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| Number | Title | Issue Date |
| 7427423 | Components with conductive solder mask layers A method of fabricating solder assemblies for forming solder connections that include a dielectric base having a non solder-wettable surface, a plurality of solder-wettable pads exposed to said surface, and an electrically conductive potential plane element having a... | 09/23/2008 |
| 7410090 | Conductive bonding material fill techniques A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit sup... | 08/12/2008 |
| 7361983 | Semiconductor device and semiconductor assembly module with a gap-controlling lead structure In a semiconductor device (1), semiconductor elements (2) and (3) are mounted on a lead frame (5) having leads (4). The semiconductor elements (2) and (3) are connected with the leads (4) by metallic wires (... | 04/22/2008 |
| 7358118 | Mounting method of flexible printed circuit and manufacturing method of electric optical device Aspects of the current invention are directed to a method of mounting a flexible printed circuit and a manufacturing method of an electric optical device. Each of the methods form semiconductor elements and first terminal portions for electrically connecting the sem... | 04/15/2008 |
| 7357291 | Solder metal, soldering flux and solder paste Solder metal consists essentially of 8.8 to 5.0 mass % of Zn, 0.05 to 0 mass % of Bi and the balance of Sn and unavoidable impurities. ... | 04/15/2008 |
| 7357288 | Component connecting apparatus When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection... | 04/15/2008 |
| 7359207 | Laminated printed circuit board fixture assembly and method A fixture assembly for holding printed circuit boards (PCBAs) during processing such as wave soldering. The fixture assembly consists of multiple plates which are assembled to define protective cavities and recesses for masking components such as surface mounted dev... | 04/15/2008 |
| 7350684 | Apparatus and method for forming bump A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal... | 04/01/2008 |
| 7345361 | Stackable integrated circuit packaging A system may include an integrated circuit die, an integrated circuit package coupled to the integrated circuit die, mold compound in contact with the integrated circuit die and the integrated circuit package, and an interconnect coupled to the integrated circuit pa... | 03/18/2008 |
| 7319276 | Substrate for pre-soldering material and fabrication method thereof A substrate for a pre-soldering material and a fabrication method of the substrate are proposed. The substrate having at least one surface formed with a plurality of conductive pads is provided. An insulating layer is formed over the surface of the substrate in such... | 01/15/2008 |
| 7311240 | Electrical circuits with button plated contacts and assembly methods Exemplary methods for making a solder joint between two articles are disclosed. The method includes the steps of positioning a first article and a second article to be soldered together. At least one of the first article and the second article has at least one butto... | 12/25/2007 |
| 7311241 | Method of mounting terminal on printed board, terminal mounted printed board and electric connection box accommodating the terminal mounted printed board, which are formed by the method A printed board is arranged above solder blowing nozzles of a spot flow soldering apparatus with first terminal groups facing upward, second terminal groups projected toward the solder blowing nozzles are shielded by shield jigs, solder jetted from the solder blowin... | 12/25/2007 |
| 7308129 | Characteristic amount calculating device for soldering inspection A characteristic amount calculating device for soldering inspection. The characteristic amount calculating device includes a design information inputting section for inputting design information of an inspection object, an inspection standard inputting section for i... | 12/11/2007 |
| 7292744 | Optical connection device and optoelectronic hybrid apparatus including the same An optical connection device includes: a substrate; an optical waveguide provided in the substrate; and plural optical connection ports provided in the optical waveguide and having at least one of a light output port and a light input port, the light output port out... | 11/06/2007 |
| 7291565 | Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid A method and system is described for treating a substrate with a high pressure fluid, such as carbon dioxide in a supercritical state. A process chemistry is introduced to the high pressure fluid for treating the substrate surface. The process chemistry comprises fl... | 11/06/2007 |
| 7287685 | Structure and method to gain substantial reliability improvements in lead-free BGAs assembled with lead-bearing solders Methods of forming and assemblies having hybrid interconnection grid arrays composed of a homogenous mixture of Pb-free solder joints and Pb-containing solder paste on corresponding sites of a printed board. The aligned Pb-free solder joints and Pb-containing solder... | 10/30/2007 |
| 7271484 | Substrate for producing a soldering connection A solderable device includes a substrate and a soldering pad overlying the substrate. A solder mask overlies the substrate and portions of the soldering pad. The solder mask has an opening that exposes a portion of the soldering pad. The opening has at least two edg... | 09/18/2007 |
| 7263755 | Method for the manufacture of fillings for utilization in the mechanical processing of aqueous paper fiber stock A method for fabricating fillings that are utilized in refiners for the purpose of refining paper fiber stock. The filling manufactured in accordance with the method of the present invention includes a base body, an overlay template on the base body and processing e... | 09/04/2007 |
| 7263769 | Multi-layered flexible print circuit board and manufacturing method thereof A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit layers via the insulating layer, wherein there is provided an electri... | 09/04/2007 |
| 7260890 | Methods for fabricating three-dimensional all organic interconnect structures The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided liquid crystalline polymer LCP where both the high and low temperature LCP are drilled to form a z-ax... | 08/28/2007 |
| 7258839 | Temperature controlled microfabricated two-pin liquid sample dispensing system A cooled liquid sample dispensing system comprises a pair of pins for holding a droplet of liquid therebetween and a cooling element. Each pin includes a tip spaced predetermined distance from the other pin to define a sample acquisition region. The pins acquire and... | 08/21/2007 |
| 7255772 | High pressure processing chamber for semiconductor substrate A high pressure chamber comprises a chamber housing, a platen, and a mechanical drive mechanism. The chamber housing comprises a first sealing surface. The platen comprises a region for holding the semiconductor substrate and a second sealing surface. The mechanical... | 08/14/2007 |
| 7251880 | Method and structure for identifying lead-free solder A method and apparatus are provided for determining whether solder used during assembly of a printed circuit board is lead-free or not. This may include providing a pad on the printed circuit board and placing solder on the pad in a predetermined pattern. The solder... | 08/07/2007 |
| 7250374 | System and method for processing a substrate using supercritical carbon dioxide processing A method and system for processing a substrate in a film removal system. The method includes providing the substrate in a substrate chamber of a film removal system, where the substrate has a micro-feature containing a dielectric film on a sidewall of the micro-feat... | 07/31/2007 |
| 7241348 | Flux for solder paste and solder paste A flux for solder paste contains a dicarboxylic acid of carbon number 3 to 5 and a dicarboxylic acid of carbon number 15 to 20 as an activator, which prevents skinning or changes by aging of viscosity. In actual use, the solder paste of the present invention can mai... | 07/10/2007 |
| 7238919 | Heating element movement bonding method for semiconductor components According to an aspect of the present invention, there is provided a bonding method, comprising disposing on a first body a second body with a bump interposed therebetween; and electrically and mechanically bonding the first body and the second body with the bump by... | 07/03/2007 |
| 7230515 | Package for parts for LAN and pulse transformer module for LAN A resin-made base body 1 has first recessed portions 11 and 12 for respectively accommodating a plurality of pulse transformers as well as second recessed portions 13 and 14 for accommodating common mode choke coils which are respe... | 06/12/2007 |
| 7216794 | Bond capillary design for ribbon wire bonding A device (100) and method (200) for bonding a ribbon wire (104) to a workpiece (106) comprising feeding the ribbon wire through a passageway (116) of an ultrasonic bond capillary (102) and clamping the ribbon wire against an... | 05/15/2007 |
| 7213738 | Selective wave solder system The present invention relates to a selective wave solder machine. In particular, it relates to a system for calibrating and adjusting process points to account for variations in machines and circuit boards. Vision systems are used to locate fiducials on the processi... | 05/08/2007 |
| 7206516 | Apparatus and method for measuring the dispersion of a fiber span The invention pertains to optical fiber transmission systems, and is particularly relevant to transmission of large volumes of data over long distances at high rates. An improved apparatus and method for measuring dispersion in a fiber span is disclosed. In particul... | 04/17/2007 |
| 7199329 | Method of soldering semiconductor part and mounted structure of semiconductor part A semiconductor part 1 in which a metal terminal 2 is formed on its back surface and side surface is mounted so that only the back surface portion of the metal terminal 2 is in contact with a cream solder 3. When the side surface portion ... | 04/03/2007 |
| 7197819 | Method of assembling an electric power A method of assembling and providing an electric power apparatus. The method uses a heat resistant housing having a structure adapted to accommodate and retain a power circuit card and also including a bracket adapted to accommodate and constrain a rigid conductive ... | 04/03/2007 |
| 7195145 | Electrical circuit apparatus and method for assembling same A method for assembling an electrical circuit apparatus that includes; a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture; a heat sink; and an adhesive layer for mechanically coupling the heat sink to the g... | 03/27/2007 |
| 7186049 | Pin to thin plate joint and method for making the joint A pin to plate joint and method of making the joint comprising a plate comprising an entry side and an exit side with the plate defining cutouts, and the pin movable through the plate from the entry side to the exit side and in doing so pushes tab members at angles ... | 03/06/2007 |
| 7182240 | Solder coated lid A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a Sn—Sb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a pac... | 02/27/2007 |
| 7173804 | Array capacitor with IC contacts and applications An apparatus having a first set of contacts on a first side of the apparatus adapted to interface with a corresponding plurality of contacts on an integrated circuit package. The apparatus further includes a second set of contacts on a second side of the apparatus a... | 02/06/2007 |
| 7161370 | Semiconductor testing device A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the sp... | 01/09/2007 |
| 7161252 | Module component A module includes a component, a circuit board having the component mounted thereon, a first grounding pattern formed on an outermost periphery of a surface portion of the circuit board; a first sealer provided on the circuit board and having a dimension projected o... | 01/09/2007 |
| 7157903 | Inductive sensor and rotary encoder provided with an inductive sensor An inductive sensor includes at least two circuit boards and receiver circuit traces applied on the first circuit board. Arranged on the second circuit board are components of an evaluation electronics for evaluating signals that originate from the receiver circuit ... | 01/02/2007 |
| 7153788 | Method and apparatus for attaching a workpiece to a workpiece support A method for attaching a workpiece, for example a semiconductor die, to a workpiece holder, for example a lead frame die support, comprises the steps of interposing an uncured adhesive between the semiconductor die and the die support and preheating the adhesive fro... | 12/26/2006 |
