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| Number | Title | Issue Date |
| 8127979 | Electrolytic depositon and via filling in coreless substrate processing Electronic assemblies including coreless substrates and their manufacture using electrolytic plating, are described. One method includes providing a core comprising a metal, and forming a dielectric material on the core. The method also includes forming vias in the ... | 03/06/2012 |
| 8104666 | Thermal compressive bonding with separate die-attach and reflow processes A method of bonding includes providing a first work piece, and attaching a second work piece on the first work piece, with a solder bump disposed between the first and the second work pieces. The second work piece is heated using a heating head of a heating tool to ... | 01/31/2012 |
| 8096464 | Solder-bearing articles and method of retaining a solder mass along a side edge thereof A method and device for depositing a solder mass within a plated opening that is formed in a side edge of an electronic device includes the steps of carrying the solder mass in a carrier device and orienting the carrier device with respect to the side edge such that... | 01/17/2012 |
| 8087566 | Techniques for arranging solder balls and forming bumps A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed int... | 01/03/2012 |
| 8083123 | Method for manufacturing a printed wiring board A method of manufacturing a printed wiring board having at least one solder bump includes forming a solder resist layer on a conductor layer. The solder resist layer has at least one opening that exposes a connection pad of the conductor layer, and the at least one ... | 12/27/2011 |
| 8070048 | Method of attaching a solder ball and method of repairing a memory module In a method of attaching a solder ball, a first material is coated on a solder ball. A second material is coated on a pad of a substrate where the solder ball is to be attached to exothermically react with the first material. The solder ball makes contact with the p... | 12/06/2011 |
| 8061583 | Ball mounting apparatus and method A device for mounting an array of solder balls to a plurality of substrates of integrated circuits, comprising: a first plate for receiving a first substrate in a loading position; said first plate adapted to translate laterally from a substrate loading position to ... | 11/22/2011 |
| 8052035 | Method and mask assembly for forming solder bodies on a substrate A method for forming solder bodies on a substrate includes: positioning a first mask plate, which is formed with at least one first through-hole, on the substrate; filling the first through-hole with a first solder paste so as to form a first solder body on the subs... | 11/08/2011 |
| 8042724 | Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate A method is provided for making an electrical connection with a microelectronic component arranged on or embedded within a surface of a circuit board layer or a substrate. The microelectronic component has an electrical contact face that is accessible on a surface o... | 10/25/2011 |
| 8033446 | Manufacturing method of solid-state image pickup device After a wiring substrate having, on its lower surface, an opening and terminals arranged therearound is provided, a sealing material is supplied to the lower surface of the wiring substrate, and a sensor chip is flip-chip mounted on the lower surface of the wiring s... | 10/11/2011 |
| 8025205 | Electronic component mounting method By an electronic component mounting method for electrically connecting bumps to board electrodes, in a contact process for placing a thermosetting resin in a liquid glob state on the board surface and bringing the lower surface of the electronic component into conta... | 09/27/2011 |
| 7954693 | Method of treating and probing a via A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern of a ... | 06/07/2011 |
| 7946470 | Method for depositing solder material on an electronic component part using separators A method for accurately depositing a required volume of solder material on a specific area of a lead frame, substrate or other part of an electronic component to be bonded by reflow of solder material to another part into a reliable, void-free connection during a su... | 05/24/2011 |
| 7938311 | Method for hybridization of two components by using different sized solder protrusions and a device that uses two components hybridized according to this method The hybridization method provides a first component with first pads and a second component with second pads for accommodating protrusions of a fusible material, so that the first pads and second pads line up two by two in order to form pairs of pads to interconnect ... | 05/10/2011 |
| 7926697 | Underfill formulation and method of increasing an adhesion property of same An underfill formulation includes a solvent (110), a plurality of amphiphilic block copolymers (120) in the solvent, and an adhesion promoter (130) in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micel... | 04/19/2011 |
| 7900809 | Solder interconnection array with optimal mechanical integrity A method for assembling, and the resultant electronic module, includes attaching a chip to a substrate using a first solder interconnection array, and attaching a board to the substrate using a second solder interconnection array, which may be a single-melt or a dua... | 03/08/2011 |
| 7891538 | Techniques for arranging solder balls and forming bumps A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed int... | 02/22/2011 |
| 7886957 | Method of bonding probes and method of manufacturing a probe card using the same In a method of manufacturing bonding probes, bump layer patterns are formed on terminals of a multi-layered substrate. A first wetting layer pattern having a wettability with respect to a solder paste, and a non-wetting layer pattern having a non-wettability with re... | 02/15/2011 |
| 7878385 | Probe arrays and method for making Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent subst... | 02/01/2011 |
| 7866534 | Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method There is provided a conductive ball mounting apparatus. The conductive ball mounting apparatus includes: a conductive ball mounting mask disposed to oppose a substrate having a plurality of pads coated with an adhesive flux, the conductive ball mounting mask having ... | 01/11/2011 |
| 7854366 | Method of mounting conductive ball and conductive ball mounting apparatus A method of mounting a conductive ball according to the present invention includes the steps of, disposing a mask on a substrate including connection pads, the mask having opening portions corresponding to the connection pad, supplying conductive balls on the mask, ... | 12/21/2010 |
| 7854367 | Apparatus and method for arranging magnetic solder balls An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a magnet which is incorporated in the stage and is movable in parallel with a lower surface of the placed and fixed substrate so as to cause a magnetic f... | 12/21/2010 |
| 7810702 | Solder standoffs for injection molding of solder A method of producing standoffs in an injection molded solder (IMS) mold, which possesses cavities, each of which is filled with a solder paste using standard techniques, such as screening or IMS. This solder paste is heated to a reflow temperature at which the sold... | 10/12/2010 |
| 7793818 | Semiconductor device, manufacturing method and apparatus for the same A highly reliable semiconductor chip electrode structure allowing control of interface reaction of bonding sections even in the case of using two- or three-element solder used conventionally is disclosed. A solder alloy making layer for preventing dissolving and dif... | 09/14/2010 |
| 7784671 | Apparatus and method for arranging magnetic solder balls An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a magnet which is incorporated in the stage and is movable in parallel with a lower surface of the placed and fixed substrate so as to cause a magnetic f... | 08/31/2010 |
| 7780063 | Techniques for arranging solder balls and forming bumps A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities Substantially one ball is dispensed into... | 08/24/2010 |
| 7743964 | Bonding apparatus and bonding method A bonding apparatus (10) that bonds an electrode of a semiconductor die (12) and an electrode of a circuit board (19) using a metal nano paste includes a bump formation mechanism (20) that forms bump by injecting microdroplets of a metal ... | 06/29/2010 |
| 7731077 | Structure and method to gain substantial reliability improvements in lead-free BGAs assembled with lead-bearing solders Methods of forming and assemblies having hybrid interconnection grid arrays composed of a homogenous mixture of Pb-free solder joints and Pb-containing solder paste on corresponding sites of a printed board. The aligned Pb-free solder joints and Pb-containing solder... | 06/08/2010 |
| 7726545 | Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei A flip chip mounting process or a bump-forming process according to the present invention is characterized in that electrically-conductive particles are fixed on electrodes formed on an electronic component. A composition comprising solder powder, a convection addit... | 06/01/2010 |
| 7726546 | Bonding apparatus and bonding method A bonding apparatus (10) that bonds an electrode of a semiconductor die (12) and an electrode of a circuit board (19) using a metal nano paste includes a bump formation mechanism (20) that forms bump by injecting microdroplets of a metal ... | 06/01/2010 |
| 7726544 | Method of packaging flip chip and method of forming pre-solders on substrate thereof A method of forming pre-solders on a substrate is provided. Firstly, a substrate is provided. The substrate includes an upper surface and a lower surface. There are several metal circuits and a solder mask both on the upper and the lower surfaces. Each solder mask c... | 06/01/2010 |
| 7712652 | Component mounting apparatus and component mounting method First components and second components in which bumps are formed on the lower surface thereof and laminate structures are formed by mounting them to stack with each other on a circuit board 13 are picked up from a component supply unit 1 using a placem... | 05/11/2010 |
| 7694869 | Universal mold for injection molding of solder A system, method, and device for applying conductive bonding material to a substrate are disclosed. The method includes providing conductive bonding material in a plurality of cavities of a mold. A total number of cavities in the plurality of cavities being greater ... | 04/13/2010 |
| 7651020 | Amphiphilic block copolymers for improved flux application Embodiments include materials which may be used during electronic device fabrication, including a flux material. The flux material comprises a solution including a plurality of micellar structures in a solvent, the micellar structures each including a plurality of a... | 01/26/2010 |
| 7651021 | Microball attachment using self-assembly for substrate bumping Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate with a plurality of bonding pads thereon, and providing a plurality of solder microballs, the microballs including a coating thereon. The metho... | 01/26/2010 |
| 7611040 | Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition A method for forming solder bumps for realizing high density mounting and a highly reliable method for mounting a semiconductor device is provided. A flat plate having a plurality of projections or recesses thereon is prepared; the flat plate is aligned to oppose an... | 11/03/2009 |
| 7611041 | Semiconductor device, manufacturing method and apparatus for the same A highly reliable semiconductor chip electrode structure allowing control of interface reaction of bonding sections even in the case of using two- or three-element solder used conventionally is disclosed. A solder alloy making layer for preventing dissolving and dif... | 11/03/2009 |
| 7600667 | Method of assembling carbon nanotube reinforced solder caps A method of making a carbon nanotube reinforced solder cap. Carbon nanotube-solder (CNT-S) particles are transferred from a transfer substrate, having an adhesive layer, to a solder bump by using thermo compression bonding. The CNT-S particles are then reflowed to f... | 10/13/2009 |
| 7575150 | Flux composition for solder, solder paste, and method of soldering Soldering flux compositions, solder pastes, and methods of soldering using the same are provided, that exhibit excellent wettability, give highly reliable solder joints, and have superior storage stability. The flux composition contains at least one compound having ... | 08/18/2009 |
| 7568610 | Method of soldering electronic component having solder bumps to substrate A method of soldering electronic component (6) having solder bumps (7) formed thereon to substrate (12), wherein bumps (7) are pressed against a flux transferring stage on which a thin film is formed of flux (10) containing metal p... | 08/04/2009 |
