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| Number | Title | Issue Date |
| 7963434 | Micro component removing method A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surfa... | 06/21/2011 |
| 7481352 | Method for ablating points of contact (debumping) The invention relates to a method for removing a plurality of raised places of contact made of a meltable metal, such as tin or indium or an alloy, such as tin-containing solder, silver-containing solder or lead-containing solder, the meltable metal being meltable a... | 01/27/2009 |
| 7472818 | Selective rework process and apparatus for surface mount components An apparatus and method for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module ... | 01/06/2009 |
| 7441687 | Desoldering sheath The present invention provides a desoldering sheath and a method for making the same. The desoldering sheath is comprised of multiple metal ropes that are each made from two or more fine-gauge wire threads. The metal ropes are woven together to form a metal fabric t... | 10/28/2008 |
| 7353983 | Vertical removal of excess solder from a circuit substrate A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate with a plurality of pads and vias that are solder-wettable. The pads and vias of the sacrificial circuit substrate are placed in vertical prox... | 04/08/2008 |
| 7347348 | Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece Stenciling machines and methods for forming solder balls on microelectronic workpieces are disclosed herein. In one embodiment, a method for depositing and reflowing solder paste on a microelectronic workpiece having a plurality of dies includes positioning a stenci... | 03/25/2008 |
| 7347353 | Method for connecting magnetic substance target to backing plate, and magnetic substance target A method for connecting a magnetic substance target to a backing plate with less variation in plate thickness, characterized in having the steps of connecting the magnetic substance target to an aluminum plate beforehand while maintaining the flatness, connecting th... | 03/25/2008 |
| 7299965 | Method and apparatus for mounting and removing an electronic component A method and an apparatus are provided for mounting and removing electronic components using solder bumps while constraining thermal stresses to a substrate. The method and apparatus for mounting and removing an electronic component (bear chip 32) to be solde... | 11/27/2007 |
| 7296335 | Method of detaching of magnetic head slider from head gimbal assembly A method is provided for reworking a head gimbal assembly (HGA). An ultrasonic probe is used to stress the connection between the slider component of an HGA to remove the slider from its mounting position. ... | 11/20/2007 |
| 7288471 | Bumping electronic components using transfer substrates A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic compo... | 10/30/2007 |
| 7056767 | Method and apparatus for flip chip device assembly by radiant heating A flip chip semiconductor device having non-solder contact terminals is assembled by securing the chip and substrate with a rapidly thermosetting adhesive. The process is amenable to various bump and substrate materials, and has the advantage of simultaneously adher... | 06/06/2006 |
| 7007833 | Forming solder balls on substrates A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverte... | 03/07/2006 |
| 7004371 | Gripper and method for detaching packaged chip from PCB A gripper for detaching a packaged chip from a PCB. The gripper comprises a plurality of hooks, elastic slices, and a heating device. These hooks are used for gripping and hooking the packaged chip. Each hook includes a chip-upholding part and a chip-gripping part, ... | 02/28/2006 |
| 6942137 | Die removal method and apparatus A method and apparatus for separating a semiconductor device from a substrate in a fixture with a shearing element, wherein the semiconductor device is attached to the substrate by solder connections to form an assembly, includes using the shearing element to apply ... | 09/13/2005 |
| 6902099 | Method for manufacturing a circuit board capable of protecting an MR magnetic head therein against electrostatic breakdown and a method for manufacturing a magnetic head using the same The invention provides a magnetic head capable of positively preventing electrostatic breakdown of an MR magnetic head device, and a method of manufacturing the magnetic head. A circuit board comprises at least a pair of leads for constructing a circuit, lands conne... | 06/07/2005 |
| 6897410 | Dual stage pre-heater A system for electronic component processing, including: a frame configured to hold a printed circuit board; a tool head connected to the frame, the tool head being configured to position an electronic component on top of the printed circuit board; a heater disposed... | 05/24/2005 |
| 6845556 | Techniques for reworking circuit boards with ni/au finish Circuit board reworking techniques involve removing original solder from the metallic pad, removing an outer portion of the metallic pad to expose an inner portion of the metallic pad, and applying new solder to the metallic pad. Removal of the original solder and t... | 01/25/2005 |
| 6811072 | Known good die removal method and apparatus A method and apparatus for separating a chip from substrate where the chip is attached to the substrate by solder connections to form an assembly involve applying a loading force to drive a coil spring biased shearing element comprising a slide block with carrying a... | 11/02/2004 |
| 6786390 | LED stack manufacturing method and its structure thereof A LED stacking manufacturing method and its structure thereof, mainly uses a stacking method to integrate the epitaxial layer and the high-thermal-conductive substrate by twice bonding process, and the converted epitaxial layer of the temporary bonded substrate repl... | 09/07/2004 |
| 6745932 | Low strain chip removal apparatus A method and structure for a chip detach apparatus and method that limits the solder ball maximum shear rate and, more particularly, that delays the application of shear force until a minimum predefined temperature is reached. The chip detach apparatus and method ca... | 06/08/2004 |
| 6698649 | Desolder apparatus Apparatus and methods for removing solder ball connections from electrical circuits are disclosed. The apparatus and methods comprise a solder ball removing tool 20 having a multiplicity of raised ribs 22 defining a contact surface 24 and made up of heat ... | 03/02/2004 |
| 6655576 | Process for disassembling a brazed structure Brazed structures comprising hollow components having a closure component bonded thereto by a metallic brazing alloy for closing off an end of the hollow component are disassembled by locating a wire transport material in the hollow component and covering... | 12/02/2003 |
| 6622902 | Nozzle apparatus for surface mount device A nozzle device of a surface mounting device including a holder mounted and adhered closely to socket shafts by an elastic force of elastic members connected to both ends of the socket shafts, and a holder shaft formed on the bottom surface of the holder ... | 09/23/2003 |
| 6610430 | Method of attaching a device to a circuit board A method of soldering a ball grid array device onto a circuit board which includes: positioning a solder paste brick on top of a contact pad of the circuit board, said solder past brick defining an irregularly shaped structure such that a majority of a to... | 08/26/2003 |
| 6550669 | Integral heating nozzle and pickup tube An integral heating nozzle and a syringe needle pickup vacuum tube where the nozzle moves relative to the pickup tube, FIG. 4, and where the nozzle does not move relative to the pickup tip, FIG. 1. The relative movement allows the heating gas to be direct... | 04/22/2003 |
| 6497357 | Apparatus and method for removing interconnections A method for removing at least one molten or solid structure from a surface including: placing the surface with the at least one molten or solid structure in a fixture; disposing said wiper assembly acted on by a bias proximate the at least one molten or ... | 12/24/2002 |
| 6360938 | Process and apparatus to remove closely spaced chips on a multi-chip module A process and apparatus for removing flip chips with C4 joints mounted on a multi-chip module by applying a tensile force to one or more removal member bonded to the back of one or more flip chips during heating of the module to a temperature sufficient t... | 03/26/2002 |
| 6247630 | Apparatus and method for uniformly melting the solder attaching a surface mount device to a printed circuit board A flow control nozzle for hot gases includes an input end to receive a hot gas. An output end of the flow control nozzle delivers the hot gas to a surface mount device attached with solder to a printed circuit board. A gas distribution mechanism is positi... | 06/19/2001 |
| 6243944 | Residue-free method of assembling and disassembling a pressed joint with low thermal resistance A method of assembling a pressed joint between an integrated circuit module and a temperature regulating unit includes the steps of: 1) providing the integrated circuit module with a contact surface of a first material and providing the temperature regula... | 06/12/2001 |
| 6225206 | Flip chip C4 extension structure and process An electrical structure, and associated method of fabrication, for reducing thermally induced strain in a conductive structure that couples a first substrate to a second substrate. The first substrate may include a chip or a module. The second substrate m... | 05/01/2001 |
| 6201930 | Chip removal and replacement system A chip removal and replacement system is designed for safely and easily removing or reattaching components from a printed circuit board. The system includes an automatic suction system for lifting a component which has been removed. A nozzle connection an... | 03/13/2001 |
| 6142358 | Wafer-to-wafer transfer of microstructures using break-away tethers Break-away tethers to secure electronic, mechanical, optical, or other microstructures, during release from one substrate and transfer to another. Microstructures are fabricated with integrated tethers attaching them to a first substrate. The structures a... | 11/07/2000 |
| 6131794 | Shaving blade for chip site dressing A shaving or shearing blade utilized in dressing solder joint chip technologies without the use of heat or a copper block wicking process. In essence, any solder debris resulting from the solder shaving process as implemented by the shaving blade is remov... | 10/17/2000 |
| 6053393 | Shaving blade for chip site dressing A shaving or shearing blade utilized in dressing solder joint chip technologies without the use of heat or a copper block wicking process. In essence, any solder debris resulting from the solder shaving process as implemented by the shaving blade is remov... | 04/25/2000 |
| 6050476 | Reworkable microelectronic multi-chip module A reworkable cold welded microelectronic multi-chip module contains cold welded microelectronic chips in which the chip's cold weld metal bonding pads (3) are constructed of a metal having one hardness and the corresponding cold weld metal bonding pads of... | 04/18/2000 |
| 5950906 | Reversible brazing process A method of reversibly brazing surfaces together. An interface is affixed to each surface. The interfaces can be affixed by processes such as mechanical joining, welding, or brazing. The two interfaces are then brazed together using a brazing process that... | 09/14/1999 |
| 5934545 | Ball placement method and apparatus for forming a ball grid array A method and apparatus allow securing of balls to ball grid array electronic components. A component having a surface with rows and columns of electrical contact solder pads is removed from a printed circuit board for rework. Excess solder is removed from... | 08/10/1999 |
| 5921462 | Ball grid array ball placement method and apparatus A method and apparatus enables the securing of balls to ball grid array electronic components. A component having a surface with rows and columns of electrical contact pads is removed from a printed circuit board for rework. Excess solder is removed from ... | 07/13/1999 |
| 5816479 | Method for joining driven pipe Improved welding method and padeye processing speeds up the connection of individual joints by peripheral fusion welding while the joint to be added stands vertically atop an existing pipe string also standing vertical in the rig floor. A plurality of wel... | 10/06/1998 |
| 5806753 | Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier A method of forming a bond structure for use with integrated circuits and semiconductor electronics and carrier assemblies is disclosed. Metallurgical paste is screen printed through a stencil and the stencil is left in place during the reflow process. Th... | 09/15/1998 |
