Did You Know...
...that after Parker Brothers executives turned down the game of Monopoly because it had "52 fundamental errors" (including taking too long to play), a copy of the game wound up in the home of the company president who stayed up until 1 a.m. to finish playing it? He was so impressed by the game that the next day he wrote to inventor Charles Darrow and offered to buy it!
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| Number | Title | Issue Date |
| 8186568 | Assembly of two parts of an integrated electronic circuit A process for assembling two parts of an integrated electronic circuit has two successive steps. During a first step, the two circuit parts are made into a single unit by molecular bonding, realized on respective application surfaces of the two parts. During a secon... | 05/29/2012 |
| 8186567 | Method for forming a weldbonded structure A method for weldbonding at least two work-pieces together includes applying an adhesive to a first surface of a first work-piece, and bringing the first surface of the first work-piece into contact with a surface of a second work-piece. The first work-piece and sec... | 05/29/2012 |
| 8096463 | Wiring method and device To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, the following steps are carried out: a. providing a frame including at least one tensioned wire, b. providing a holding jig including at least one seat in whic... | 01/17/2012 |
| 8074867 | Conductive ball mounting apparatus A conductive ball mounting apparatus for mounting conductive balls by providing an array mask having through holes, into which conductive balls are to enter, above a mounting target placed on a stage, by arranging a ball reservoir having an opening for reserving a p... | 12/13/2011 |
| 7874474 | Self-assembly of elements using microfluidic traps A self-assembly process is disclosed for integrating free standing microcomponents onto a template having a plurality of binding sites, an interconnect network, and trapping structures disposed downstream of the binding sites. The self-assembly is accomplished by fl... | 01/25/2011 |
| 7412766 | Method of fabricating coil-embedded inductor A method of fabricating a coil-embedded inductor provides steps for obtaining uniform density of coil-embedded inductor. The cavity of a first die is filled with dust before being flipped, and then filled with dust a second time. The dust in the cavity is pressed on... | 08/19/2008 |
| 7364394 | Break away fastening system A fastening system is providing, the fastening system has a weld stud having an annular weldment portion and a fracturable nut. The fracturable nut and stud construction is configured to fail under torsional load prior to the structural parts failure. ... | 04/29/2008 |
| 7363819 | High-pressure sensor housing which is simplified by means of a connection element (also emc) A device for measuring pressure, in particular for measuring high pressure, is provided, having a pressure sensor situated in a sensor housing, the sensor housing having a first sensor housing part provided with a pressure connecting piece and a second sensor housin... | 04/29/2008 |
| 7357060 | Vehicle armor A vehicle is armored the steps of sequentially making a steel plate with a thickness of 4 mm to 15 mm of by weight | 04/15/2008 |
| 7358118 | Mounting method of flexible printed circuit and manufacturing method of electric optical device Aspects of the current invention are directed to a method of mounting a flexible printed circuit and a manufacturing method of an electric optical device. Each of the methods form semiconductor elements and first terminal portions for electrically connecting the sem... | 04/15/2008 |
| 7356907 | Method of manufacturing a carriage assembly of a hard disk drive A method of manufacturing a cartridge assembly of a hard disk drive, including a step of forming a part of a wiring circuit into flying leads and a step of forming a coating layer on the respective opposite surfaces of the bonding surfaces of the flying leads, which... | 04/15/2008 |
| 7355504 | Electrical devices An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising (a) a main portion which comprises a main part of the first electrode, a ma... | 04/08/2008 |
| 7332424 | Fluxless solder transfer and reflow process Disclosed is a new process that permits the transfer and reflow of solder features produced by Injection Molded Solder (IMS) from a mold plate to a solder receiving substrate without the use of flux. Several embodiments produce solder transfer and reflow separately ... | 02/19/2008 |
| 7304393 | System and method for coupling internal circuitry of an integrated circuit to the integrated circuit's package pins A technique is provided for communicatively coupling internal circuitry (e.g., a resonant tank) of an integrated circuit (“IC”) with pins of the IC's package in a manner that minimizes the inductance of such coupling. In certain embodiments, more than two bondwi... | 12/04/2007 |
| 7293689 | Two tier brazing for joining copper tubes to manifolds A brazing process for joining copper and copper alloy tubes to a fitting which includes first forming a layer of a high melting temperature noble metal on one end of a copper or copper alloy tube. The plated end is then brazed to a metal ferrule to form a copper all... | 11/13/2007 |
| 7294394 | Phase change material containing fusible particles as thermally conductive filler According to one aspect of the invention, a structure and method for providing improved thermal conductivity of a thermal interface material (TIM) made of phase changed polymer matrix and a fusible filler material is disclosed. The TIM may also have a non-fusible fi... | 11/13/2007 |
| 7288471 | Bumping electronic components using transfer substrates A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic compo... | 10/30/2007 |
| 7282662 | Paint groove stud A weld stud includes a cylindrical body having an outer surface and opposing first and second ends. At least one groove is formed in the outer surface of the cylindrical body. The groove extends helically about the cylindrical body from the first end toward the seco... | 10/16/2007 |
| 7253374 | Sheet-to-tube welded structure and method Method of welding a metal sheet and metal tubing as well as a welded sheet-to-tube welded structure wherein the tube-to-sheet gage ratio may be reduced to permit use of metal tubing having a reduced wall thickness. One or more intermediate metal bridging members is/... | 08/07/2007 |
| 7240821 | Method for joining at least two adjoining work-pieces by friction stir and/or friction stir spot welding A method for weldbonding at least two work-pieces together includes applying an adhesive to a first surface of a first work-piece, and bringing the first surface of the first work-piece into contact with a surface of a second work-piece. The first work-piece and sec... | 07/10/2007 |
| 7226649 | Laser weldable flexible medical tubings, films and assemblies thereof The present invention provides a tubing assembly having a sidewall having a first layer. The first layer is fabricated from a first polymer blend comprising a first component of a material not thermally responsive to laser beam and selected from the group consisting... | 06/05/2007 |
| 7219933 | Hollow product, fluid processing system and joining method of hollow members A connecting portion (10c) of a container (10) of a catalyst converter is formed with a joining portion (15) to be joined to a joining portion (16) of a flange member (11) by spinning working, and the joining portion (15) fo... | 05/22/2007 |
| 7217999 | Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semiconductor chip on the interconnection board In accordance with the present invention, during formation of the interconnection board, the interconnection board remains securely fixed to a high rigidity plate being higher in rigidity than the interconnection board for suppressing the interconnection board from ... | 05/15/2007 |
| 7214887 | Electronic circuit connecting structure, and its connecting method A connecting structure includes a circuit board with a first connection land having a plurality of conductor patterns on the surface thereof, a second connection land disposed in a position opposite to the first connection land of the circuit board, and a flexible b... | 05/08/2007 |
| 7211888 | Encapsulation of pin solder for maintaining accuracy in pin position Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts. ... | 05/01/2007 |
| 7199342 | Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowin... | 04/03/2007 |
| 7165314 | Method for manufacturing a magnetic head arm assembly (HAA) A system and method for an improved magnetic head arm assembly (HAA) is disclosed. The HAA includes three principal components, a head gimbal assembly (HGA), a flexible printed circuit (FPC) assembly, and an actuator coil assembly. The design allows for HAA rigidity... | 01/23/2007 |
| 7164094 | Apparatus and method for electrofriction welding An apparatus and method arranged to use a combination of at least electrical resistance heating and mechanical friction heating to case a base material and/or a consumable material to reach a combination of temperature and pressure sufficient to cause welding. The m... | 01/16/2007 |
| 7150967 | Fluorescent tags for amino acid and nucleic acid analysis Methods and kits for labeling and detecting thiol containing species and nucleic acids using mercurimethyl-dihydropsoralen compounds and derivatives thereof which intercalate nucleic acids and are highly reactive with thiol containing species are provided. Fluoresce... | 12/19/2006 |
| 7140952 | Oxidation protected blade and method of manufacturing The surface of a gas turbine blade is machined with a material-removing tool and simultaneously, an anti-oxidation coating is deposited on the surface using eletrospark deposition. ... | 11/28/2006 |
| 7137547 | Process for forming electrical/mechanical connections A method of making a connection to a surface of an electronic carrier, the method comprising the steps of: providing a mass of malleable material on the surface of the electronic carrier; connecting the mass to said surface; and extruding the mass into a bore of a t... | 11/21/2006 |
| 7138583 | Method and apparatus for maintaining a separation between contacts Methods and apparatus for controlling the distance between contact pads or leads which are to be interfaced are disclosed. According to one aspect of the present invention, an electrical package includes a body and a contact. The body includes electrical circuitry s... | 11/21/2006 |
| 7135397 | Method and system for packaging ball grid arrays According to one embodiment of the invention, a method of packaging ball grid arrays includes providing a substrate having a plurality of holes formed therein. Each hole is associated with a respective one of a plurality of contact pads formed on a first surface of ... | 11/14/2006 |
| 7129569 | Large die package structures and fabrication method therefor A method for fabricating large die package structures is provided wherein at least portions of the leadtips of at least a plurality of leadfingers of a leadframe are electrically insulated. A die is positioned on the electrically insulated leadtips. The die is elect... | 10/31/2006 |
| 7121647 | Method of applying an encapsulant material to an ink jet printhead A stencil printed encapsulant material is provided for use in protecting electrical components in thermal ink jet printhead cartridges. A method of applying an encapsulant material to an ink jet print cartridge by stencil printing is also provided. The method includ... | 10/17/2006 |
| 7115324 | Method of combining welding and adhesive bonding for joining metal components A method of joining metal components having the steps of depositing adhesive material between the components and welding the components together via solid-state or fusion welding. The welds are spaced apart from the adhesive material and are produced so as to preven... | 10/03/2006 |
| 7111606 | Rotary positive displacement device A device to convert energy having exterior and interior rotors where the number of legs (Λ) of an interior rotor divided by the number of chambers (X) defined by the fins of the outer rotor is equal to the effective radius of the inner reference circle ri | 09/26/2006 |
| 7108060 | Fracturing different levels within a completion interval of a well Method and apparatus for fracturing different levels of a completion interval in a well. A workstring lowers a fracturing string which, in turn, is comprised of a base pipe which is blank except for perforated sections spaced along its length. Screen may be provided... | 09/19/2006 |
| 7091619 | Semiconductor device, semiconductor package, electronic device, electronic apparatus, and manufacturing methods of semiconductor device and electronic device A method is provided to enhance the connection reliability in three-dimensional mounting while considering the warping of packages. Opening diameters of the openings provided corresponding to protruding electrodes, respectively, are set so as to gradually decrease f... | 08/15/2006 |
| 7090112 | Method and sealant for joints A joint between one or more structural members and an associated method are provided. The joint includes a friction weld joint or other connection between faying surfaces of the members, and an exothermically reacted sealant disposed in an interface defined by the f... | 08/15/2006 |
