Did You Know...
...that in 1800 ether was first used by partyers as a fun diversion? Sniffing the gas led to hilarious and raucous laughter as people watched each other become more and more intoxicated and silly. Several doctors independently realized the value ether would have to anesthetize surgery patients. Of those who claimed rights to the "discovery," none had a happy ending. One had a seizure and died defending his rights. Another spent his life in an asylum because he had been denied acclaim. A third became addicted to chloroform and, in a New York City jail, he soaked a cloth in the drug, severed an artery and bled to death.
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| Number | Title | Issue Date |
| 7661573 | Heating apparatus The heating apparatus allows an outlet of a heating nozzle to get opposed to an electronic component during detachment of the electronic component from a printed wiring board. Hot air blown out of the outlet of the heating nozzle is utilized to heat the electronic c... | 02/16/2010 |
| 7441687 | Desoldering sheath The present invention provides a desoldering sheath and a method for making the same. The desoldering sheath is comprised of multiple metal ropes that are each made from two or more fine-gauge wire threads. The metal ropes are woven together to form a metal fabric t... | 10/28/2008 |
| 7325714 | Solder heating system This invention provides a system capable of melting solder and removing the melted solder from a substrate. The heating system includes a desoldering tool having at least two handles, a first handle and a second handle. This way, an operator may grip the first handl... | 02/05/2008 |
| 7288472 | Method and system for performing die attach using a flame Embodiments of a method for attaching a die to a substrate using a flame or other heat source are disclosed. The flame may be produced by combustible gas. Also disclosed are embodiments of a system for performing die attach using a flame. Other embodiments are descr... | 10/30/2007 |
| 7252100 | Systems and methods for processing a set of circuit boards A circuit board processing system includes a wash tank configured to contain cleaning fluid, and a positioning subsystem configured to immerse a set of circuit boards into the wash tank. The system further includes a flow control subsystem having (i) a first set of ... | 08/07/2007 |
| 7244081 | Drill adapter for drill having central and lateral cutting inserts A drill adapter has a resilient insert retaining portion at one end, a drive stem at the second end, and an adapter seating portion between the two. The insert retaining portion includes first and second resilient clamping members which are rotationally 180° apart.... | 07/17/2007 |
| 7234218 | Method for separating electronic component from organic board A method and electrical structure for separating electronic components from one another joined by solder interconnections. An electronic module is joined to a substrate via a solder interconnection, whereby the electronic module has an electrical heating component r... | 06/26/2007 |
| 7222772 | Flip chip bonder A flip chip bonder including a substrate holding mechanism and a chip die bonder for bonding a semiconductor chip having a plurality of electrodes projecting from its front surface to a substrate held on the substrate holding means. The flip chip bonder includes a c... | 05/29/2007 |
| 7199476 | Electronic device An electronic device has at least one semiconductor chip, which has mutually opposing contact sides, of which one first contact side is electroconductively surface-bonded via a first, solid soldering-agent layer to at least one first metallic conductor part. The sem... | 04/03/2007 |
| 7177160 | Circuit board clamping device A circuit board clamping device is applied to at least two spaced and stacked circuit boards, wherein the two circuit boards are spaced apart and fixed by a plurality of spacing posts. The circuit board clamping device includes a securing member, a pressing member a... | 02/13/2007 |
| 7171743 | Apparatus and method for warpage compensation of a display panel substrate assembly An apparatus and method for warpage compensation of a display panel substrate assembly are described. A method and apparatus for warpage compensation of a display panel substrate assembly are described. In one embodiment, the method includes the selection of a subst... | 02/06/2007 |
| 7156278 | Auxiliary soldering tool An auxiliary soldering tool includes a first jaw plate having a first holding portion and a first holding portion, a second jaw plate having a second holding portion and a second holding portion, and two elastic press plates each respectively rested on the first hol... | 01/02/2007 |
| 7134590 | Desoldering sheath A desoldering sheath that comprises at least one hollow metal wire molded to conform to the tip of a desoldering tool. In one implementation, the desoldering sheath is formed using a hollow metal wire that is coiled around a male cone-shaped mold. The coiled, hollow... | 11/14/2006 |
| 7048172 | Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on... | 05/23/2006 |
| 7033842 | Electronic component mounting apparatus and electronic component mounting method The present invention provides an electronic component mounting apparatus, wherein a high speed operation can be provided by simplifying the structure of a mounting head and wherein the working efficiency can be improved by eliminating the use of the mounting head f... | 04/25/2006 |
| 7014673 | Filtering apparatus A filtering apparatus for a reflow oven includes a contaminated-gas inlet for receiving contaminated gas from a reflow oven; a filtering device configured to filter the received contaminated gas; a returned gas outlet for returning filtered gas to the reflow oven; a... | 03/21/2006 |
| 6971571 | Reflow soldering apparatus and reflow soldering method A bath apparatus 12 reserves a liquid 13 as a heating medium and includes an input partition bath 31, a first intermediate partition bath 32, a heat partition bath 33, a second intermediate partition bath 34 and a removing p... | 12/06/2005 |
| 6972396 | Electric part heating device and electric part handling device Disclosed is a heating device having a elongated body to heat an electric part for soldering or desoldering the electric part. The heating device includes a tip through which the heat is applied to the part, a heater for heating the tip and a temperature sensor for ... | 12/06/2005 |
| 6957686 | Heated blades for wax melting A knife for heating the wax on the surface of a wax runner. The knife as a surface which is recessed in the center of the surface to permit melted wax to flow up into the recessed area and not flow away from the knife. Alternately, conformal heating surface which me... | 10/25/2005 |
| 6957759 | Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on... | 10/25/2005 |
| 6954987 | Method of interconnecting a circuit board to a substrate A printed circuit board assembly employing a solder vent hole adjacent solder filled interconnect vias connecting to a conductive pallet, is disclosed. The solder vent hole allows gases to escape from an otherwise sealed cavity during solder reflow, relieving positi... | 10/18/2005 |
| 6951299 | Tooling frame able to adhere to tin A tooling frame with an ability to adhere to tin is disclosed, which is a frame structure used to support a circuit board passing through a stannic furnace to be soldered. The tooling frame is characterized in that a tin adhesive apparatus having a tin adhesive mate... | 10/04/2005 |
| 6942137 | Die removal method and apparatus A method and apparatus for separating a semiconductor device from a substrate in a fixture with a shearing element, wherein the semiconductor device is attached to the substrate by solder connections to form an assembly, includes using the shearing element to apply ... | 09/13/2005 |
| 6910615 | Solder reflow type electrical apparatus packaging having integrated circuit and discrete components In a solder reflow type building of modular electrical apparatus involving integrated circuit and discrete components, fabrication operations are arranged to include the providing of a general type series of steps for each component element involving a reflow or joi... | 06/28/2005 |
| 6902101 | Bump bonding method apparatus In a bump bonding technique for forming a bump on an IC, including forming a ball at the tip of a gold wire protruding from a capillary, and providing a metal-to-metal joint by applying ultrasonic vibration from a ultrasonic head through the capillary while pressing... | 06/07/2005 |
| 6811072 | Known good die removal method and apparatus A method and apparatus for separating a chip from substrate where the chip is attached to the substrate by solder connections to form an assembly involve applying a loading force to drive a coil spring biased shearing element comprising a slide block with carrying a... | 11/02/2004 |
| 6809286 | Shielding gas filter for welding apparatus A shielding gas filter that can be readily incorporated into a gas shielding system for an arc welding apparatus. The gas shielding filter is readily installed to the system upstream of a gas solenoid valve and removes any potentially harmful particles from the supp... | 10/26/2004 |
| 6793125 | Solder shaping process and apparatus A process and apparatus for forming fusible solder material mounted on a substrate with the use of a tool having a treatment surface with selected shape. The solder material is heated sufficiently to cause fusing after which the tool is moved such that the treatment... | 09/21/2004 |
| 6732911 | Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system There is provided a chamber open to the outside through openings through which a solder-adhered object is passed and the chamber having a heating/melting area, a carrying mechanism for carrying the solder-adhered object into the heating/melting area, a formic-acid s... | 05/11/2004 |
| 6722557 | Flux cleaning method and method of manufacturing semiconductor device An effective method for cleaning flux residues produced in process of fabricating semiconductor devices, and a method of fabricating the semiconductor devices including this cleaning method are provided. The flux cleaning method for cleaning the solder bump electrod... | 04/20/2004 |
| 6705509 | Method of recovering lead-free solder from printed circuit boards Discarded printed circuit boards are sorted according to the alloying elements in solder used on the printed circuit boards. After sorting, the printed circuit boards are heated to melt the solder, and the molten solder is collected. ... | 03/16/2004 |
| 6676005 | Wire bonding method and apparatus The present invention enhances the reliability of wire-bonding strength by reducing a variation in the entire transformation amount of a wire. At point P1, a bonding wedge 21 abuts the wire 71, whereby a load is exerted on the wire 71. The wire 71 transfo... | 01/13/2004 |
| 6655576 | Process for disassembling a brazed structure Brazed structures comprising hollow components having a closure component bonded thereto by a metallic brazing alloy for closing off an end of the hollow component are disassembled by locating a wire transport material in the hollow component and covering... | 12/02/2003 |
| 6638363 | Method of cleaning solder paste A cleaning apparatus for cleaning solder paste off the bottom side of a printed circuit board stencil includes a container of cleaning solution therein and a blade holder that is movable between a wiping position and the container of cleaning solution. A ... | 10/28/2003 |
| 6609675 | Desoldering wick dispenser A desoldering wick dispenser In an embodiment of combined package and tube, the package has a funnel shaped housing containing a coil of desoldering wick. An end portion of the desoldering wick extends through and beyond the outer end of a tube extending ... | 08/26/2003 |
| 6607113 | Apparatus and method for removing a soldered device from a printed circuit board A rework nozzle includes a gripping device that is used to remove a soldered device from a circuit board. The rework nozzle attaches to a module that generates hot gas. The device that is to be removed from the circuit board is placed within the nozzle. T... | 08/19/2003 |
| 6576030 | Filtering apparatus A filtering apparatus for a reflow oven includes a contaminated-gas inlet for receiving contaminated gas from a reflow oven; a filtering device configured to filter the received contaminated gas; a returned gas outlet for returning filtered gas to the ref... | 06/10/2003 |
| 6568077 | Blisk weld repair Damage in a blisk airfoil is machined away to create a notch. A repair is welded in the airfoil to fill the notch. The weld repair is then machined to restore the airfoil to a substantially original, pre-damaged configuration at the repair.... | 05/27/2003 |
| 6557796 | Desoldering wick dispenser A desoldering wick dispenser includes a conventional wick package in the form of a bowl with a central hub and a flat cover mounted on the hub and having a gap between the edge of the cover and the outer edge of the bowl. A desoldering wick is coiled in t... | 05/06/2003 |
| 6550669 | Integral heating nozzle and pickup tube An integral heating nozzle and a syringe needle pickup vacuum tube where the nozzle moves relative to the pickup tube, FIG. 4, and where the nozzle does not move relative to the pickup tip, FIG. 1. The relative movement allows the heating gas to be direct... | 04/22/2003 |
