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"I hate what they've done to my child...I would never let my own children watch it. "
Vladimir Zworykin, television pioneer ; Talking about an invention in which he played a critical role.
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| Number | Title | Issue Date |
| 7353982 | Diffusion bonding for metallic membrane joining with metallic module This invention relates to a method of bonding a metallic membrane with metallic part involving pressing a smooth surface of the metallic membrane against the smooth surface of the metallic part, and heating the metallic membrane and metallic part to a temperature ab... | 04/08/2008 |
| 7025248 | Method for manufacturing a titanium sheet and a shaped component consisting of the titanium sheet The invention relates to a roll-bonded titanium sheet (6), a shaped component manufactured therefrom (10) and a method for manufacturing the titanium sheet (6) and the shaped component (10). In order to achieve a high-temperature-resistan... | 04/11/2006 |
| 6945448 | Method for attaching a porous metal layer to a metal substrate A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components or acetabular cups. The method, in one embodiment thereof, comprises providing a structur... | 09/20/2005 |
| 6921018 | Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array A multi-chip stack structure and method of fabrication are provided utilizing self-aligning electrical contact arrays. Two or more arrays of interconnection contacts are provided, with one array being a rough aligned contact array, and a second array being a high ba... | 07/26/2005 |
| 6259036 | Method for fabricating electronic assemblies using semi-cured conductive elastomeric bumps A method for fabricating bumped semiconductor components and electronic assemblies, such as multi chip modules, is provided. The method includes forming semi cured, electrically conductive, elastomeric bumps on electrodes of a semiconductor component (e.g... | 07/10/2001 |
| 6123250 | Reflow oven The invention relates to an oven for reflow soldering objects such as printed circuit boards. A temperature differential is established between the top and bottom surfaces of the board to allow gases liberated from solder paste within through-holes to esc... | 09/26/2000 |
| 6100475 | Solder bonding printed circuit boards The specification describes techniques for attaching double sided circuit boards having plated through holes to interconnection substrates using solder bump arrays. The through holes are filled with a high melting point solder which allows solder bumps to... | 08/08/2000 |
| 6015325 | Method for manufacturing transmission type X-ray tube A method for manufacturing an X-ray tube that simplifies the manufacturing process, which method includes a stem unit assembly process, a high-temperature brazing process, an X-ray tube assembly process, and a low-temperature brazing process. In the stem ... | 01/18/2000 |
| 5803344 | Dual-solder process for enhancing reliability of thick-film hybrid circuits A high temperature thick-film hybrid circuit is characterized by a surface-mount circuit component that is electrically interconnected with a conductor. The surface-mount circuit component of the thick-film hybrid circuit is bonded to the conductor with a... | 09/08/1998 |
| 5655703 | Solder hierarchy for chip attachment to substrates The method for soldering a chip to a substrate to form a module and then soldering the module to a circuit board includes selecting a three level hierarchy of solders by the temperature required to melt. By this method, a module can be soldered to and de-... | 08/12/1997 |
| 5323954 | Method of bonding titanium to a cobalt-based alloy substrate in an orthophedic implant device A femoral component of a knee prosthesis, including a cobalt-based alloy substrate and a titanium fiber metal pad bonded thereto by means of an interlayer of a cobalt-based alloy including nickel. More specifically, a method of bonding a titanium porous s... | 06/28/1994 |
| 5289966 | Method for connecting electronic component with substrate A method is provided for electrically connecting a first electronic component which is not resistant to a reflowing temperature and a second electronic component which is resistant to the reflowing temperature to a substrate. The method includes the steps... | 03/01/1994 |
| 5199632 | Railway car body structures and methods of making them A method is provided for making a passenger car body structure which has a panel assembly forming at least part of a side, the roof, and end of the floorplate. Each panel has inner and outer spaced metal sheets and a cellular metal core brazed to the shee... | 04/06/1993 |
| 5163601 | Making a measuring chamber A method for making a gas chamber for photometric measuring equipment comprises providing a metal frame with recesses on opposite sides establishing a web and at least one opening in the web and having solder surface areas; providing at least two calcium ... | 11/17/1992 |
| 5129573 | Method for attaching through-hole devices to a circuit board using solder paste A process is disclosed from mounting through-hole components having closely-spaced electrical leads to a printed board (PCB) using solder paste. The process comprises applying conventional solder paste to alternating through-holes in an array of through-h... | 07/14/1992 |
| 4940180 | Thermally stable diamond abrasive compact body A method of producing a thermally stable diamond compact having a metal layer bonded to a surface thereof is provided. The thermally stable diamond compact comprises a mass of diamond particles containing diamond-to-diamond bonding and a second phase unif... | 07/10/1990 |
| 4872606 | Sealed structure and production method thereof In a sealed structure consisting of ceramic members opposing each other and a frame coupled to the ceramic members and defining an He-tight chamber with the ceramic members, the melting point of a joint member for bonding one of the ceramic members to the... | 10/10/1989 |
| 4860444 | Method of assembling a fluid-cooled integrated circuit package A package for enclosing, protecting and cooling semiconductor integrated circuit chips. The package includes a generally planar substrate with the chips positioned thereon. Signal connections are provided between at least some of the chips. A heat sink is... | 08/29/1989 |
| 4858818 | Method of bonding a magnetostrictive sheet to a shaft A method is provided for use with non-contacting torque sensors. Many torque sensors use a sheet of magnetostrictive material wrapped about the shaft whose torque is to be measured. The methods used to wrap and affix the sheet of magnetostrictive material... | 08/22/1989 |
| 4784310 | Method for screen printing solder paste onto a substrate with device premounted thereon A printing screen for screen printing fabrication substances such as solder paste has an aperture formed therein so that the screen may be placed on a substrate surface with a pre-mounted device extending through the aperture. A metal cap is bonded to the... | 11/15/1988 |
| 4739917 | Dual solder process for connecting electrically conducting terminals of electrical components to printed circuit conductors A method of providing improved electrical and physical connections between the electrically conducting terminals of an electronic component and the conductors of a printed circuit board by utilizing a high temperature solder material formed in mounds on d... | 04/26/1988 |
| 4700879 | Method for manufacturing semiconductor power modules with an insulated contruction A method for manufacturing insulated semiconductor power modules includes: presoldering a plurality of semiconductor sandwiches and a carrier unit including a metal base plate, ceramic insulating discs and connecting tabs with a high-melting solder in a f... | 10/20/1987 |
| 4684057 | Heat insulated cooking utensil Disclosed is a vacuum-heat-insulated cooking utensil and a method of manufacturing the same. Inner and outer containers are prepared each having a tubular side wall and an end wall closing the end of the side wall. The inner container is positioned in the... | 08/04/1987 |
| 4605154 | Radiator heater solder pouring process This is a process relating to improvements in the soldering of headers to conventional radiators. Tubular members of the radiator extend through holes in the header. The tubes are initially sealed to the header with a solder having a high temperature melt... | 08/12/1986 |
| 4600137 | Method and apparatus for mass soldering with subsequent reflow soldering An improved apparatus and method for mass soldering electrical and electronic components populating both the top and bottom surfaces of substrate circuit boards or the like in a single pass is described. The circuit boards pass through a mass soldering st... | 07/15/1986 |
| 4556240 | Corrosion-resistant, double-wall pipe structures In a corrosion-resistant, double-wall pipe structure formed by tightly fitting a stainless-steel inner pipe in an outer pipe, the inner pipe at any portion thereof which is liable to be adversely affected by heat due to heat processing is replaced by an i... | 12/03/1985 |
| 4515304 | Mounting of electronic components on printed circuit boards Mounting of leaded components on one side of a PCB and surface mounting components on the other side of the PCB creates problems. The pressure of the lead ends projecting through the PCB prevents the use of a mask for applying solder paste for the mountin... | 05/07/1985 |
| 4510171 | Clad metal joint closure A plasma arc spray overlay of cladding metals is used over joints between clad metal pieces to provide a continuous cladding metal surface. The technique permits applying an overlay of a high melting point cladding metal to a cladding metal surface withou... | 04/09/1985 |
| 4450611 | Method of manufacturing a blade wheel Method of manufacturing a blade wheel including setting a plurality of blades into a first jig, positioning an annular core member thereover with mating projections on the blades with slits on the core member, welding at the mating points, setting the sub... | 05/29/1984 |
| 4142664 | Method of joining titanium clad steel plates A method of butt welding titanium-clad steel plates whereby the steel portions of the abutting plates are first welded together, then the portions of the steel plates adjacent to the titanium portions are metallized with a refractory metal coating, which ... | 03/06/1979 |
| 4083484 | Process and apparatus for manufacturing flexible shielded coaxial cable There is disclosed a process and apparatus for manufacturing flexible, shielded coaxial cable exhibiting improved magnetical screening capabilities wherein a tubular outer conductor is concentrically formed about an inner conductor with spacer means being... | 04/11/1978 |
| 4073427 | Lined equipment with triclad wall construction An improved wall construction and method of fabrication is disclosed in which a wall assembly is comprised of a base metal layer of mild steel with a bonded intermediate layer of copper and a bonded layer of corrosion resistant material containing a fusio... | 02/14/1978 |
| 4053728 | Brazed joint between a beryllium-base part and a part primarily of a metal that is retractable with beryllium to form a brittle intermetallic compound A brazed joint between a beryllium-base part and a copper-base part comprises a first layer of brazing material in contact with the beryllium-base part. This brazing material is an alloy that just prior to brazing consists essentially of silver and a mino... | 10/11/1977 |
| 4050132 | Method of producing a housing for circular piston combustion engine of trochoid type A housing for circular piston combustion engines of trochoid type is produced with at least one annular shell having an inner peripheral wall in the shape of a multi-arcuate trochoid, an outer peripheral wall, and end walls parallel to each other and adjo... | 09/27/1977 |
| 4046304 | Process for producing metal composite material A metal composite material having an aluminium surface layer firmly bonded on a substrate material consisting of a metal other than aluminium is produced by cold pressure bonding the metal substrate material to an aluminium foil superimposed thereon, subj... | 09/06/1977 |
| 4043031 | Method of manufacturing internally cooled high-energy cable A cable includes a tubular multi-layer electric conductor, electric insulation surrounding the electric conductor, and an outer cable jacket surrounding the electric insulation. An inner tubular member of titanium or alloyed stainless steel is accommodate... | 08/23/1977 |
