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| Number | Title | Issue Date |
| 7303033 | Vehicle frame assembly and method for same A method for assembling vehicular structural frames employing elongated members and connectors interconnecting the elongated members increases flexibility in assembling chassis frames and body frames. The method includes assembling a first vehicle structural frame a... | 12/04/2007 |
| 7275676 | Apparatus for locating conductive spheres utilizing screen and hopper of solder balls Apparatus for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop thr... | 10/02/2007 |
| 7179558 | Braze alloy containing particulate material A minimum joint thickness can be assured by incorporating beads or particles having a diameter corresponding to the joint thickness desired and which are infusible at the brazing temperature. Preferably such particles are formed of high-melting metals, metal oxides,... | 02/20/2007 |
| 7159906 | Methods and apparatus for flange sealing Embodiments of the invention, can utilize a flange system incorporating metal sealing. In a further specific embodiment, the subject invention can utilize stainless steel sealing, where the flanges and seals are stainless steel. The subject seal may be made and rele... | 01/09/2007 |
| 7108060 | Fracturing different levels within a completion interval of a well Method and apparatus for fracturing different levels of a completion interval in a well. A workstring lowers a fracturing string which, in turn, is comprised of a base pipe which is blank except for perforated sections spaced along its length. Screen may be provided... | 09/19/2006 |
| 6994117 | Piping elbow liners Liners useful as piping elbow liners comprising a body liner, a tangential inlet liner, and a tangential outlet liner. The tangential inlet liner and the tangential outlet liner can be removably inserted into a cavity in the body liner. The body liner can comprise t... | 02/07/2006 |
| 6869008 | Method of forming bumps In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to be formed, there are various limitations on the material of which the bumps are made, due to enough cubic volume of bumps and to sm... | 03/22/2005 |
| 6742700 | Adhesive composition for bonding different kinds of members A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two or more kin... | 06/01/2004 |
| 6484925 | Method for soldering pipes A method for soldering pipes configures the pipes being soldered such that water running through the pipes is not permitted to pool in the pipes. The method also configures the pipes to facilitate sealing of the pipes after the soldering is completed.... | 11/26/2002 |
| 6390354 | Adhesive composition for bonding different kinds of members A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two ... | 05/21/2002 |
| 6379817 | Metallic fabric and manufacturing process of a hollow body made of a metallic fabric A metallic fabric for manufacturing a hollow body is welded at two edge areas and according to the present invention a metallic strip is welded on in the vicinity of the welded seam, whereby the width of the welded seam is narrower than the width of the m... | 04/30/2002 |
| 6347663 | Fitting/manifold assembly and method for a heat exchanger A fitting/manifold assembly and method are provided for a heat exchanger. The method includes the steps of providing a manifold (22) including a wall (30) having an aperture (32) therethrough; providing a fitting (24) including a body (42), a nipple (44) ... | 02/19/2002 |
| 6293594 | Joining a winding to a connector using a transition ring A technique for joining an elongated wound element and a mating connector of a body implantable lead assembly comprises the steps of causing an end portion of the wound element to abut against a first end of a transition component having similar mass and ... | 09/25/2001 |
| 6283359 | Method for enhancing fatigue life of ball grid arrays This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has ... | 09/04/2001 |
| 6247639 | Fixed-gap solder reflow method A method is provided for forming a plurality of solder joints for electrically and mechanically coupling a printed circuit board (100) and a flexible circuit (101). Solder is applied to the connection surfaces of the printed circuit board (100), and the c... | 06/19/2001 |
| 6247637 | Method of integrated circuit assembly A method of integrated circuit assembly before encapsulation including at least one step of soldering, under mechanical pressure, a first element on a second element, including temporarily maintaining a predetermined spacing, at least partially without so... | 06/19/2001 |
| 6209775 | Bracket mounting arrangement for machine frames A bracket for a machine frame, such as a core molding machine frame, having horizontal and vertical members includes first and second legs adapted for attachment to the machine frame members. The first and second legs are formed from a plate material and ... | 04/03/2001 |
| 6188039 | Projection welded panel spacer and method for making the same A method for making a spacer assembly comprises: forming a plurality of projections along an edge of a portion of sheet metal; roll forming the portion of sheet metal into a tubular configuration; positioning the roll formed portion of sheet metal and a m... | 02/13/2001 |
| 6156408 | Device for reworkable direct chip attachment The method (400, 500) and device (200) for reworkable direct chip attachment include a thermal-mechanical and mechanical stable solder joint for arranging connection pads on a top surface of the circuit board to facilitate connection for electronic elemen... | 12/05/2000 |
| 6131797 | Method for joining ceramic to metal Metal and ceramic members are joined together by a braze joint including a member made of bar stock molybdenum, a first ductile member brazed between the molybdenum member and the metal member, and a second ductile member brazed between the molybdenum mem... | 10/17/2000 |
| 6126061 | Element made of composite material including electrical continuity through the element The subject of the invention is an element made of composite material comprising an organic matrix which is reinforced with mineral or organic fibers, as well as at least one assembly with partial superposition of at least two electrically conductive elon... | 10/03/2000 |
| 6079611 | Method of manufacturing ventilated brake disc A method of manufacturing a stainless steel ventilated brake disc is provided that results in a relatively inexpensive stainless steel ventilated brake disc. In manufacturing the ventilated brake disc a pair of annular plate members are provided that are ... | 06/27/2000 |
| 6059177 | Welding method and welding material A welding method for two members adapted to be welded and formed of a low-alloy steel for structural purposes causing the weld metal to develop martensite transformation during cooling after welding, so that the weld metal becomes expanded to a greater de... | 05/09/2000 |
| 6053394 | Column grid array substrate attachment with heat sink stress relief Structure and method for reinforcing a solder column grid array attachment of a ceramic or the like substrate to a printed circuit board, the reinforcement providing support for a heat sink which is bonded or affixed by pressure to a structural element of... | 04/25/2000 |
| 6045028 | Integral corrosion protection of friction-welded joints A zone of corrosion-resistant material covering a friction stir welded joint surface is provided by applying a layer of corrosion-resistant material over one or both surfaces of the workpieces being joined so that the layer covers at least the weld zone w... | 04/04/2000 |
| 6045033 | Pipe connection and method A method of forming lengths of pipe for assembly together to form fluid flow conduits includes the steps of providing a pipe having a first inner diameter and a central longitudinal axis, providing a ferrule which has an annular first end, having an inner... | 04/04/2000 |
| 6010669 | Method for restoring the functionality of equipment subjected to heavy corrosion in a plant for the production of urea A method for repairing and restoring the functionality of equipment subjected to internal corrosion during its operation at high or medium pressure in a plant for the synthesis of urea. The method includes the cleaning of the corroded area, the formation ... | 01/04/2000 |
| 6011693 | Slotted printed circuit board surface mount stress relief system A surface mounting stress relief system for mounting a surface mount package such as a leadless ceramic chip carrier on a printed circuit board includes a printed circuit board having a top layer attached to a bottom layer. The top layer includes cavities... | 01/04/2000 |
| 5992728 | Endoscope An endoscope contains no adhesives, epoxies, or other organic materials. The endoscope includes a set of lenses held in position by cylindrical spacers. A pair of windows seal the ends of the endoscope, and prevent the lenses and spacers from falling out.... | 11/30/1999 |
| 5975410 | Process of bonding a metal brush structure to a planar surface of a metal substrate Process for bonding a metal brush structure to a planar surface of a metal substrate in which an array of metal rods are retained and immobilized at their tips by a common retention layer formed of metal, and the brush structure is then joined to a planar... | 11/02/1999 |
| 5971253 | Microelectronic component mounting with deformable shell terminals A microelectronic element assembly such as a semiconductor chip assembly uses a connection component incorporating a dielectric sheet with electrically conductive elements therein. Each electrically conductive element may include a flexible shell. The fle... | 10/26/1999 |
| 5961028 | System for joining thin-walled steel parts A thin-walled steel first part is joined to a steel second part by first juxtaposing a metal plate with the first part, then securing the plate to the first part by soldering or laser welding, juxtaposing the second part with the plate, and fusion welding... | 10/05/1999 |
| 5950906 | Reversible brazing process A method of reversibly brazing surfaces together. An interface is affixed to each surface. The interfaces can be affixed by processes such as mechanical joining, welding, or brazing. The two interfaces are then brazed together using a brazing process that... | 09/14/1999 |
| 5921591 | Pipe connecting assembly and method for joining two lengths of pipe by a press-fit connection A pipe connecting assembly and method for joining two lengths of steel pipe in the field without the need for welding the connection includes a pair of tubular members both having cylindrical exterior and interior surfaces that substantially conform to th... | 07/13/1999 |
| 5709337 | Mounting assembly for a pressure transmitter The present invention relates to a mounting assembly for a pressure sensor in a pressure transmitter. The mounting assembly includes a header having a cavity opening to a first surface. The cavity is defined by an inner endwall and an inner sidewall. A su... | 01/20/1998 |
| 5699954 | Device for securing an electronic component to a pin grid array socket The present invention is directed to a device for securing an electrical component to a pin grid array (PGA) socket that has a substantially planar body portion and a plurality of conductor pins, which are electrically connectable to a circuit board and p... | 12/23/1997 |
| 5690270 | Surface mounting stress relief device and method A device and method for mounting a surface mount package onto a printed circuit board includes inserting a pin through a printed circuit board feedthrough for providing movement of the pin within the feedthrough. One end of the pin is soldered to conducti... | 11/25/1997 |
| 5678164 | Process for obtaining a bladed circular metallic article A process for constructing a circular metallic article which includes a hub and a plurality of vanes mounted on the periphery of the hub wherein the vanes are placed in position around the hub, formers are arranged between the blade portions of the vanes,... | 10/14/1997 |
| 5529957 | Method for blocking contamination and stabilizing chip capacitor during attachment using a tape strip Chip capacitors are attached to an integrated circuit package. Strips of synthetic tape are placed between pairs of chip capacitor pads on the integrated circuit package. The strips of synthetic tape each have a height extending above height of the pairs ... | 06/25/1996 |
| 5511799 | Sealing device useful in semiconductor processing apparatus for bridging materials having a thermal expansion differential The present invention pertains to an apparatus useful in semiconductor processing. The apparatus can be used to provide a seal which enables a first portion of a semiconductor processing chamber to be operated at a first pressure while a second portion of... | 04/30/1996 |
