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| Number | Title | Issue Date |
| 8025204 | Method of wire bond encapsulation profiling A method for profiling a bead of encapsulant extending along an edge of a die mounted to a supporting structure, by depositing a bead of encapsulant onto wire bonds along the edge of the die, positioning a profiling surface over the die at a predetermined spacing fr... | 09/27/2011 |
| 7988033 | Method of reducing wire bond profile height in integrated circuits mounted to circuit boards A method of profiling a wire bond between a contact pad on a die, and a conductor on a supporting structure, by electrically connecting the contact pad on the die to the conductor on the supporting structure with a wire bond, the wire bond extending in an arc from t... | 08/02/2011 |
| 7905387 | Method of manufacturing expansion joint A method of manufacturing an expansion joint includes steps of: marking parts, which will form the expansion joint, on a piece of raw material, so that the original 360 degree shape of the expansion joint is equally divided by the parts, and cutting the marked parts... | 03/15/2011 |
| 7802715 | Method of wire bonding an integrated circuit die and a printed circuit board A method of profiling a series of wire bonds between a line of contact pads on a die, and a corresponding set of conductors on a supporting structure. The method involves electrically connecting each of the contact pads on the die to a corresponding conductor on the... | 09/28/2010 |
| 7669751 | Method of forming low profile wire bonds between integrated circuits dies and printed circuit boards A method of profiling a series of wire bonds between a line of contact pads on a die, and a corresponding set of conductors on a supporting structure, by electrically connecting each of the contact pads on the die to a corresponding conductor on the supporting struc... | 03/02/2010 |
| 7441691 | Method for the production of parts by means of diffusion bonding and superplastic forming, and mold for carrying out said method A method for producing parts including at least one internal cavity. In the method at least two metal sheets are diffusion bonded; then the bonded metal sheets are bent; and then each of internal cavities is inflated by superplastic forming. The method is carried ou... | 10/28/2008 |
| 7337518 | Method of fabricating titanium lined composite cookware A Cooking vessel has an interior lining of titanium or an allow thereof. The bottom is optionally formed of anodized aluminum as the titanium walls withstand the corrosive environment of the anodizing bath. The titanium lining is more resistant to corrosion, stainin... | 03/04/2008 |
| 7310984 | Forming apparatus for precambered metal sections A forming apparatus (50) includes a roll former (51) operative to roll form a metal strip (100) to form a profiled metal section (10) of generally C section profile including a pan (12) and a pair of upstanding edge margins (14 | 12/25/2007 |
| 7244344 | Physical vapor deposition plasma reactor with VHF source power applied through the workpiece A physical vapor deposition plasma reactor includes a vacuum chamber including a sidewall, a ceiling and a wafer support pedestal near a floor of the chamber, and a vacuum pump coupled to the chamber, a process gas inlet coupled to the chamber and a process gas sour... | 07/17/2007 |
| 7215021 | Electronic device The conductor wire surface for constituting a circuit formed by print or junction on a substrate formed from a composite member of ceramics, resin, and an inorganic member and from a resin member is coated with glass, resin, solder, or silver paste, thus the corrosi... | 05/08/2007 |
| 7208231 | Bonded metal components having uniform thermal conductivity characteristics and method of making same Cookware having improved uniform heat transfer over the entire cross section thereof, the cookware formed from a multi-layered composite metal having a layer of stainless steel roll bonded at or near the core of the composite. The stainless layer is roll bonded to l... | 04/24/2007 |
| 7182672 | Method of probe tip shaping and cleaning Methods are provided for shaping, maintaining the shape of, and cleaning a probe tip using a pad such as a multi-layer adhesive and abrasive pad. The multi-layer adhesive and abrasive pad may be formed from layers of adhesive material having abrasive particles in-be... | 02/27/2007 |
| 7168606 | Method of mitigating inner diameter reduction of welded joints Aspects of the present invention provide methods and apparatus for connecting two tubulars using a welding process with reduced inner diameter flash. The method includes connecting an end of a first expandable tubular to an end of a second expandable tubular using a... | 01/30/2007 |
| 7165325 | Welding material, gas turbine blade or nozzle and a method of repairing a gas turbine blade or nozzle A welding material composition, which is a nickel based super alloy having γ′ phase and chromium carbides precipitated. The composition comprising 18 to 25% by weight of Co, 15 to 20% by weight of Cr, 1.5 to 5.5% by weight of Al, 5 to 14% by weight of W, 0.05 to ... | 01/23/2007 |
| 7163121 | High temperature isostatic pressure bonding of hollow beryllium pressure vessels using a bonding flange A bond joint and process of bonding metal parts to one another to form seamless, hollow metal articles, particularly made from beryllium. Tooling is assembled to the parts, prior to hot pressing, to cause pressure to be applied to flanges that extend peripherally fr... | 01/16/2007 |
| 7124496 | Method of manufacturing head suspension for disk drive A head suspension for a disk drive has a base plate (19) to be attached to a carriage of the disk drive and a load beam (21) consisting of a rigid part (27) and a resilient part (29), to apply load onto a slider. The rigid part and resili... | 10/24/2006 |
| 7121806 | Welding method and an assembly formed thereby A method of welding and an assembly formed thereby, according to which a first member is formed with a first thickness and a second thickness greater than the first thickness. The first member is welded to a second member and a toe is formed in at least one wall of ... | 10/17/2006 |
| 7090309 | Variable wall thickness trailer axles An axle assembly is provided having a varying wall thickness resulting in an axle assembly that is lightweight yet has sufficient strength and stiffness. The axle assembly includes a tube disposed about a longitudinal axis and having first and second end portions an... | 08/15/2006 |
| 7031117 | Modular rotary actuator assembly for a rotatable media data storage device Assemblies in accordance with the present invention can access a data storage medium having one or more disks. One such assembly comprises a mounting block including a bore and spacer, an arm stack connected with the top surface of the spacer, and a bottom arm conne... | 04/18/2006 |
| 7028717 | Water stop for a loop installation in a pre-insulated pipeline A high temperature pre-insulated piping system is shown which has a special water stop located along the length of the piping. The water stop has an internal disk which forms a pair of isolated chambers within the water stop. The internal disk is formed of a materia... | 04/18/2006 |
| 7021523 | Tool and a method for creating a tool A method for forming a tool 10 and a tool 10 which is comprised of several selectively coupled sectional members, such as members 12, 16, which are placed upon a heat resistant surface 20. A sealing material 24, such as copper in a... | 04/04/2006 |
| 7017249 | Apparatus and method for forming a tube having an article attached thereto In the present invention, at least one tubular blank and at least one article such as a metal stamping, to be attached to a hydroformed part, are loaded into a die. The tube is hydroformed using typical methods. The article is positioned in the die such that, when t... | 03/28/2006 |
| 6978807 | Water stop for a line installation in a pre-insulated pipeline A high temperature pre-insulated piping system is shown which has a special water stop located along the length of the piping. The water stop has an internal disk which forms a pair of isolated regions within the water stop. The internal disk is formed of a material... | 12/27/2005 |
| 6965245 | Prefabricated and attached interconnect structure A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and seperate from the larger structure enables the use of economic mass fabr... | 11/15/2005 |
| 6955982 | Flip chip C4 extension structure and process An electrical structure, and associated method of fabrication, for reducing thermally induced strain in a structure that couples a first conductive body of a first substrate to a second conductive body of a second substrate (e.g., a chip to a chip carrier; a chip ca... | 10/18/2005 |
| 6921016 | Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment A tip of a wire is bonded to a first electrode by using a tool. The wire is drawn from the first electrode to a bump on a second electrode. Apart of the wire is bonded to the center of the bump or a portion of the bump beyond the center in a drawing direction of the... | 07/26/2005 |
| 6916439 | Colored laminate and a method for coloring the surface of a membrane In this method, a fibrous material is embedded between the surfaces of a membrane and a dissimilar coloring material as the mating surfaces of the membrane and the coloring material are cured or cosolidify. This results in an encapsulation bond where fibers embedded... | 07/12/2005 |
| 6866942 | Press-forming tailored blank material excellent in formability and production method therefor There is provided a tailored blank article for press forming, the article having an excellent formability and comprising multiple different plates of different thickness, which can evade a break of a low strength plate (or low-thickness plate) due to strength rate-d... | 03/15/2005 |
| 6848608 | Method of bonding sputtering target materials A method of forming a sputtering target is described that involves bonding a backing plate onto a casement having one or more recesses that contain target material to form a bonded target. During the bonding process, the bonded target is optionally vacuum sealed wit... | 02/01/2005 |
| 6805276 | Deposit metal welding method To prevent decreases in fatigue strength of a base material by relieving the residual stress of a weld. A method for welding a deposit metal to a base material with reduced residual stress, comprising a step of welding a deposit metal to a base material; and a step ... | 10/19/2004 |
| 6800150 | Manufacturing process for an element of a chemical device comprising a support part in metal and an anticorrosion metallic coating The aim of the present invention is a manufacturing process for assembly parts (101, 102, 111, 112) for the manufacture of elements of chemical devices (100), comprising the fixation of an anticorrosion metallic coating (31, 32) on an unprocesse... | 10/05/2004 |
| 6622903 | Production of a tailless ball bump A method of producing a ball bump on a workpiece employs a capillary having a passageway therethrough. A wire extends through the passageway and has a ball formed on its end below the capillary. The capillary is positioned above a bond site and is lowered... | 09/23/2003 |
| 6543114 | Manufacturing system using solder self-alignment with optical component deformation fine alignment A process for assembling micro-optical systems, such as optoelectronic and/or fiber optic components uses solder self-alignment to achieve a coarse, passive alignment of optical components relative to the optical bench. The fine, final alignment is perfor... | 04/08/2003 |
| 6530514 | Method of manufacturing heat transfer tubes The invention relates to a method of manufacturing heat transfer tubes for a heat exchanger such as an automobile radiator. The tubes are preferably formed of copper or a copper alloy. A sheet of the material is folded into a shape that resembles a B and ... | 03/11/2003 |
| 6527163 | Methods of making bondable contacts and a tool for making such contacts A method of making bondable contacts on a microelectronic element includes providing a microelectronic element having one or more die pads on a first face thereof and depositing conductive bonding material, such as gold, atop each die pad. The conductive ... | 03/04/2003 |
| 6527160 | Method of producing metal composites which can be processed at high temperatures A method whereby a composite clad metal ingot can be produced for onward processing at higher temperatures which are sufficient to allow the properties of the substrate material to be adequately controlled to meet specific requirements. These higher tempe... | 03/04/2003 |
| 6513219 | Method for producing a ring collar, notably for a clutch mechanism in particular for a motor vehicle A method for making a frustro-conical ring collar by providing a metal band, helically winding the band, cutting off a length of the band which corresponds to one lead of the helix, axially acting on the two ends of the band length to place them in facing... | 02/04/2003 |
| 6499646 | Fusion welded liquefiable gas cylinder with overpressure protection heads and method for making the same A liquefiable gas pressure cylinder and method for making the same with the cylinder including a cylindrical shell, and heads fusion welded at opposites ends of the shell. The side ends where the heads are joined to the shell are crimped radially inward t... | 12/31/2002 |
| 6426153 | Tailored blank A tailored blank is provided by welding a pair of constituent parts to one another in juxtaposition. The parts are laser welded together to form a unitary blank that is subsequently formed into a shaped finished component.... | 07/30/2002 |
| 6419806 | Insert target assembly and method of making same Method of forming a two-piece hollow cathode sputter target assembly and the assembly formed thereby. The sputter target assembly includes an outer shell having a substantially cylindrical side wall and is composed of a relatively low purity metallic mate... | 07/16/2002 |
