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| Number | Title | Issue Date |
| 7971771 | Method and device for producing tubular jackets In at least one embodiment, for producing segments of tubular jackets, a strip-shaped sheet material is continuously reshaped transverse to the strip axis into a closed form and following the welding of a longitudinal seam, jacket sections are cut off the jacket str... | 07/05/2011 |
| 7347112 | Air sampler with integrated airflow sensing Air sampler with integrated airflow sensing. The air sampler according to at least some embodiments includes an air mover that is operable to move air over a sampling media. An integrated airflow sensor is in fluid communication with the air mover. The air mover ope... | 03/25/2008 |
| 7334311 | Method of forming a nested can brush seal A method of forming a brush seal which includes placing a bristle hoop sandwiched by a sideplate and a backplate in the cavity of a forming die. The components are then die formed together into a unitized brush seal. ... | 02/26/2008 |
| 7319265 | Semiconductor chip assembly with precision-formed metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal ... | 01/15/2008 |
| 7299557 | Tilt sensor A tilt sensor has a source for optical radiation, a pattern support having an optically effective pattern for the passage of the optical radiation generated by the source, a tilt-sensitive unit downstream of the pattern support in the direction of propagation of the... | 11/27/2007 |
| 7268421 | Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip a... | 09/11/2007 |
| 7264991 | Method of connecting a conductive trace to a semiconductor chip using conductive adhesive A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip that includes a conductive pad, providing a conductive trace, then disposing a conductive adhesive between the conductive trace and the chip, thereby mechanical... | 09/04/2007 |
| 7262082 | Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first encapsulant, wherein the first conductive trace includes a first metal pillar... | 08/28/2007 |
| 7232707 | Method of making a semiconductor chip assembly with an interlocked contact terminal A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7232706 | Method of making a semiconductor chip assembly with a precision-formed metal pillar A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7217332 | Brush filament bundles and preparation thereof Methods and devices are provided for forming filament bundles of long, continuous strands of filaments. The methods include bonding the long, continuous stands of filaments together so that they cannot move axially with respect to any other filament in the bundle. M... | 05/15/2007 |
| 7195456 | Turbine engine guide vane and arrays thereof An exit guide vane array for a turbine engine includes a set of guide vanes 28 having a solidity and defining fluid flow passages 74 with a chordwisely converging forward portion 80. The high solidity and convergent passage portion 80 res... | 03/27/2007 |
| 7190080 | Semiconductor chip assembly with embedded metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line... | 03/13/2007 |
| 7182345 | Hydrodynamic brush seal A hybrid brush seal is provided having two bundles of axially spaced seal bristles each of which are mounted in a ring shape on a first machine component with bristle ends directed at a sealing surface of the second, rotating machine component. The bristle ends are ... | 02/27/2007 |
| 7181843 | Method of manufacturing a brush seal A method for manufacturing a brush seal is provided including the steps of: (a) providing fiber; (b) providing a packing material; (c) providing a pair of backing plates; (d) arranging the fiber in a particular arrangement; (e) applying the packing material to selec... | 02/27/2007 |
| 7163121 | High temperature isostatic pressure bonding of hollow beryllium pressure vessels using a bonding flange A bond joint and process of bonding metal parts to one another to form seamless, hollow metal articles, particularly made from beryllium. Tooling is assembled to the parts, prior to hot pressing, to cause pressure to be applied to flanges that extend peripherally fr... | 01/16/2007 |
| 7134590 | Desoldering sheath A desoldering sheath that comprises at least one hollow metal wire molded to conform to the tip of a desoldering tool. In one implementation, the desoldering sheath is formed using a hollow metal wire that is coiled around a male cone-shaped mold. The coiled, hollow... | 11/14/2006 |
| 7132741 | Semiconductor chip assembly with carved bumped terminal A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal filler, a connection joint that electrically connects the routing line and the pad, and an enca... | 11/07/2006 |
| 7129575 | Semiconductor chip assembly with bumped metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an enca... | 10/31/2006 |
| 7129113 | Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first encapsulant, wherein the first conductive trace includes a first metal pillar... | 10/31/2006 |
| 7111770 | Method for producing connecting ends on metal tubes and tube piece comprising such connecting ends Connecting ends on a hose piece comprising several metal layers, in particular a strip wound metal hose piece, are produced by fixing the overlapping metal layers of a hose of larger length or of an endless hose in the region of the point of separation through weldi... | 09/26/2006 |
| 7112521 | Method of making a semiconductor chip assembly with a bumped metal pillar A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a bumped terminal, then mechanically attaching a semiconductor chip to the metal base, the routing line and the bumped terminal, then forming an encapsulant, and the... | 09/26/2006 |
| 7094676 | Semiconductor chip assembly with embedded metal pillar A method of making a semiconductor chip assembly includes forming a routing line on a metal base, etching the metal base wherein an unetched portion of the metal base forms a pillar, mechanically attaching a semiconductor chip to the routing line and the pillar wher... | 08/22/2006 |
| 7079559 | Flip-chip automatically aligned optical device A semiconductor laser device with a first side and a second side, comprising (a) an active region, (b) a P layer, wherein the P layer contains a first contact area, (c) an N layer, wherein said N layer contains a second contact area, wherein the contact area of the ... | 07/18/2006 |
| 7075186 | Semiconductor chip assembly with interlocked contact terminal A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal pillar and a contact terminal, a connection joint that electrically connects the routing line and the pad, and an enc... | 07/11/2006 |
| 7069653 | Method for electrically connecting a semiconductor component to an electrical subassembly A method of establishing an electric connection between electric terminals of a semiconductor component as part of an electric module and additional parts of the electric module by using a punched grid having internal terminal ends and external terminal ends that ar... | 07/04/2006 |
| 7071089 | Method of making a semiconductor chip assembly with a carved bumped terminal A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a metal filler, then mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the metal filler, th... | 07/04/2006 |
| 7071573 | Semiconductor chip assembly with welded metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip a... | 07/04/2006 |
| 7067911 | Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture A three-dimensional stacked semiconductor package includes first and second semiconductor chip assemblies. The first semiconductor chip assembly includes a first chip, a first conductive trace and a first encapsulant, and the first conductive trace includes a first ... | 06/27/2006 |
| 7015128 | Method of making a semiconductor chip assembly with an embedded metal particle A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip that includes a conductive pad to a routing line, mechanically attaching and electrically connecting a metal particle to the routing line, wherein the routing line ... | 03/21/2006 |
| 7009297 | Semiconductor chip assembly with embedded metal particle A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal particle, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The rout... | 03/07/2006 |
| 7004054 | In-process tape bur monitoring The protective tape applied to the front surface of a semiconductor wafer to protect the wafer during backgrinding must be trimmed so that excess tape, known as tape bur, does not extend beyond the perimeter of the wafer. Tape bur may interfere with backgrinding by ... | 02/28/2006 |
| 6951119 | Method for producing micromechanical and micro-optic components consisting of glass-type materials What is proposed here is a method of structuring surfaces of glass-type materials and variants of this method, comprising the following steps of operation: providing a semiconductor substrate, structuring, with the formation of recesses, of at least one surface of t... | 10/04/2005 |
| 6949408 | Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps A method of making a semiconductor chip assembly includes providing a semiconductor chip, a metal base, an insulative base and a conductive trace, wherein the chip includes a conductive pad, the metal base is disposed on a side of the insulative base that faces away... | 09/27/2005 |
| 6908788 | Method of connecting a conductive trace to a semiconductor chip using a metal base A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip, a conductive trace and a metal base, wherein the chip includes a conductive pad, and the conductive trace is disposed between the metal base and the chip, then... | 06/21/2005 |
| 6880742 | Separating seam welding device Shown is a device and a process for the simultaneous separating and welding of foils or foil tubes (5) where the device comprises at least one welding terminal (2) and an opposing terminal (3), | 04/19/2005 |
| 6875942 | Methods and systems for fabricating spiral welded cylinders A method for forming a cylindrical body utilizing a continuous weld is provided. The method includes feeding a source material including a first edge and a second edge from a coil and offsetting at least one of the first edge and the second edge. The method further ... | 04/05/2005 |
| 6848608 | Method of bonding sputtering target materials A method of forming a sputtering target is described that involves bonding a backing plate onto a casement having one or more recesses that contain target material to form a bonded target. During the bonding process, the bonded target is optionally vacuum sealed wit... | 02/01/2005 |
| 6827248 | Cutting device for bonded wires Bond-wire cutting device for cutting off the part of a bond wire that extends beyond the bonding contact area after a bonded connection has been produced, with a knife that can be moved with a movement component perpendicular to the surface of a substrate and hence ... | 12/07/2004 |
| 6749102 | Ultrasonic welding and cutting device for use in the manufacture of a flat cable The invention relates to an ultrasonic welding and cutting device for use in the manufacture of a flat-cable. The flat cable includes a plurality of wire conductors which are arranged in parallel at a given interval with respect to each other and interposed between ... | 06/15/2004 |
