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| Number | Title | Issue Date |
| 7669752 | Flux for soldering and circuit board A flux contains resin having film forming ability, activator, solvent and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plati... | 03/02/2010 |
| 7581668 | Method and device for reflow soldering with volume flow control According to one aspect of the invention it is possible to rapidly heat a soldering item by reducing an initially larger volume flow at a constant or increasing temperature, effectively preventing small components from overheating. By using the volume flow of a conv... | 09/01/2009 |
| 7556190 | Method and device for mounting electric component A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive ... | 07/07/2009 |
| 7467742 | Electrically conducting adhesives for via fill applications Electrically conducting adhesives having a broader selectable range of properties are provided by having random sizes of micrometer diameter range particles coated with a low melting temperature metal. The coated particles are suspended in a vehicle of a mixture of ... | 12/23/2008 |
| 7419084 | Mounting method for surface-mount components on a printed circuit board A method for surface mount solder of a comparatively large component is provided wherein a first intermediate component is soldered to a printed wring board and a larger second component is positioned and soldered to the printed wiring board using the intermediate c... | 09/02/2008 |
| 7416106 | Techniques for creating optimized pad geometries for soldering A technique for processing a circuit board involves placing a mask layer on the circuit board, where the mask layer defines a set of pad profiles for a component mounting location. Each pad profile has a set of rounded corners. The technique further involves forming... | 08/26/2008 |
| 7407084 | Method for mounting a semiconductor chip onto a substrate A method for mounting a semiconductor chip onto a substrate the side of which facing towards the substrate is coated with an adhesive layer is characterised by the following steps: (1) Lowering the semiconductor chip until the semiconductor chip touches... | 08/05/2008 |
| 7383977 | Method for attaching a shield can to a PCB and a shield can therefor A method for providing a PCB (printed circuit board) with a shield can (1) comprising a metal shell with a free rim (5). The method prescribes that the rim (5) of the shield can (1) is provided with an extra amount of solder (8) be... | 06/10/2008 |
| 7378297 | Methods of bonding two semiconductor devices A device and a method for bonding elements are described. A first solder ball is produced on a main surface of a first element. A second solder ball is produced on a main surface of a second element. Contact is provided between the first solder ball and the second s... | 05/27/2008 |
| 7362562 | Electronic unit of radio system and method of producing the same The invention relates to a method of producing an electronic unit of a radio system automatically, an electronic unit of a radio system and an electronic component. The method of producing an electronic unit of a radio system automatically comprises mounting (802... | 04/22/2008 |
| 7360307 | Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure includes non-conductive material defining a top surface of the circuit ... | 04/22/2008 |
| 7357293 | Soldering an electronics package to a motherboard In some example embodiments, a method includes engaging a first contact on a motherboard with a second contact on an electronic package. A portion of one of the first and second contacts is covered with an interlayer that has a lower melting temperature than both of... | 04/15/2008 |
| 7357294 | Method for mounting a semiconductor package onto PCB A method for mounting a semiconductor package onto PCB includes a semiconductor package comprising a plurality of outer terminals exposed out of an encapsulant. A PCB having a surface with a plurality of contact pads is provided. Each contact pad has a first exposed... | 04/15/2008 |
| 7358445 | Circuit substrate and apparatus including the circuit substrate The present invention provides a circuit substrate which has a substrate including a first surface and a second surface opposite to the first surface. A first and a second conductor patterns are formed on the first and the second surface respectively. The second sur... | 04/15/2008 |
| 7357288 | Component connecting apparatus When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection... | 04/15/2008 |
| 7351361 | Conductive particles, conductive composition, electronic device, and electronic device manufacturing method A conductive composition layer, conductive particles as a raw material, a conductive composition therefor, a manufacturing method of the conductive composition layer, etc. are provided wherewith heat conductance can be accelerated between electronic devices or elect... | 04/01/2008 |
| 7351072 | Memory module, memory extension memory module, memory module system, and method for manufacturing a memory module A memory extension memory module, a memory module system, and a memory module is disclosed. The memory module including at least one memory device and a connector for connecting the memory module to a computer system, wherein the memory module additionally includes ... | 04/01/2008 |
| 7347349 | Apparatus and method for printing micro metal structures A method and device for printing liquid material such as liquid solder is provided. C4 structures as small as 10 microns in diameter can be produced using devices and methods described above. Further, devices and methods provided are able to operate at temperatures ... | 03/25/2008 |
| 7347354 | Metallic solder thermal interface material layer and application of the same A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert c... | 03/25/2008 |
| 7344060 | Apparatus and method for aligning solder pads during head gimbal assembly soldering A device for orienting an integrated lead suspension tail during a head gimbal assembly soldering operation of a head stack assembly process is disclosed. The device includes a body portion and at least one pin extending from the body portion. The pin(s) is configur... | 03/18/2008 |
| 7342409 | System for testing semiconductor components A system for testing semiconductor components includes an interconnect, an alignment system for aligning a substrate to the interconnect, a bonding system for bonding the component to the interconnect, and a heating system for heating the component and the interconn... | 03/11/2008 |
| 7337534 | SMD chip handling apparatus The apparatus is for securely fetching and positioning an SMD chip on a printed circuit board and soldering the same to the board. Two spring plates form the clasping fingers which are wedged apart to a width larger than the width of the SMD chip by an expander form... | 03/04/2008 |
| 7331500 | Solder bumps formation using solder paste with shape retaining attribute Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially retain their geometric shape upon exposure to electromagnetic radiation.... | 02/19/2008 |
| 7332411 | Systems and methods for wafer bonding by localized induction heating A system and method bond wafers using localized induction heating. One or more induction micro-heaters are formed with a first substrate to be bonded. A second substrate is positioned in intimate contact with the induction micro-heaters. An alternating magnetic fiel... | 02/19/2008 |
| 7332424 | Fluxless solder transfer and reflow process Disclosed is a new process that permits the transfer and reflow of solder features produced by Injection Molded Solder (IMS) from a mold plate to a solder receiving substrate without the use of flux. Several embodiments produce solder transfer and reflow separately ... | 02/19/2008 |
| 7328830 | Structure and method for bonding to copper interconnect structures An integrated circuit structure and a method for fabricating the structure. The method comprises forming a copper bond pad for attaching the integrated circuit to a package. Copper oxide is removed from the pad by reduction in a hydrogen ion atmosphere. For attachin... | 02/12/2008 |
| 7325716 | Dense intermetallic compound layer Apparatus and methods of fabricating a bump limiting metallization structure including a two-step bump reflow process that reduces intermetallic compound porosity, increases bump strength, improve die yield, and device reliability. The first step comprises annealing... | 02/05/2008 |
| 7322511 | Apparatus and method for printing micro metal structures A method and device for printing liquid material such as liquid solder is provided. C4 structures as small as 10 microns in diameter can be produced using devices and methods described above. Further, devices and methods provided are able to operate at temperatures ... | 01/29/2008 |
| 7320426 | Cover for ball-grid array connector A presently-preferred embodiment of a cover for a ball-grid array connector comprises a top member and a first and a second side member adjoining opposing ends of the top member. The first and the second side members each have a mating feature formed thereon for eng... | 01/22/2008 |
| 7316062 | Solder extraction tool and method Methods and apparatus are provided for removing plating from a device. The method and apparatus may be used for preparing an electrical connector for connecting at least one wire or other terminus thereto where the electrical connector has at least one electrical co... | 01/08/2008 |
| 7317165 | Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate An intermediate substrate comprising: an intermediate substrate body containing an insulating material, and having a first face to be mounted with an semiconductor element and a second face opposing to said first face; and a semiconductor element mounting area inclu... | 01/08/2008 |
| 7301103 | Printed-wiring board, printed-circuit board and electronic apparatus A printed-wiring board having a multiplayer structure including a plurality of insulating layers and a plurality of conducting layers includes a signal pattern provided in at least one of outermost layers of the conducting layers which includes a plurality of pad po... | 11/27/2007 |
| 7291549 | Method and structure to reduce risk of gold embrittlement in solder joints A method for reducing gold embrittlement in solder joints, and a copper-bearing solder according to the method, are disclosed. Embodiments of the invention comprise adding copper to non-copper based solder, such as tin-lead solder. The embodiments may further compri... | 11/06/2007 |
| 7288845 | Fabrication of wire bond pads over underlying active devices, passive devices and/or dielectric layers in integrated circuits A wire connection structure for an integrated circuit (IC) die includes a semiconductor wafer with an active device and/or a passive device. One or more dielectric layers are arranged adjacent to the active and/or passive device. One or more metal interconnect layer... | 10/30/2007 |
| 7288742 | Method and device for heating a strip-shaped carrier According to a method and a device for heating a strip-shaped carrier in an oven, a carrier is passed through the oven in a direction of conveyance. The carrier is supported by a heatable plate, which together with the carrier is moved through the oven stepwise with... | 10/30/2007 |
| 7284941 | Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape A method and apparatus for picking up a semiconductor chip, a method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape are provided. Air may be blown through air holes in a dicing tape to at least pa... | 10/23/2007 |
| 7285018 | Electrical connector incorporating passive circuit elements An electrical connector that electrically connects a first printed circuit board and a second printed circuit board is disclosed, where the electrical connector in the preferred embodiment includes: (a) an insulative housing; (b) a plurality of signal conductors, wi... | 10/23/2007 |
| 7271497 | Dual metal stud bumping for flip chip applications A method for forming a stud bumped semiconductor die is disclosed. The method includes forming a ball at the tip of a coated wire passing through a hole in a capillary, where the coated wire has a core and an oxidation-resistant coating. The formed ball is pressed t... | 09/18/2007 |
| 7267558 | Electrical connector with contact An electrical connector includes an insulative housing adapted to engage a conductive contact (20). The conductive contact has a tail end, wherein the tail end (22) is angled and has a generally dished shape such that at least a portion of the tail end... | 09/11/2007 |
| 7264482 | Anisotropic conductive sheet An anisotropic conductive sheet capable of transmitting high-speed digital signals reliably is provided. The anisotropic conductive sheet has a conductive property in a thickness direction thereof under a predetermined condition, and includes: insulative matrix memb... | 09/04/2007 |