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Class 228/163 - By melting


Subclass of Class 228 - Metal fusion bonding
Definition: Process wherein shaping and removal of material is done
No. of patents: 7
Last issue date: 09/21/2004


NumberTitleIssue Date
6793831Microlamination method for making devices
A method for fabricating devices in a pre-assembled state comprising forming plural laminae, registering the laminae, and bonding the laminae one to another is described. The plural laminae contain the substructures and structures of the device. The substructures ar...
09/21/2004
6759622Interconnection between two-surface of multi-surface thin strip-shaped layers that lie one on top of the other, in particular, between two strips undergoing a continuous processing
The invention relates to an interconnection between two overlapping end sections of metallic strips (10, 20) in which a quick and economical interconnetion should be produced. To this end, the invention provides that several annular welds (30) are prov...
07/06/2004
6490839Window frame and method of producing it
A window frame is formed of a plurality of plastic section pieces welded together at their ends. The ends of the plastic section pieces also have surfaces which abut one another. The plastic section pieces are not welded at the abutting surfaces. The unwe...
12/10/2002
6347901Solder interconnect techniques
A method and article of fabrication is described featuring a solder layer having a serpentine, interrupted, or interdigitated boundary. The non-planar design of the boundary layer increases the fatigue life of the solder joint by limiting the damage cause...
02/19/2002
4955524Extrusion die construction and its method of manufacture
In accordance with a preferred embodiment, a monolith extrusion die is formed by a plurality of individual tube elements bonded together as a tube stack defining a plurality of extrudable material feed holes and reference guides for a plurality of individ...
09/11/1990
4877175Laser debridging of microelectronic solder joints
A solder bridge between leads of a microelectronic circuit is removed by projecting a laser beam onto the solder bridge with sufficient power to cause the solder forming the bridge to melt and to flow onto a wicking tool placed into contact with the solde...
10/31/1989
3938723Method for rolling thin metal films
The specification and drawings disclose a method and apparatus for rolling plural metal strips simultaneously to form thinner metal strip or foil. The method allows use of larger diameter rolls and simpler roll supporting structure and mill controls than ...
02/17/1976
 
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