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| Number | Title | Issue Date |
| 8109431 | Method of joining articles using adjustment features A method of joining a first article to a second article using adjustment features located in an assigned scrap portion of the first article. The first article can be a casing for a turbine engine the first article being the casing skin and the second article a flang... | 02/07/2012 |
| 7527188 | Self-encapsulated silver alloys for interconnects Alloys of silver and an alloying element that diffuses to the surface of the high conductivity metal and is oxidizable to form an alloying element oxide such as beryllium are provided along with electronic structures employing the alloys and methods of fabrication. | 05/05/2009 |
| 7398911 | Structural assemblies and preforms therefor formed by friction welding A preform and method for forming a structural assembly are provided. The preform can be formed by friction welding structural members to a base member and subsequently providing a connection material to join the structural members. The resulting preform can be forme... | 07/15/2008 |
| 7370787 | Compressor rotor and method for making A method an apparatus for a gas turbine compressor rotor is provided which offers improved characteristics to the rotor when used with at least titanium IMI 834. Mechanical work is optimized through forging to provide at least improved low cycle fatigue life to the ... | 05/13/2008 |
| 7334311 | Method of forming a nested can brush seal A method of forming a brush seal which includes placing a bristle hoop sandwiched by a sideplate and a backplate in the cavity of a forming die. The components are then die formed together into a unitized brush seal. ... | 02/26/2008 |
| 7319265 | Semiconductor chip assembly with precision-formed metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal ... | 01/15/2008 |
| 7268421 | Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip a... | 09/11/2007 |
| 7264991 | Method of connecting a conductive trace to a semiconductor chip using conductive adhesive A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip that includes a conductive pad, providing a conductive trace, then disposing a conductive adhesive between the conductive trace and the chip, thereby mechanical... | 09/04/2007 |
| 7262082 | Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first encapsulant, wherein the first conductive trace includes a first metal pillar... | 08/28/2007 |
| 7232707 | Method of making a semiconductor chip assembly with an interlocked contact terminal A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7232706 | Method of making a semiconductor chip assembly with a precision-formed metal pillar A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7190080 | Semiconductor chip assembly with embedded metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line... | 03/13/2007 |
| 7182345 | Hydrodynamic brush seal A hybrid brush seal is provided having two bundles of axially spaced seal bristles each of which are mounted in a ring shape on a first machine component with bristle ends directed at a sealing surface of the second, rotating machine component. The bristle ends are ... | 02/27/2007 |
| 7132741 | Semiconductor chip assembly with carved bumped terminal A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal filler, a connection joint that electrically connects the routing line and the pad, and an enca... | 11/07/2006 |
| 7129113 | Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first encapsulant, wherein the first conductive trace includes a first metal pillar... | 10/31/2006 |
| 7129575 | Semiconductor chip assembly with bumped metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an enca... | 10/31/2006 |
| 7112521 | Method of making a semiconductor chip assembly with a bumped metal pillar A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a bumped terminal, then mechanically attaching a semiconductor chip to the metal base, the routing line and the bumped terminal, then forming an encapsulant, and the... | 09/26/2006 |
| 7094676 | Semiconductor chip assembly with embedded metal pillar A method of making a semiconductor chip assembly includes forming a routing line on a metal base, etching the metal base wherein an unetched portion of the metal base forms a pillar, mechanically attaching a semiconductor chip to the routing line and the pillar wher... | 08/22/2006 |
| 7075186 | Semiconductor chip assembly with interlocked contact terminal A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal pillar and a contact terminal, a connection joint that electrically connects the routing line and the pad, and an enc... | 07/11/2006 |
| 7071089 | Method of making a semiconductor chip assembly with a carved bumped terminal A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a metal filler, then mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the metal filler, th... | 07/04/2006 |
| 7071573 | Semiconductor chip assembly with welded metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip a... | 07/04/2006 |
| 7067911 | Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture A three-dimensional stacked semiconductor package includes first and second semiconductor chip assemblies. The first semiconductor chip assembly includes a first chip, a first conductive trace and a first encapsulant, and the first conductive trace includes a first ... | 06/27/2006 |
| 7044357 | Bump formation method and wire bonding method Bump formation method and wire bonding method including a step of forming a ball on the tip end of a wire that passes through a capillary and joining this ball to an electrode pad so as to make a press-bonded ball. In the next step, the capillary is raised and moved... | 05/16/2006 |
| 7015128 | Method of making a semiconductor chip assembly with an embedded metal particle A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip that includes a conductive pad to a routing line, mechanically attaching and electrically connecting a metal particle to the routing line, wherein the routing line ... | 03/21/2006 |
| 7009297 | Semiconductor chip assembly with embedded metal particle A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal particle, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The rout... | 03/07/2006 |
| 6953143 | Explosion welded design for cooling components A method and apparatus are described for making a coldplate. A first component of, for example copper, is explosion welded to a second component of, for example aluminum. The first metal component has a top surface opposite the second metal component and at least on... | 10/11/2005 |
| 6949408 | Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps A method of making a semiconductor chip assembly includes providing a semiconductor chip, a metal base, an insulative base and a conductive trace, wherein the chip includes a conductive pad, the metal base is disposed on a side of the insulative base that faces away... | 09/27/2005 |
| 6918529 | Method for producing metal/ceramic bonding circuit board After copper plates 14 are bonded to both sides of a ceramic substrate 10 via a brazing filler metal 12, UV curing alkali peeling type resists 16 are applied on predetermined portions of the surfaces of the copper plates 14 to etch... | 07/19/2005 |
| 6908788 | Method of connecting a conductive trace to a semiconductor chip using a metal base A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip, a conductive trace and a metal base, wherein the chip includes a conductive pad, and the conductive trace is disposed between the metal base and the chip, then... | 06/21/2005 |
| 6848608 | Method of bonding sputtering target materials A method of forming a sputtering target is described that involves bonding a backing plate onto a casement having one or more recesses that contain target material to form a bonded target. During the bonding process, the bonded target is optionally vacuum sealed wit... | 02/01/2005 |
| 6793831 | Microlamination method for making devices A method for fabricating devices in a pre-assembled state comprising forming plural laminae, registering the laminae, and bonding the laminae one to another is described. The plural laminae contain the substructures and structures of the device. The substructures ar... | 09/21/2004 |
| 6632118 | Method of connecting workpieces The invention relates to a method of connecting workpieces which is suitable notably for connecting an anode rod (5) to an end plate (6) of a rotor sleeve (7) in a rotary anode X-ray tube where on the one hand adequate strength is required and on the othe... | 10/14/2003 |
| 6378756 | Solder ball arrangement device A solder ball arrangement device has a thin arrangement plate having a plurality of through-holes of a truncated pyramid shape, a porous member bonded to the arrangement plate, and a housing member for receiving the arrangement plate and the porous member... | 04/30/2002 |
| 6164904 | Assembly for brazing a stator component of a gas turbine engine and method brazing articles such as an abradable material to a stator of a gas turbine engine A method and assembly useful in metal joining processes is disclosed which blocks the deposition of molten metal in openings. The method and assembly employs mica material with a binder to block the flow of molten metal. In one detailed embodiment, the mi... | 12/26/2000 |
| 6158646 | Weld bead chopper A weld bead chopper is provided, for use in combination with a scarfing tool which is intended to scarf a longitudinal weld bead from a tube. The chopper has a) a chopper blade which is rotatable about an axis which is substantially perpendicular to a lon... | 12/12/2000 |
| 5815904 | Method for making a stent The present invention relates to a method for manufacturing a tubular medical device for insertion in a body. The method includes the step cutting a plurality of cross-sectional pieces or layers from a flat sheet. The pieces are cut so as to define inner ... | 10/06/1998 |
| 5655702 | Sacrificial bonding and forming aid for platelet assemblies Platelet assemblies are formed from bondable platelets, such as diffusion-bondable, brazable, or adhesive-bondable platelets, with void regions in the platelets to form channels or open spaces in the finished platelet assembly. To improve the response of ... | 08/12/1997 |
| 5571428 | Semiconductor leadframe and its production method and plastic encapsulated semiconductor device A method of producing a leadframe for use in semiconductor devices, comprises the steps of forming a space between leads 1a and 1b which are to be overlapped and welded each other, and welding the leads at a region including the space and melting and cutt... | 11/05/1996 |
| 5207371 | Method and apparatus for fabrication of three-dimensional metal articles by weld deposition In a method and apparatus for forming a three-dimensional object, successive layers of metal are welded together to build the object. After each layer is formed a complementary material is placed adjacent the layer. In this manner, layers of material form... | 05/04/1993 |
| 5098008 | Fine pitch leaded component placement process A method of mounting an integrated circuit carrier (10) having a plurality of straight leads (12) retained by an integral frame (16) is provided. The plurality of straight leads (12) of the carrier (10) is bent to form a plurality of bent leads (12) still... | 03/24/1992 |
