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| Number | Title | Issue Date |
| 7891537 | Sputter target and backing plate assembly A method for aligning the sputter target onto a backing plate having a peripheral arcuate-shaped flange on its bonding surface to provide an aligned and uniform solder bonded interface; and the sputter target/backing plate assembly so produced. ... | 02/22/2011 |
| 7837086 | System, method, and apparatus for forming ballistic armor from ceramic and shape memory metallic alloy materials A ballistic armor uses shape memory alloys and novel joining techniques to form a solution from a combination of shape memory metallic alloys (SMA) and ceramic materials. The SMA allows a high amount of strain to be recovered through a low temperature heat treatment... | 11/23/2010 |
| 7748598 | Method of joining clad metals and vessel produced thereby A method for joining clad metal plates having a protective layer (27), e.g. titanium, and a substrate layer (28), e.g. carbon steel, includes firstly removing margins (29) of protective layer along edges of the clad metal plates to be joined. Th... | 07/06/2010 |
| 7735713 | Method for mounting chip component and circuit board A method for mounting a chip component includes the steps of: flattening a solder deposit adhering onto a land terminal of a circuit board; forming grooves on the solder deposit simultaneously with or after flattening the solder deposit; coating the solder deposit w... | 06/15/2010 |
| 7431195 | Method for centering a sputter target onto a backing plate and the assembly thereof A method for aligning the sputter target onto a backing plate having a peripheral arcuate-shaped flange on its bonding surface to provide an aligned and uniform solder bonded interface; and the sputter target/backing plate assembly so produced. ... | 10/07/2008 |
| 7367099 | Method for assembling two parts having accurate dimensions and use for brazing of a linac RFQ accelerator A method of assembling two parts of which the dimensions of one of the parts or the final assembly are to be adhered to with precision. In the part whose dimensions are to be adhered to with the highest level of precision, a groove is machined to have a depth greate... | 05/06/2008 |
| 7261230 | Wirebonding insulated wire and capillary therefor An improved method of bonding an insulated wire (14) that has one end connected to a first bond pad (16) to a second bond pad (18) includes moving a tip of a capillary (20) holding the bond wire (14) over the surface of the second ... | 08/28/2007 |
| 7211039 | Strand with end plug A treatment strand for insertion into a patient using a needle. The strand includes an elongated member having first and second longitudinal ends, and a plurality of treatments seeds spaced apart from one another within the elongated member between the longitudinal ... | 05/01/2007 |
| 7143928 | Flux and method for joining dissimiliar metals Disclosed herein is a method for joining dissimilar metals without a need for a separate welding process. The method comprises applying a flux on a metal to be joined, inserting the metal into a mold, and injecting a molten metal into the mold. Thus, the base metal ... | 12/05/2006 |
| 7135770 | Semiconductor element with conductive columnar projection and a semiconductor device with conductive columnar projection A columnar bump formed of copper etc. is formed on a wiring film of a semiconductor chip through an interconnected film and an adhesive film in a wafer unit by electrolytic plating in which package formation is possible. An oxidation prevention film is formed of suc... | 11/14/2006 |
| 7131567 | Method and device for joining of metal components, particularly light metal components Method for joining components of metals and alloys, particularly components of light metals, including alloys of light metals and possibly hybrids/composites containing light metals. Oxide on the surfaces to be joined is removed immediately prior to joining, and the... | 11/07/2006 |
| 7084657 | Bump and method of forming bump A probe card used for establishing electric contact with an electric part to inspect an electric characteristic thereof comprises a plurality of conductors, each transmitting a signal used for inspection, and a plurality of bumps, each formed on one of the plurality... | 08/01/2006 |
| 7074291 | Delivery system and method for interstitial radiation therapy using strands constructed with extruded strand housings A delivery system and method for interstitial radiation therapy comprising substantially axially stiff and longitudinally flexible elongated members made of material which is bioabsorbable in living tissue and a plurality of radioactive seeds dispersed in a predeter... | 07/11/2006 |
| 7034247 | Apparatus for handling sheet metal workpieces to be welded An apparatus for handling a pair of sheet metal workpieces to be welded is provided that includes a first workpiece holder, a second workpiece holder, at least one backing element, and at least one squeeze roller. The first and second workpiece holders are positione... | 04/25/2006 |
| 7028403 | Method of manufacturing friction plate and apparatus thereof A method of manufacturing a friction plate including a plurality of frictional material segments which are punched into a predetermined shape, and a core plate onto which the plurality of frictional material segments are annularly bonded, comprising step of punching... | 04/18/2006 |
| 7028881 | Method for providing removable weld backing Method for welding objects having limited backside access to a cavity behind a region to be welded. The method includes inserting a fugitive backing material in an installation state into a first portion of the cavity proximate the region to be welded and then trans... | 04/18/2006 |
| 7009294 | Production process for semiconductor device A production process for a semiconductor device having a metal electrode on a semiconductor substrate thereof. A metal electrode portion is formed on a surface of another substrate for electrode transfer. Then, the metal electrode portion is transferred from the ele... | 03/07/2006 |
| 6954987 | Method of interconnecting a circuit board to a substrate A printed circuit board assembly employing a solder vent hole adjacent solder filled interconnect vias connecting to a conductive pallet, is disclosed. The solder vent hole allows gases to escape from an otherwise sealed cavity during solder reflow, relieving positi... | 10/18/2005 |
| 6953143 | Explosion welded design for cooling components A method and apparatus are described for making a coldplate. A first component of, for example copper, is explosion welded to a second component of, for example aluminum. The first metal component has a top surface opposite the second metal component and at least on... | 10/11/2005 |
| 6926189 | Welding method and apparatus An apparatus for welding closed one end of each of a multiplicity of open-ended tubes suitable for use as brachytherapy capsules includes a welding station having a welding position for welding closed one end of a tube, a rotatable platform having an outside edge, a... | 08/09/2005 |
| 6918808 | Arc tube for discharge lamp and method for producing the same A discharge lamp arc tube in which a pair of electrode assemblies each having an electrode rod, a sheet of molybdenum foil and a lead wire integrally series-connected to one another have respective molybdenum foil containing regions pinch-sealed with glass, and elec... | 07/19/2005 |
| 6918173 | Method for fabricating surface mountable chip inductor In a method for fabricating a surface mountable chip inductor, a spiral coil pattern is formed on a surface of a cylindrical body fabricated by mixing ferrite or ceramic powder with thermoplastic organic binder, the cylindrical body is transformed into a square-shap... | 07/19/2005 |
| 6916550 | Method of manufacturing a metal matrix composite structure A method for mechanically cutting a continuous circular shaped groove in a foil sheet for use in a metal matrix composite product. In one form the foil sheet is held adjacent a rotating machine tool by vacuum and a cutting tool is moved relative thereto to cut a spi... | 07/12/2005 |
| 6910612 | Capillary with contained inner chamfer A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer formed at an inner portion of the end of the working tip, the inner ... | 06/28/2005 |
| 6907666 | Method of assembly of vehicle body structure A method of manufacture of a body assembly of a refuse vehicle includes forming a first, second and third components of the assembly. A first and second locating constructions are formed in the first component. The second component is formed so as to have a first ma... | 06/21/2005 |
| 6840427 | Method of manufacturing sputter targets with internal cooling channels The present invention pertains to low temperature pressure consolidation methods which provide for bonding of target material (10) to the backing plate material (15) capable of withstanding the stresses imposed by high sputtering rates. The sputter tar... | 01/11/2005 |
| 6793119 | Process for welding duplex steel Process for welding duplex steel in the presence of a shielding gas without use being made of welding aids and with nitrogen being added to the shielding gas and with an austenitic-ferritic duplex steel with a chromium content of between 28 and 35 wt. % and a nickel... | 09/21/2004 |
| 6688513 | Process for producing longitudinally welded tubes In a process for producing longitudinally welded tubes, a metal strip, which is continuously pulled from a supply, is gradually formed into a slit tube and the longitudinal slit of said slit tube is welded. The metal strip (2) is pulled through a pluralit... | 02/10/2004 |
| 6672502 | Method for making devices having intermetallic structures and intermetallic devices made thereby A method and system for making a monolithic intermetallic structure are presented. The structure is made from lamina blanks which comprise multiple layers of metals which are patternable, or intermetallic lamina blanks that are patternable. Lamina blanks ... | 01/06/2004 |
| 6599405 | Recessed sputter target The method manufactures sputter target assemblies. It first includes the step of manufacturing a target insert. The target insert has a yield strength, a diameter, a height, a planar top surface and a conical-shaped rear surface. Then a backing plate is m... | 07/29/2003 |
| 6588648 | Method and device for transferring a hollow-profile blank During manufacture of certain hollow profiles suitable for use in car body construction the welded profiles are subjected to a further deformation process, namely hydroforming. At present the corresponding welding machines are charged manually. The invent... | 07/08/2003 |
| 6579431 | Diffusion bonding of high purity metals and metal alloys to aluminum backing plates using nickel or nickel alloy interlayers An improved method for joining mating surfaces of a metallic sputter target and a backing plate of aluminum, aluminum alloy or aluminum matrix composite material to form a sputter target/backing plate assembly comprises the steps of roughening the mating ... | 06/17/2003 |
| 6543674 | Multilayer interconnection and method A method for electrically coupling electrode pads comprising forming a reflowed solder bump on a first electrode pad supported by a first substrate. The reflowed solder bump includes a solder material having a solder melting temperature. The method furthe... | 04/08/2003 |
| 6521108 | Diffusion bonded sputter target assembly and method of making same Low temperature diffusion bonding methods and target/backing plate assemblies bonded by the methods are disclosed. In accordance with the methods, copper and/or cobalt targets are bonded to backing plate members via the use of an interlayer selected from ... | 02/18/2003 |
| 6516993 | Control rod A fabricated control rod is disclosed having a spacer with a "C" or "U-shaped" channel cross-section. The spacer also has a bushing tube welded to each of its ends. Each end of the spacer is shaped to have a substantially continuous mating engagement with... | 02/11/2003 |
| 6474535 | Welding method and apparatus In a method for welding closed one end of each of a multiplicity of open-ended tubes suitable for use as brachytherapy capsules (100), each tube is loaded into a holder (52), brought to a welding station (80), has one end welded closed and is then release... | 11/05/2002 |
| 6467674 | Method of manufacturing semiconductor device having sealing film on its surface A sealing film is formed on a semiconductor substrate on which a number of columnar electrodes are formed, and then the upper surface of the sealing film is polished to expose the upper surfaces of the columnar electrodes made of a soft metal. During the ... | 10/22/2002 |
| 6430809 | Method for bonding conductors, in particular beam leads A method for bonding conductors onto semiconductor components is disclosed, where an opening is provided in an insulation layer on a semiconductor component. At least one conductor extends across the opening, where the conductor is bonded onto the semicon... | 08/13/2002 |
| 6409072 | Chemical microreactors and method for producing same Chemical microreactors for chemical systhesis and their methods of manufacture are known, but have disadvantages such as extremely high manufacturing costs or poor flexibility for adaptation to various cases of application. These disadvantages are avoided... | 06/25/2002 |
| 6409071 | Method for assembling, by welding, a coil with an integrated circuit or an electronic unit of small dimensions Method for welding two end portions (6, 8) of a coil (not shown) onto two electric contact pads or bumps (24, 26) of an integrated circuit (2) or an electronic unit of small dimensions. This welding method is characterised in that, prior to the actual wel... | 06/25/2002 |
