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Pizza Pie With Concentric Rings of Crust
A pizza mold for forming a plurality of concentric raised ridges of dough (i.e., crust) on the surface of a pizza pie.
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| Number | Title | Issue Date |
| 7358539 | Flip-chip light emitting diode with indium-tin-oxide based reflecting contacts A flip chip light emitting diode die (12) includes a light-transmissive substrate (20) and a plurality of semiconductor layers (22) are disposed on the light-transmissive substrate (20). The semiconductor layers (22) define a light... | 04/15/2008 |
| 7341096 | Method for processing a continuously cast metal slab or strip, and plate or strip produced in this way The invention relates to a method for processing a continuously cast metal slab or strip, in which the slab or strip is passed between a set of rotating rolls of a rolling mill stand in order to roll the slab or strip. According to the invention, the rolls of the ro... | 03/11/2008 |
| 7323360 | Electronic assemblies with filled no-flow underfill High yield, high reliability, flip-chip integrated circuit (IC) packages are achieved utilizing a combination of heat and pressure to bond flip-chip die and to cure no-flow underfill material. The underfill comprises a filler or low coefficient of thermal expansion ... | 01/29/2008 |
| 7318267 | Strip production equipment Arranged are a twin- or single-roll continuous casting machine supplied with molten metal from a tundish arranged above so as to continuously cast a strip with a predetermined width, a trimmer arranged downstream of the continuous casting machine to trim widthwise e... | 01/15/2008 |
| 7293690 | Method of manufacturing metallic composite material Disclosed is a method of manufacturing a metallic composite material for use as building material, the metallic composite material including an aluminium core sheet and a titanium clad layer on at least one side of the core sheet. The aluminium core sheet and titani... | 11/13/2007 |
| 7253517 | Method and apparatus for combining multiple integrated circuits An apparatus includes a circuit having first, second and third circuit portions, the first and third circuit portions each including at least one semiconductor circuit component. The second circuit portion includes at least one non-semiconductor circuit component, a... | 08/07/2007 |
| 7199325 | Method for interconnecting tubulars by forge welding A method for interconnecting tubulars by forge welding involves arranging the tubular ends that are to be interconnected at a distance, up to a few millimeters from each other in a shield gas chamber, into which a reducing non-explosive flushing fluid mixture (e.g. ... | 04/03/2007 |
| 7124930 | Welding method and tubular member and gear pump made using the welding method A gear pump having an inner rotor and an outer rotor is covered by a cylindrical outer casing and side casings. The cylindrical outer casing has two outer circumferential edges which are welded over the entire circumference thereof to the outer edges of the side cas... | 10/24/2006 |
| 7120898 | Intermediate representation for multiple exception handling models As described herein, an intermediate representation of a source code file may be used to explicitly express exception handling control flow prior to generating object code for the source code. As further described herein, a single uniform set of instructions of the ... | 10/10/2006 |
| 7048973 | Metal film vapor phase deposition method and vapor phase deposition apparatus A copper film vapor phase deposition method includes the steps of exposing high-purity copper to a plasma of a gas containing chlorine gas to etch the high-purity copper, thereby generating active CuxCly, wherein x is 1 to 3, y is 1 to 3, gas, ... | 05/23/2006 |
| 7020232 | Electron beam computed tomographic scanner system with helical or tilted target, collimator and detector components to eliminate cone beam error and to scan continuously moving objects A scanning electron beam computed tomographic system eliminates axial offset between target and detector by disposing the target, collimator, and detector such that active portions of the target and detector are always diametrically opposite each other. This result ... | 03/28/2006 |
| 6938816 | Methods of manufacturing diffusion bonded products and products manufactured by such methods A method is provided for diffusion bonding a first member (20) and a second member (3) to each other. According to this method, a first joint portion (24) of the first member and a second joint portion (34) of the second member are fitted... | 09/06/2005 |
| 6926190 | Integrated circuit assemblies and assembly methods A method for assembling chips onto substrates includes applying a flux-free, no-flow underfill material. In an embodiment, the method includes removing oxide from interconnects without the use of a flux and applying a flux-free, no-flow underfill. In an embodiment, ... | 08/09/2005 |
| 6924171 | Bilayer wafer-level underfill Methods for fabricating microelectronic interconnection structures as well as the structures formed by the methods are disclosed which improve the manufacturing throughput for assembling flip chip semiconductor devices. The use of a bilayer of polymeric materials ap... | 08/02/2005 |
| 6892928 | Method of manufacturing tubular body, by friction stir welding Method of manufacturing a tubular end product, wherein an aluminum plate is formed into a generally cylindrical body such that opposite end sections of the cylindrical body are flattened and butted together along a joint region extending parallel to an axis of the c... | 05/17/2005 |
| 6840430 | Board pieces, flexible wiring boards and processes for manufacturing flexible wiring boards A board piece 2 of the present invention comprises a non-thermoplastic resin film 11, a thermoplastic resin film 10 formed on the non-thermoplastic resin film 11 and a metal wiring 8 formed on the surface of the thermoplastic resin... | 01/11/2005 |
| 6814275 | Method for making a structural element having a generally tubular metal wall and structural element At least one plane blank (20) is cut out from a sheet of metal material, the blank comprising a main part having the developed shape of the wall of the structural element and at least one additional overlap and fixing tab (26, 27, 28), the cutout blank... | 11/09/2004 |
| 6749103 | Low temperature sputter target bonding method and target assemblies produced thereby A low temperature target and backing plate bonding process and assemblies made thereby. A plurality of projections are formed in the harder member of the assembly. The assembly is bonded by conventional techniques around the peripheral assembly boundaries. The assem... | 06/15/2004 |
| 6711803 | Method of joining steel products, method of processing junction surfaces of steel products, and reinforcing member The present invention enables to firmly assemble a steel-frame structure. To form a steel-frame structure or to join two steel members being reinforcing members thereof, a slip-proof surface having one or plural concentric higher parts and grooves is formed on the j... | 03/30/2004 |
| 6672502 | Method for making devices having intermetallic structures and intermetallic devices made thereby A method and system for making a monolithic intermetallic structure are presented. The structure is made from lamina blanks which comprise multiple layers of metals which are patternable, or intermetallic lamina blanks that are patternable. Lamina blanks ... | 01/06/2004 |
| 6596947 | Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards A board piece 2 of the present invention comprises a non-thermoplastic resin film 11, a thermoplastic resin film 10 formed on the non-thermoplastic resin film 11 and a metal wiring 8 formed on the surface of the thermoplastic resin film 10. Metal wiring 8... | 07/22/2003 |
| 6509541 | Method for molding an assembly panel The present invention provides a method for molding an assembly panel by manufacturing a blank for a main panel and a blank for a reinforcing panel; temporarily welding the blank for the reinforcing panel to the blank for the main panel along a predetermi... | 01/21/2003 |
| 6508393 | Suspension system including arm having zero clearance axle connection A suspension system is provided which includes an arm having a zero clearance axle connection. In a described embodiment, a method is provided for manufacturing the suspension system, which method includes the steps of welding an axle connector to an axle... | 01/21/2003 |
| 6491210 | Method and apparatus of butt welding A method of butt welding is performed in the following steps: a step of pressing first and second blank materials onto first and second loading bases respectively by clamping devices thereby fixing them; a step of shearing end surfaces of the first and se... | 12/10/2002 |
| 6419146 | Metal sandwich structure with integral hardpoint A superplastically formed, diffusion bonded sandwich structure having integral metal hardpoints, made by joining two superplastic metal core sheets together into a core pack by welding or diffusion bonding along a pattern of lines which form junction line... | 07/16/2002 |
| 6402009 | Apparatus and method for shaping lead frame for semiconductor device and lead frame for semiconductor device In apparatus and method for shaping a lead frame for a semiconductor device, there are provided a lower die having a concave shape for forming a step portion on the lower surface of the lead frame through a slope shape, an upper die having a convex shape ... | 06/11/2002 |
| 6260271 | Tubular body having integral branch tubes and method for producing the same A tubular body having integral branch tubes for use in a distribution tank of a car air conditioner and a method for producing such tubular body. The tubular body is produced almost solely by a deformation process. The process for forming the tubular body... | 07/17/2001 |
| 6199743 | Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies The invention encompasses a method of forming a semiconductor chip assembly. A substrate is provided. Such substrate has a pair of opposing surfaces and circuitry formed on one of the opposing surfaces. A semiconductor chip is joined to the substrate. The... | 03/13/2001 |
| 6125533 | Insulated wire termination, method, and machine A method, machine and termination for connecting two or more insulated wire ends comprises placing them in a metal tube held between fusing electrodes. The electrodes are shaped to deform the tube and wires therein with the application of fusing pressure.... | 10/03/2000 |
| 6027008 | Electronic device having electric wires and method of producing same An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of... | 02/22/2000 |
| 5975408 | Solder bonding of electrical components The specification describes a technique for solder bump bonding IC chips or chip packages to interconnection substrates. Epoxy prepolymer underfill is applied to the surface of the interconnection substrate prior to the solder bump bonding step. The prese... | 11/02/1999 |
| 5803342 | Method of making high purity copper sputtering targets Described is a method of making high purity copper sputtering target. The method avoids melting and casting and involves stacking segments of high purity copper plates, and heating, forging and annealing to produce a diffusion bonded unitary structure.... | 09/08/1998 |
| 5353491 | Method of making frame and magnet assembly for a dynamoelectric machine A method of securing a tubular metallic magnet retainer to a tubular metallic frame of a dynamoelectric machine, the tubular frame having an annular internal surface, the steps comprising, forming an annular end surface at an end of said tubular frame tha... | 10/11/1994 |
| 5279909 | Compact multilayer ceramic-to-metal seal structure A compact multilayer ceramic-to-metal seal structure, and method for manufacture, includes a ceramic core with opposed metallic surface layers. Between the ceramic core and each of the metallic surface layers is a transition zone which is made from graded... | 01/18/1994 |
| 5259547 | Method of manufacturing bi-metallic tubing This invention relates to a method for producing bi-metallic tubing wherein a layer (3,31) of a first metal is metallurgically bonded to the exterior surface of a core component (1,29) of a second metal incompatible for solid state bonding with the first ... | 11/09/1993 |
| 5163604 | Method for forge welding or the like A method for forge welding or the like of a first and a second metal part, wherein at least one joint is established between opposed bounding surfaces on the two parts to be joined, and wherein preferably a reducing gas is passed through the joint or join... | 11/17/1992 |
| 5150520 | Heat exchanger and method of assembly thereof A method of affixing a plurality of tubes having oval ends into a plurality of corresponding oval openings of equal circumference in the header wall of a heat exchanger. The minor diameter of the tube ends is greater than the minor diameter of the header ... | 09/29/1992 |
| 5139528 | Method of securing a mesh to a metal substrate for a bone implant The wire mesh is welded to the metal substrate via step-like protuberances formed on the outer surface of the substrate. The wire mesh is permanently deformed in the regions over the protuberances to facilitate forming of spot welds while the remainder of... | 08/18/1992 |
| 5115964 | Method for bonding thin film electronic device A method of forming electrical connections between a flexible film carrier and an electronic device (e.g., semiconductor chip). The method comprises the steps of aligning the film carrier relative to the device having a plurality of solder mounds located ... | 05/26/1992 |
| 5096111 | Method for contracting a cylindrical body A method of diametrically contracting a cylindrical body, includes the steps of grasping the cylindrical body with a plurality of elongated grasping members, preparing a cylindrical drawing die having an opening at one end and a tapered inside peripheral ... | 03/17/1992 |
