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Microwave Oven With Removable Storage Cassette in Dashboard of Motor Vehicle
A microwave oven adapted for use within a motor vehicle dashboard area. The microwave oven has a removable storage cassette, and slidable platforms for securing and serving containers of beverages and foods.
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| Number | Title | Issue Date |
| 8157158 | Modification of solder alloy compositions to suppress interfacial void formation in solder joints A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead containing or a lead free solder selected from the group comprising Sn—Ag—Cu solder, Sn—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder select... | 04/17/2012 |
| 8033445 | Nano-soldering to single atomic layer A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the solder... | 10/11/2011 |
| 8016181 | Method of producing electro-optical device using anisotropic conductive adhesive containing conductive particles to bond terminal portions and electro-optical device A method of producing an electro-optical device for electrically connecting a first terminal portion provided on an electro-optical panel to a second terminal portion of a substrate includes applying an anisotropic conductive adhesive containing conductive particles... | 09/13/2011 |
| 7918381 | Process for attaching components with near-zero standoff to printed circuit boards The present invention relates to a method and apparatus for mounting electrical components to electric circuit boards. Specifically, the present invention relates to a method for mounting electrical components having near-zero standoff height to electrical printed c... | 04/05/2011 |
| 7850060 | Heat cycle-able connection A method of creating an electrical connection involves providing a pair of contacts each on one of two different chips, the pair of contacts defining a volume therebetween, the volume containing at least two compositions each having melting points, the compositions ... | 12/14/2010 |
| 7743963 | Solderable lid or cover for an electronic circuit A solderable cover for solder attachment to an electronic substrate comprises a non-solderable cover defining an attachment pattern, a solderable metal layer in the shape of the attachment pattern, and a layer of adhesive bonding the solderable metal layer to the at... | 06/29/2010 |
| 7726543 | Method for the production of a soldered joint A method for the production of a soldered joint between at least two contact partners (22, 23) of a bonding arrangement (21), with a formed piece of solder material (27) being arranged at a distance to the bonding arrangement. The formed piece o... | 06/01/2010 |
| 7694868 | Method and apparatus for mounting at least two types of electronic components Provided is a method and apparatus for mounting a plurality of electronic components. The method comprises mounting a first electronic component on a substrate; forming a mask on the substrate to expose the first electronic component and a region of the substrate on... | 04/13/2010 |
| 7677431 | Electronic device handler for a bonding apparatus A large electronic device having a bonding area on one side that comprises first and second portions may be bonded by first locating the first portion but not the second portion of the electronic device for bonding by a bonding tool. After the first portion of the e... | 03/16/2010 |
| 7510108 | Method of making an electronic assembly A method of making an electronic assembly comprising an electronic component that is attached to a circuit board by protruding solder bumps of the electronic component places the electronic component on a surface of the circuit board so that solder bumps on the bott... | 03/31/2009 |
| 7389905 | Flip chip bonding tool tip A flip chip bonding tool tip comprising a dissipative material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large enough to damage the device being bonded is disclosed. Methods for man... | 06/24/2008 |
| 7364063 | Thermally coupling an integrated heat spreader to a heat sink base The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating w... | 04/29/2008 |
| 7360675 | Wire bonder for ball bonding insulated wire and method of using same An electrical contact device is provided for electrically grounding an uninsulated end-portion of insulated wire stored on a spool driven by a device comprises the following. An electrical connector fixes to the spool and is configured to receive an electrical conne... | 04/22/2008 |
| 7360679 | Method for the production of a soldered connection A method for the production of a soldered joint between at least two contact partners (22, 23) of a bonding arrangement (21), with a formed piece of solder material (27) being arranged at a distance to the bonding arrangement. The formed piece o... | 04/22/2008 |
| 7344060 | Apparatus and method for aligning solder pads during head gimbal assembly soldering A device for orienting an integrated lead suspension tail during a head gimbal assembly soldering operation of a head stack assembly process is disclosed. The device includes a body portion and at least one pin extending from the body portion. The pin(s) is configur... | 03/18/2008 |
| 7332365 | Method for fabricating group-III nitride devices and devices fabricated using method A method according to the present invention for fabricating high light extraction photonic devices comprising growing an epitaxial semiconductor structure on a substrate and depositing a first mirror layer on the epitaxial semiconductor structure such that the epita... | 02/19/2008 |
| 7325715 | Unitary vacuum tube incorporating high voltage isolation A housing for microelectronic devices requiring an internal vacuum for operation, e.g., an image detector, is formed by tape casting and incorporates leads between interior and exterior of said housing where said leads are disposed on a facing surface of green tape ... | 02/05/2008 |
| 7327015 | Semiconductor device package A semiconductor device package includes a semiconductor device mounted to a substrate, a wall erected around the semiconductor device with a height taller than the height of the semiconductor device, at least one metal member provided in the wall or against the wall... | 02/05/2008 |
| 7323779 | Semiconductor device A semiconductor device includes a semiconductor chip. A stepped member having stepped regions is provided on the semiconductor chip. The stepped member, together with a redistribution layer, is encapsulated by an encapsulating resin layer. The stepped member is exem... | 01/29/2008 |
| 7319265 | Semiconductor chip assembly with precision-formed metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal ... | 01/15/2008 |
| 7302830 | Flow detectors having mechanical oscillators, and use thereof in flow characterization systems An improved system, device and method for characterizing a fluid sample that includes injecting a fluid sample into a mobile phase of a flow characterization system, and detecting a property of the fluid sample or of a component thereof with a flow detector comprisi... | 12/04/2007 |
| 7304265 | Method and system for machining fragile material In a method for processing brittle material, a laser light from a laser light source irradiates the brittle material and transports an irradiating position of the laser light along a predetermined line, wherein the laser light L from a plurality of laser light sourc... | 12/04/2007 |
| 7299966 | Initial ball forming method for wire bonding wire and wire bonding apparatus An initial ball forming method for wire bonding wire and wire bonding apparatus that uses: a capillary through which a wire is passed; a torch electrode made of a low-melting-point material that contains, for instance, tin; and a direct-current high voltage power su... | 11/27/2007 |
| 7267260 | Apparatus for holding a fiber array Optical fibers are inserted and bonded in a two dimensional array of feedthroughs provided by an insert having a top plate, a bottom plate and a sandwiched spacer plate. Top and bottom plate feature funnel shaped hole sections that capture the approaching fiber end ... | 09/11/2007 |
| 7268421 | Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip a... | 09/11/2007 |
| 7264991 | Method of connecting a conductive trace to a semiconductor chip using conductive adhesive A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip that includes a conductive pad, providing a conductive trace, then disposing a conductive adhesive between the conductive trace and the chip, thereby mechanical... | 09/04/2007 |
| 7265315 | Method of joining terminals by soldering A method of joining terminals by soldering is provided which allows control of increasing gas supply even in soldering performed in a gas atmosphere within a gas chamber. Utilizing a springback phenomenon occurring at a flat portion of a terminal, a solder joint of ... | 09/04/2007 |
| 7262082 | Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first encapsulant, wherein the first conductive trace includes a first metal pillar... | 08/28/2007 |
| 7258264 | Methods for manufacturing optical modules using lead frame connectors Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a secon... | 08/21/2007 |
| 7249955 | Connection of package, board, and flex cable In some embodiments an apparatus includes a board, a package coupled to the board, and a flex cable coupled to the package and extending between the board and the package. Other embodiments are described and claimed. ... | 07/31/2007 |
| 7248450 | Pad cell with multiple signal paths An integrated circuit is described including internal circuitry and having at least one external connection. A pad cell is electrically interposed between the external connection and the internal circuitry, the pad cell comprising a first group of components adapted... | 07/24/2007 |
| 7240820 | Clamping device for processing electronic devices A clamping device is provided for holding an electronic device, such as a semiconductor carrier in the form of a leadframe, during processing thereof. It includes a main body for covering the electronic device and an opening in the main body for providing access to ... | 07/10/2007 |
| 7232706 | Method of making a semiconductor chip assembly with a precision-formed metal pillar A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7232707 | Method of making a semiconductor chip assembly with an interlocked contact terminal A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7223349 | Method and apparatus for surface processing of printed wiring board A printed wiring board having a conductor pattern on which a pre-flux film of a stabilized quality is to be formed using a water-soluble pre-flux liquid. To this end, such an apparatus is used which includes an etching unit 12 for etching lands 5b | 05/29/2007 |
| 7199992 | ESD shorting block system and method for compression connector-type cables A system and associated method are disclosed for protecting a magnetoresistive (MR) head from damage caused by electrostatic discharge. Included is a protective member having a conductive surface for being removably positioned on a MR connector cable such that the c... | 04/03/2007 |
| 7199329 | Method of soldering semiconductor part and mounted structure of semiconductor part A semiconductor part 1 in which a metal terminal 2 is formed on its back surface and side surface is mounted so that only the back surface portion of the metal terminal 2 is in contact with a cream solder 3. When the side surface portion ... | 04/03/2007 |
| 7196294 | Method and resistive bridge circuit for the detection of solder-joint failures in a digital electronic package A solder-joint detection circuit uses a resistive bridge and a differential detector to detect faults in the solder-joint network both inside and outside the digital electronic package during operation. The resistive bridge is preferably coupled to a high supply vol... | 03/27/2007 |
| 7195145 | Electrical circuit apparatus and method for assembling same A method for assembling an electrical circuit apparatus that includes; a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture; a heat sink; and an adhesive layer for mechanically coupling the heat sink to the g... | 03/27/2007 |
| 7190080 | Semiconductor chip assembly with embedded metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line... | 03/13/2007 |
