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Class 228/172 - Abrading


Subclass of Class 228 - Metal fusion bonding
Definition: Process wherein the shaping operation is done by the action
No. of patents: 18
Last issue date: 12/25/2007


NumberTitleIssue Date
7312985Cooler of notebook personal computer and fabrication method thereof
Disclosed is a cooler of a notebook personal computer allowing more much heat to be rapidly discharged to the outside. The cooler includes: a heat absorbing part fan for absorbing heat generated from a heat generation device of the notebook personal computer; a cool...
12/25/2007
7097915Separator plate for manufacturing printed circuit board components
A separator plate for the production of printed circuit board components by pressing individual layers, which separator plate includes a metallic core layer and a coating on at least one side of the core layer, wherein the coating on the core layer, which is made of...
08/29/2006
6992261Sputtering target assemblies using resistance welding
A method of forming a sputtering target assembly and other metal articles is described. Sputtering target assemblies and metal articles are also described. The method includes bonding a sputter target to a backing plate using resistance heating or welding to bond as...
01/31/2006
6908588Process for manufacturing an evaporation source
The invention relates to a process for manufacturing an evaporation source for physical vapor deposition. The evaporation source is formed of the actual sputtering target with an aluminum component and one or more further components as well as of a backing plate mad...
06/21/2005
6523735Method of manufacturing bonded assembly
A method of bonding respective objects made of different kinds of material to each other is disclosed. The method includes the steps of (A) contacting a bonding material in the fluid state thereof with respective bonding faces of the respective objects to...
02/25/2003
6073830Sputter target/backing plate assembly and method of making same
This invention is directed to an improved bonded sputter target/backing plate assembly and a method of making these assemblies. The assembly includes a sputter target having side and bottom bonding surfaces bonded within a recess in an underlying backing ...
06/13/2000
5836506Sputter target/backing plate assembly and method of making same
This invention is directed to an improved method for making a bonded sputter target/backing plate assembly as well as assemblies produced therefrom. The assembly includes a sputter target having a bonding surface which is bonded to the bonding surface of ...
11/17/1998
5323536Method of manufacturing an article by superplastic forming and diffusion bonding
A plurality of workpieces are assembled into a stack. Two of the workpieces are machined on one surface at predetermined positions from the edges of the workpieces. The workpieces are stacked so that the machined surfaces of the workpieces face away from ...
06/28/1994
5145103Partial elimination of copper plate from steel strip by mechanical means
A process for producing non-corrosive double-wall tubing in which an unbrazed, unsealed continuous double-wall tube of a given circumference is formed from a metal sheet composed of a first non-ferritic metal having a first defined region of exposed non-f...
09/08/1992
5042710Method of forming filament reinforced shaft
A method for forming a shaft of filament reinforced matrix metal is provided. The hollow shaft structure is made up of a number of layers of monotape which are assembled together and then HIPed to form a consolidated composite tubular shaft structure. The...
08/27/1991
4732312Method for diffusion bonding of alloys having low solubility oxides
Diffusion bonding of surface layers of an alloy, such as an aluminum alloy, having surface oxides of low solubility in the alloy includes treating the surface layers to be bonded to remove existing surface oxide coatings, and diffusion bonding the surface...
03/22/1988
4598873Method of manufacturing a pumpable coal/liquid mixture
In order to enable a reduction of the percentage of liquid in a liquid/coal pumping mixture the coal is dry-ground in a first grinding stage (1) to provide a relatively coarse particle size and then a fraction of the coarse ground coal is then dry-ground ...
07/08/1986
4593446Method of manufacturing a fluid flow restrictor
The method of providing an order of magnitude manufacturing cost reduction in the manufacture of fluid flow restrictors by employing components produced by punch press stamping operations. The flow restrictor is formed of a plurality of annular plates. Ha...
06/10/1986
4206866Apparatus and method for producing high sensitivity magnetochemical particles
Improved apparatus and method for continuously producing high sensitivity magnetochemical particles consisting of joined pairs of pre-oriented magnetic metallic spheres which have been heat treated, magnetically annealed, then plated with color forming me...
06/10/1980
4161273Tube joint and method of making same
A tube joint including a male end which has a rounded inner edge having its original surface finish and a female end which is expanded to receive the male end. The male end is formed by chamfering the end outer diameter and flaring the end inner diameter ...
07/17/1979
4132343Method for manufacturing a pipeline having an internal protective layer
A pipeline consisting of lengths of steel pipe welded together in end-to-end relation is made by first weld-plating the internal surface of the end portions of each individual pipe length with a corrosion-resistant material. A protective layer is then app...
01/02/1979
4082213Method of mounting a particle on a support member
The method of mounting a particle on a support member comprises mounting a mass of material from which the particle is derived on a carrier element and then shaping the mass of material to form an assembly of the particle on the element. The assembly is l...
04/04/1978
4058246Suction pipette and method of manufacture for receiving of semiconductor crystal plates
A method of manufacturing a suction pipette of sinterable material for receiving substantially rectangular, semiconductor crystal plates. The pipette is formed with a rectangular recess and has walls defining the recess which narrow towards the floor of t...
11/15/1977
 
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