Class 228/188 - Including nonmetallic base

Subclass of Class 228 - Metal fusion bonding
Definition: Process in which one of the work parts is a material other
No. of patents: 39
Last issue date: 10/23/2007

Number	Title	Issue Date
7285010	TDI detecting device, a feed-through equipment and electron beam apparatus using these devices An electron beam apparatus comprises a TDI sensor (64) and a feed-through device (50). The feed-through device has a socket contact (54) for interconnecting a pin (52) attached to a flanged (51) for separating different environment...	10/23/2007
7159756	Method of soldering and solder compositions The invention relates to using the heat generated during thermal treatment of one or more glass sheets to melt solder. In one nonlimiting embodiment, a lead providing external access to an electrical conductive arrangement, e.g. a conductive member between and conne...	01/09/2007
7159757	Metal/ceramic bonding article and method for producing same After a metal member of an alloy containing copper and nickel is arranged on at least one side of a ceramic substrate, the metal member and the ceramic substrate are heated in an atmosphere of an inert gas or in vacuo at a temperature between solidus and liquidus li...	01/09/2007
7132173	Self-centering braze assembly Braze and electrode wire assemblies, e.g., used with an implantable microstimulator, include a wire welded in the through-hole of an electrode, which electrode is brazed to a ceramic case that is brazed to a metal ring that is welded to a metal can. The braze joints...	11/07/2006
6953706	Method of providing a semiconductor package having an internal heat-activated hydrogen source Manufacturable processes and the resultant structures utilize metal hydride as an internal source of hydrogen to enhance heat removal within semiconductor packages that employ low dielectric constant materials. The use of a metal hydride heated by internal or extern...	10/11/2005
6833526	Flex to flex soldering by diode laser A method to solder flex circuits by diode laser. First and second flex circuits composed of polymer flex substrate are provided. Each flex circuit has a top and a bottom side and at least one contact trace embedded in its surface. An area of solder is provided on th...	12/21/2004
6761303	Semiconductor light-emitting device and method of manufacturing the same and mounting plate To offer a semiconductor light-emitting device capable of preventing a short circuit failure caused by adhesion of the solder, change of a beam shape, and decrease of a beam output. A semiconductor laser device 1 is manufactured by overlaying a laser chip hav...	07/13/2004
6742700	Adhesive composition for bonding different kinds of members A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two or more kin...	06/01/2004
6526655	Angled flying lead wire bonding process A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respec...	03/04/2003
6442831	Method for shaping spring elements Interconnection elements for electronic components, exhibiting desirable mechanical characteristics (such as resiliency, for making pressure contacts) are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (suc...	09/03/2002
6295729	Angled flying lead wire bonding process A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respec...	10/02/2001
5864946	Method of making contact tip structures Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connect...	02/02/1999
5089750	Lead connection structure Lead connection in a structure is provided by leads disposed against electrodes of wiring board through resin, which resin is then stiffened by the application of light. Accordingly, an electrical and a mechanical connection of the leads and the electrode...	02/18/1992
5069978	Brazed composite having interlayer of expanded metal Two materials having different coefficients of thermal expansion are brazed together by use of an interlayer of expanded metal therebetween. The expanded metal makes point-type contact with the two materials and accommodates stresses resulting from the ex...	12/03/1991
4959590	Lead connection structure Lead connection in a structure is provided by leads disposed against electrodes of wiring board through resin, which resin is then stiffened by the application of light. Accordingly, an electrical and a mechanical connection of the leads and the electrond...	09/25/1990
4876221	Bonding method Disclosed is a method for bonding one of the principal planes of a lead formed on a film or the like and an electrode formed on the face side of a semiconductor element, by way of metal bumps, wherein the electrode, metal bumps and lead are pressurized be...	10/24/1989
4867371	Fabrication of optical devices A relatively large scale low cost method of fabricating optical devices with associated coupling lenses comprises the following steps: (a) producing in one surface of a substrate (1) of suitable material(s) a predetermined array of planar diffused lenses (4); ...	09/19/1989
4693770	Method of bonding semiconductor devices together Disclosed is a method of realizing high-density and inexpensive semiconductor apparatus by joining the electrodes of two semiconductor devices. A metal bump formed on a substrate is transferred and joined onto the electrode of first semiconductor device, ...	09/15/1987
4661181	Method of assembly of at least two components of ceramic material each having at least one flat surface A method of assembly of at least two ceramic components each having at least one flat surface, as applicable in particular to microwave equipment and encapsulation modules for microwave semiconductors. The starting components are made of ceramic material ...	04/28/1987
4624404	Method for bonding ceramics and metals A method for bonding Si3 N4 or SiC ceramics with metals which comprises the steps of depositing, on the ceramic material, an insert material consisting of a mixture of at least one metal selected from the group consisting of Ni and C...	11/25/1986
4610901	Dual glazed insulatable stained glass window and method of making same This invention relates to devices and methods of manufacturing cut glass panels which comprise a plurality of glass panes arranged in a predetermined pattern with novel came flanges that span the adjacent edges of the glass panes on both sides of the pane...	09/09/1986
4603474	Collector for an electric machine and method for its production A collector for electric machines, including a rotationally symmetrical sintered ceramic body and a plurality of radially disposed metallic segments which are separated from each other by one interspace each and which are bonded to the ceramic body via a ...	08/05/1986
4591401	Process for the direct bonding of metal to ceramics In directly bonding a metal to ceramics, in accordance with the invention, that surface of a metal component which is to be bonded by heating to a ceramic substrate is provided with parallel-running grooves before the preoxidation. The grooves make it pos...	05/27/1986
4576326	Method of bonding semiconductor devices to heatsinks A method for matching the bonding pad surfaces of a device and heatsinks to be bonded, which method maximizes the uniformity of pressure applied during thermocompression bonding, is disclosed. The method comprises using the collet of a die bonding machine...	03/18/1986
4494688	Method of connecting metal leads with electrodes of semiconductor device and metal lead therefore A method suitable for connecting a plurality of metal leads at the same time with electrodes of a semiconductor device. Metal leads are provided each of which has a metal bump bonded thereto. The metal of the metal bump is softer than that of the lead. Th...	01/22/1985
4457467	Method for positioning and fixing optical components relative to one another A method for positioning and fixing optical components relative to one another which comprises the steps of providing a carrier plate having an optical component, securing an optical component on a retainer plate having at least one solderable area, posit...	07/03/1984
4332341	Fabrication of circuit packages using solid phase solder bonding A method of forming circuit packages including bonding an electronic component, (10) such as a chip carrier, to a supporting substrate (22). Solid solder preforms (13) are applied to contact members (12) on the component or substrate or both. The preforms...	06/01/1982
4331282	Method of manufacturing glazing panels In the manufacture of glazing panels comprising sheets marginally bonded together, in order to simplify and speed up production, a method of effecting bonding between at least one such sheet and one or more members assembled in marginal contact therewith,...	05/25/1982
4315591	Method for thermo-compression diffusion bonding a structured copper strain buffer to each side of a substrateless semiconductor device wafer A method is provided for thermo-compression diffusion bonding respective structured copper strain buffers directly to each of the two major opposed surfaces of a substrateless semiconductor device wafer having a beveled outer edge surface. A selected port...	02/16/1982
4286743	Method of soldering a first vitreous component to a second component A method of soldering a first, vitreous component for example a sheet to at least one second component which is vitreous or metallic, in which the or each vitreous component is metallized in the joint region(s), the components are assembled together in th...	09/01/1981
4257156	Method for thermo-compression diffusion bonding each side of a substrateless semiconductor device wafer to respective structured copper strain buffers A method is provided for thermo-compression diffusion bonding first and second structured copper strain buffers, respectively, directly to the two opposed surfaces of a substrateless semiconductor device wafer. The expensive tungsten or molybdenum support...	03/24/1981
4251018	Method of making a lined conduit section A curved section is provided for connecting in a conduit through which passes a fluid stream having solid material entrained therein. A plurality of wear strips are attached to the inside wall of the curved section. They are positioned for the solid mater...	02/17/1981
4187599	Semiconductor device having a tin metallization system and package containing same An improved metallization system for semiconductor substrates comprising successive layers of at least one barrier metal and tin is disclosed. A semiconductor package comprising a housing of impervious material, a semiconductor device having the metalliza...	02/12/1980
4129243	Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof Disclosed is a double side cooled, pressure mounted semiconductor package and a method for the manufacture thereof. The package is formed by directly bonding upper and lower metal contact assemblies to an annular ceramic housing. Assembly is simplified if...	12/12/1978
4129242	High fidelity pressure transducer The capacitive fluid pressure transducers described herein comprise quartz bodies and diaphragms having suitable electrodes deposited thereon to form both sensing and reference capacitors in appropriate configurations for high fidelity measurement of rela...	12/12/1978
4067104	Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components A method of interconnecting microelectronic components with flexible metallic interconnects. A layer of photoresist is applied to the surface of a microelectronic component and then removed from selected locations. A deposit of metal is applied to the sel...	01/10/1978
4032058	Beam-lead integrated circuit structure and method for making the same including automatic registration of beam-leads with corresponding dielectric substrate leads A beam-lead integrated circuit chip structure which comprises a semiconductor chip substrate having a passivated planar surface from which active and passive devices in the circuit extend into the substrate. A plurality of peripheral beam-leads interconne...	06/28/1977
3953924	Process for making a multilayer interconnect system A process for making an interconnect system for a multilayer circuit pattern. The interconnect system is formed having minimized through-hole space consumption so as to be suitable for high density, closely meshed circuit patterns....	05/04/1976
3951327	Ceramic to metal seal Providing a high strength, hermetic ceramic to metal seal by essentially heating a wire-like metal gasket and a ceramic member, which have been chemically cleaned, while simultaneously deforming from about 50 to 95 percent the metal gasket against the cer...	04/20/1976

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Class 228/188 - Including nonmetallic base