten alloy comprising about 20-75% of copper and about 80-25% of tin, dipping the coated uranium promptly into molten tin, withdrawing it from the molten tin and ... | 07/06/2004 |
| 6726086 | Liquid phase diffusion bonding to a superalloy component A method for the manufacturing or repair of a superalloy gas turbine component including a liquid phase diffusion bonding process wherein the brazing heat treatment used for the diffusion bonding of a powder material to the component is accomplished by a heat cycle ... | 04/27/2004 |
| 6723213 | Titanium target assembly for sputtering and method for preparing the same A titanium target assembly includes a titanium sputtering target, a copper or copper alloy backing plate and serving as a support member for the target and a silver or silver alloy coating film and formed between the target and backing plate. The coating film is for... | 04/20/2004 |
| 6720086 | Liquid interface diffusion bonding of nickel-based superalloys A liquid interface diffusion bonded composition comprises a metal honeycomb core such as a nickel-alloy honeycomb core and a nickel-alloy facing sheet bonded thereto. The composition and method of this invention are useful in applications where high strength, heat r... | 04/13/2004 |
| 6697448 | Neutronic fuel element fabrication This disclosure describes a method for metallurgically bonding a complete leak-tight enclosure to a matrix-type fuel element penetrated longitudinally by a multiplicity of coolant channels. Coolant tubes containing solid filler pins are disposed in the co... | 02/24/2004 |
| 6599405 | Recessed sputter target The method manufactures sputter target assemblies. It first includes the step of manufacturing a target insert. The target insert has a yield strength, a diameter, a height, a planar top surface and a conical-shaped rear surface. Then a backing plate is m... | 07/29/2003 |
| 6565990 | Bonded niobium silicide and molybdenum silicide composite articles and method of manufacture An airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined at a bonded region to the first piece by a diffusion bond. The first piece comprises one of a first niobium-based refractory metal i... | 05/20/2003 |
| 6478214 | Method for assembling by diffusion welding a martensite stainless steel and a copper alloy and resulting bimetal element The present invention relates to a diffusion welding assembly process between a martensitic stainless steel and a copper alloy, and in particular, to an assembly process of a martensitic stainless steel component with a component comprising copper. Said p... | 11/12/2002 |
| 6475637 | Liquid interface diffusion bonded composition and method A liquid interface diffusion bonded composition comprises a metal honeycomb core such as a titanium honeycomb core and a metal facing sheet such as a titanium facing sheet bonded thereto. The composition is prepared by a method comprising: (a) providing a... | 11/05/2002 |
| 6419806 | Insert target assembly and method of making same Method of forming a two-piece hollow cathode sputter target assembly and the assembly formed thereby. The sputter target assembly includes an outer shell having a substantially cylindrical side wall and is composed of a relatively low purity metallic mate... | 07/16/2002 |
| 6286750 | Method of manufacturing beryllium-copper alloy hot isostatic press (HIP) bonded body and hip-bonded body A HIP-bonded body of a beryllium member and copper alloy member. Before subjecting the members to HIP processing, a diffusion inhibiting layer is deposited on the outer surface of the copper alloy member. A bond promoting layer of aluminum or aluminum all... | 09/11/2001 |
| 6257481 | Metal bonding A method of bonding two pieces of metal having a foil or layer of another metal, either of lower melting point or such that it forms a liquid layer at or near to the bonding temperature, disposed therebetween. The method comprises the steps of: bringing t... | 07/10/2001 |
| 6241145 | Lead-free solder joining method and electronic module manufactured by using the method A joining method using lead-free solder which can produce a good joint through a heating process. A first lead-free alloy layer is formed on surfaces of all parts to be mounted on a board at a temperature equal to or lower than the melting point of the fi... | 06/05/2001 |
| 6199751 | Polymer with transient liquid phase bondable particles A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point consti... | 03/13/2001 |
| 6176418 | Composite bonding material of beryllium, copper alloy and stainless steel and composite bonding method According to the present invention, an insert material is laid between metal beryllium and copper alloy, wherein the insert material has the minimum, solidus temperature of not lower than 870° C. to the metal beryllium and copper alloy, respectively, and... | 01/23/2001 |
| 6168071 | Method for joining materials together by a diffusion process using silver/germanium alloys and a silver/germanium alloy for use in the method A method for joining two elements using a silver-based alloy having a germanium content is described. The method comprises providing two elements to be joined together, at least one of the elements comprising a silver/copper/germanium alloy having a silve... | 01/02/2001 |
| 6087021 | Polymer with transient liquid phase bondable particles A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point consti... | 07/11/2000 |
| 6071389 | Diffusion bonded sputter target assembly and method of making A sputter target assembly includes a cobalt target diffusion bonded to an aluminum or copper backing plate by means of a titanium interlayer. The sputter target assembly may be made by hot vacuum pressing or, preferably, by hot isostatically pressing the ... | 06/06/2000 |
| 6056186 | Method for bonding a ceramic to a metal with a copper-containing shim A method is provided for the bonding of ceramics to metals for the production of semiconductor packages. The method includes forming a copper-copper oxide eutectic on a substantially planar copper shim. The shim and its copper-copper oxide eutectic are pl... | 05/02/2000 |
| 5938104 | Direct metal bonding A method for use with a direct metal bonding type process in which a metal layer is bonded to an insulating layer. The metal layer is applied to the insulating layer to enable a direct metal bond to be formed between the layers. The integrity of the bond ... | 08/17/1999 |
| 5831252 | Methods of bonding titanium and titanium alloy members by high frequency heating Target members of titanium or a titanium alloy with melting point M are bonded together by first forming a bonding layer with melting point J lower than M on at least one of the bonding surfaces over which the target members are to be joined together. Whi... | 11/03/1998 |
| 5809644 | Valve lifter An improved, light weight tappet and method of manufacturing such a tappet. The tappet is comprised of a light weight sleeve to which a hardened disk is metallurgically bonded.... | 09/22/1998 |
| 5759300 | Liquid-phase diffusion bonding alloy foils for joining heat-resistant metals in oxidizing atmospheres Alloy foils for liquid-phase diffusion bonding of heat-resisting metals in an oxidizing atmosphere comprise 6.0 to 15.0 percent silicon, 0.1 to 2.0 percent manganese, 0.50 to 30.0 percent chromium, 0.10 to 5.0 percent molybdenum, 0.50 to 10.0 percent vana... | 06/02/1998 |
| 5742020 | Valve seat-bonded cylinder head and method for producing same A valve seat-bonded cylinder head, in which a valve seat is bonded to a cylinder head unit, which valve seat is formed of material different from and harder than that of said cylinder head unit, wherein the valve seat is bonded to the cylinder head unit b... | 04/21/1998 |
| 5683822 | Liquid-phase diffusion bonding alloy foils for joining heat-resistant metals in oxidizing atmospheres Alloy foils for liquid-phase diffusion bonding of heat-resisting metals in an oxidizing atmosphere comprise 6.0 to 15.0 percent silicon, 0.1 to 2.0 percent manganese, 0.50 to 30.0 percent chromium, 0.10 to 5.0 percent molybdenum, 0.50 to 10.0 percent vana... | 11/04/1997 |
| 5675837 | Process for the preparation of fibre reinforced metal matrix composites and novel preforms therefor A process for the preparation of a fibre reinforced metal matrix composite comprising fibres embedded in a metal in which the process comprises forming a body with a layer of aligned fibres between at least two layers of metal foil and densifying said lay... | 10/07/1997 |
| 5573171 | Method of thin film patterning by reflow A method of thin film patterning by reflow. A first metal trace is deposited onto a surface of a substrate in a predetermined pattern. A second metal trace is then deposited onto the deposited first metal trace. Next, a thin film of a third metal is depos... | 11/12/1996 |
| 5542602 | Stabilization of conductive adhesive by metallurgical bonding A metallurgical bond which may be substituted for a soldering process forms an alloy of a metal with a metal coating applied to at least one of the surfaces to be so bonded by a transient liquid phase (TLP) reaction at a low temperature. Mechanically robu... | 08/06/1996 |
| 5421507 | Au-Sn transient liquid bonding in high performance laminates A method is disclosed of simultaneously laminating circuitized dielectric layers to form a multilayer high performance circuit board and making interlevel electrical connections. The method selects two elements which will form a eutectic at one low temper... | 06/06/1995 |
| 5372298 | Transient liquid phase ceramic bonding Ceramics are joined to themselves or to metals using a transient liquid phase method employing three layers, one of which is a refractory metal, ceramic or alloy. The refractory layer is placed between two metal layers, each of which has a lower melting p... | 12/13/1994 |
| 5322740 | Solid state joint between aluminum alloys and/or magnesium alloys, and a method of making same A solid state joint and a method of making a solid state joint between aluminum or magnesium alloys is provided. The joint consists of a diffusion bond with unmelted pieces of a fragmented foil dispersed along the diffusion bond. The joint is made by plac... | 06/21/1994 |
| 5316599 | Method of producing Ni-Ti intermetallic compounds Ni-Ti intermetallic compounds are produced by subjecting a laminate of Ni foils and Ti foils to a rolling for thickness adjustment and then to a diffusion heat treatment at multistages within a particular temperature range for a particular time.... | 05/31/1994 |
| 5289967 | Synthesis of metal matrix composites by transient liquid consolidation A method is provided for fabricating metal matrix composites. Optical or reinforcing fibers, which may be in the form of monofilaments, mats, or tow, are consolidated into a metal matrix alloy. Grooves may be provided in the metal matrix material for hold... | 03/01/1994 |
