Did You Know...
...that after Parker Brothers executives turned down the game of Monopoly because it had "52 fundamental errors" (including taking too long to play), a copy of the game wound up in the home of the company president who stayed up until 1 a.m. to finish playing it? He was so impressed by the game that the next day he wrote to inventor Charles Darrow and offered to buy it!
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| Number | Title | Issue Date |
| 8181845 | Electrical bond connection system An electrical bond connection system between a first electrical contact surface and a second electrical contact surface having at least one first electrical conductor, which is bonded to at least one of the contact surfaces via at least one first bond connection. At... | 05/22/2012 |
| 8152046 | Conductive bumps, wire loops, and methods of forming the same A method of forming a conductive bump is provided. The method includes the steps of: (1) bonding a free air ball to a bonding location using a bonding tool to form a bonded ball; (2) raising the bonding tool to a desired height, with a wire clamp open, while paying ... | 04/10/2012 |
| 8132709 | Semiconductor device and method for manufacturing same A semiconductor device comprises a semiconductor element having electrodes, a metal member, wires that electrically connect the semiconductor element and the metal member and/or electrodes within the semiconductor element, wherein the wires constitute at least a fir... | 03/13/2012 |
| 8123108 | Method of manufacturing semiconductor device and wire bonding apparatus A terminal of a compact wire loop with a great strength of bonding is formed by a method including: a first folding step in which a tip end of a capillary is raised by a height of H1 from a point 86a where the center of the capillary is posi... | 02/28/2012 |
| 8100317 | Method of teaching eyepoints for wire bonding and related semiconductor processing operations A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one ... | 01/24/2012 |
| 8042725 | Wire bonding method, wire bonding apparatus, and wire bonding control program The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even with the low loop shape. After having formed a contact-bonded ball at a... | 10/25/2011 |
| 8016182 | Wire loop, semiconductor device having same and wire bonding method A wire loop includes a wire connecting a first bonding point and a second bonding point therethrough, wherein an additional wire loop is formed after wire bonding at the second bonding point without cutting the wire and the additional wire loop is bonded to the seco... | 09/13/2011 |
| 8016183 | Adjustable clamp system and method for wire bonding die assembly A method and an adjustable clamp system for clamping a die assembly during wire bonding. The system includes at least one pair of opposing base walls, each of the base walls has a base clamping surface. There is at least one pair of clamping members, each one of the... | 09/13/2011 |
| 7975901 | Bonding apparatus and wire bonding method A bonding apparatus including a chamber for maintaining an inert gas atmosphere; a first plasma torch for performing a surface treatment on pads and electrodes, the first plasma torch being attached in the chamber, to apply gas plasma to a substrate and a semiconduc... | 07/12/2011 |
| 7934634 | Wire bonding method A wire bonding method with the process of performing a first bonding to a pad of a die that is a first bond point, and the process of performing a second bonding to an interconnect wiring (or a lead) that is a second bond point, thus connecting the pad and the inter... | 05/03/2011 |
| 7931186 | Method of teaching eyepoints for wire bonding and related semiconductor processing operations A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one ... | 04/26/2011 |
| 7926698 | Spot heat wirebonding Methods and systems are disclosed for forming secure wirebonds between electrical contacts in electronic device assemblies. Representative embodiments of the invention are described for forming a wirebond including system components and method steps for generating e... | 04/19/2011 |
| 7909233 | Method of manufacturing a semiconductor package with fine pitch lead fingers A method for manufacturing a semiconductor package system includes: providing a die having a plurality of contact pads; forming a leadframe having a plurality of lead fingers with flat tops of predetermined lengths, the plurality of lead fingers having a fine pitch ... | 03/22/2011 |
| 7854368 | Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect. ... | 12/21/2010 |
| 7815095 | Wire loop, semiconductor device having same and wire bonding method A wire loop comprises a wire connecting a first bonding point and a second bonding point therethrough, wherein the wire includes a ball bonded to the first bonding point, a neck portion adjacent to the ball and a major portion extending from the neck portion to the ... | 10/19/2010 |
| 7810703 | Wire bonding method A wire bonding apparatus includes a heat block and a heat plate provided on the heat block. A recess is provided in the heat plate to receive the first semiconductor chip and wires without contact therewith when the lead frame is provided on the heat plate such that... | 10/12/2010 |
| 7789289 | Holding tool for fixing an electronic component and circular table manufacturing unit A holding tool for fixing an electronic component (2) during a manufacturing process, the electronic component (2) comprising a winding assembly (20) and an electronic circuit (24), wherein the holding tool (1) includes a holding t... | 09/07/2010 |
| 7780064 | Wire bonding method for forming low-loop profiles A method of forming a wire bond with a bonding tool is provided that comprises the steps of forming a ball bond onto a bonding surface, raising the bonding tool away from the ball bond to form a neck portion integrated with a top of the ball bond, locating a circumf... | 08/24/2010 |
| 7770779 | Guide wire A guide wire includes a wire member having a first wire disposed on the distal side of the guide wire, and a second wire disposed on the proximal side from the first wire. The second wire is made from a material having an elastic modulus larger than that of the firs... | 08/10/2010 |
| 7762449 | Bond head for heavy wire bonder A bonding apparatus for bonding a length of wire comprises a first module which is drivable along a linear axis towards and away from a bonding point and a second module slidably mounted to the first module. A wire cutter is mounted to the first module and a bonding... | 07/27/2010 |
| 7748599 | Wire bonding method, wire bonding apparatus, and wire bonding control program The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even with the low loop shape. After having formed a contact-bonded ball at a... | 07/06/2010 |
| 7735716 | Method of controlling the trajectory of a bonding tool during the formation of a wire loop A method of determining a trajectory of an arc motion of a wire used in the formation of a wire loop is provided. The arc motion is between a first point and a second point of the trajectory. The method includes: (1) defining a pivot point with respect to the first ... | 06/15/2010 |
| 7731078 | Semiconductor system with fine pitch lead fingers A semiconductor package system includes providing a die having a plurality of contact pads. A leadframe is formed having a plurality of lead fingers with the plurality of lead fingers having a fine pitch and each having a substantially trapezoidal cross-section. A p... | 06/08/2010 |
| 7677432 | Spot heat wirebonding Methods and systems are disclosed for forming secure wirebonds between electrical contacts in electronic device assemblies. Representative embodiments of the invention are described for forming a wirebond including system components and method steps for generating e... | 03/16/2010 |
| 7665652 | Electronic devices including metallurgy structures for wire and solder bonding Metallurgy structures for input/output pads of an electronic devices can be adapted to receive both solder and wire bonds. First and second metallurgy structures, for example, can be provided on respective first and second input/output pads of an electronic device s... | 02/23/2010 |
| 7661576 | Wire bonding method A wire bonding method that connects a first bonding point and a second bonding point by a wire, the method including a step that press-bonds a ball formed on a tip end of a wire to a first bonding point, thus forming a press-bonded ball; a step that slightly raises ... | 02/16/2010 |
| 7658314 | Tail wire cutting method and bonding apparatus A tail wire cutting method and bonding apparatus executing the same, in which a capillary raised to a predetermined height and a clamper disposed above the capillary and gripping a wire are caused to make reciprocating oscillation movement on, for instance, a circul... | 02/09/2010 |
| 7654436 | Wire bonding system utilizing multiple positioning tables A wire bonding apparatus and method in which separate first and second positioning tables are provided for mounting electronic devices to be wire bonded, and a bonding tool is provided at a bonding position for bonding the electronic devices. First and second loadin... | 02/02/2010 |
| 7651022 | Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine The present invention is a method and apparatus for forming a bump for semiconductor interconnect applications, such as reverse wire bonding or stud bumping for flip chip interconnections. The bump is formed by (1) ball bonding at the bump site, (2) raising the capi... | 01/26/2010 |
| 7637414 | Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An... | 12/29/2009 |
| 7621436 | Wire bonding method A wire bonding method including the steps of: descending a capillary 5 from above an external lead 1 to press a wire 10 to such an extent that the wire is not completely connected to the external lead 1, thus forming a thin part 16... | 11/24/2009 |
| 7617966 | Semiconductor device A wire bonding method that connects a first bonding point and a second bonding point by a wire, the method including a step that press-bonds a ball formed on a tip end of a wire to a first bonding point, thus forming a press-bonded ball; a step that slightly raises ... | 11/17/2009 |
| 7614540 | Thermal insulation for a bonding tool A bonding apparatus comprising a bond arm and a wire bonding tool mounted to the bond arm is provided with thermal insulation in the form of a thermal shield substantially enclosing the bonding tool for insulating the bonding tool from ambient heat. ... | 11/10/2009 |
| 7607561 | Guide wire A guide wire includes a wire member having a first wire disposed on the distal side of the guide wire, and a second wire disposed on the proximal side from the first wire. The second wire is made from a material having an elastic modulus larger than that of the firs... | 10/27/2009 |
| 7584881 | Low loop height ball bonding method and apparatus In accordance with the invention, a bump is formed on top of a die bond pad by forming a ball bond there. Then, without severing the wire, the capillary undergoes a set of coordinated motions to fold the wire on top of the ball bond. The wire is then bonded on top o... | 09/08/2009 |
| 7578425 | Wirebonding method and apparatus A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping m... | 08/25/2009 |
| 7549568 | Method of forming identification code for wire-bonding machines A method of forming an identification code for wire bonders is revealed. Firstly, a chip with a plurality of bonding pads is provided and is disposed on a chip carrier with a plurality of bonding fingers. A binary-code baseline is defined on the chip carrier to divi... | 06/23/2009 |
| 7494042 | Method of forming low wire loops and wire loops formed using the method A method of bonding wire between first and second bonding points with a bonding tool, such as a capillary, is disclosed. A first bond is formed at the first bonding point with the bonding tool, and further steps include moving the bonding tool away from the first bo... | 02/24/2009 |
| 7481351 | Wire bonding apparatus and method for clamping a wire A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming ope... | 01/27/2009 |
| 7475802 | Method for low loop wire bonding A method is provided for low loop wire bonding. The method includes forming a first bond between a first bonding ball disposed at an end of a first wire and a bond pad of a die coupled to a leadframe having one or more leads. The method also includes forming a secon... | 01/13/2009 |
