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| Number | Title | Issue Date |
| 7134590 | Desoldering sheath A desoldering sheath that comprises at least one hollow metal wire molded to conform to the tip of a desoldering tool. In one implementation, the desoldering sheath is formed using a hollow metal wire that is coiled around a male cone-shaped mold. The coiled, hollow... | 11/14/2006 |
| 7004371 | Gripper and method for detaching packaged chip from PCB A gripper for detaching a packaged chip from a PCB. The gripper comprises a plurality of hooks, elastic slices, and a heating device. These hooks are used for gripping and hooking the packaged chip. Each hook includes a chip-upholding part and a chip-gripping part, ... | 02/28/2006 |
| 6935550 | Robotic positioner A robotic positioner for use with an automated processing system, such as an automated welding system, for example, includes a base, a support structure rotatably supported on the base, and at least one work surface supported on the support structure suitable for su... | 08/30/2005 |
| 6681980 | Structure of soldering iron tip A tip of a soldering iron is provided which separates any solder bridge, sucks up excess solder, and performs normal soldering operation. The tip has a cutter blade-like portion with its edge inclined. Grooves are formed on both side surfaces of the cutte... | 01/27/2004 |
| 6419148 | System for forming bumps on wafers A system and method for forming bumps on an integrated circuit including a scanning direct laser imager employed to selectably expose a photosensitive layer deposited on an integrated circuit substrate, thereby to define regions overlying selected portion... | 07/16/2002 |
| 6392202 | Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer An object of the present invention is to provide a bump-bonding heating apparatus, a bump bonding method and a bump forming apparatus which do not involve large-sized apparatus configuration and which are easy to handle, and a semiconductor wafer in which... | 05/21/2002 |
| 6386433 | Solder ball delivery and reflow apparatus and method An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrat... | 05/14/2002 |
| 6227437 | Solder ball delivery and reflow apparatus and method of using the same An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrat... | 05/08/2001 |
| 6138890 | Automatic soldering mechanism capable of improving a working efficiency with stabilizing a soldering quality An automatic soldering mechanism is for jetting a solder jet flow to a printed-circuit board to carry out a soldering of the printed-circuit board. The automatic soldering mechanism comprises a solder tank for storing a molten solder and a solder jetting ... | 10/31/2000 |
| 6098868 | Bump forming method and bump bonder A bump forming method comprising a first step of forming a ball (5) at a distal end of a wire (4) which protrudes from a lower end of a capillary (12); a second step of opening a damper (11) which securely holds the wire (4) above the capillary (12) and b... | 08/08/2000 |
| 5735452 | Ball grid array by partitioned lamination process A method for forming a ball grid array to provide a chip carrier with I/O capabilities is described. The method includes combining three distinct steps into one: partitioning a solder sheet into identical solder pieces using a mask provided with openings ... | 04/07/1998 |
| 5653381 | Process and apparatus for producing a bonded metal coating A process and apparatus is available for producing a bonded metal coating. older material constructed so as to form a solder material shaped body (18) is transported by means of an energy transfer device (13), which is guided in a capillary tube (12) and w... | 08/05/1997 |
| 5573170 | Bump forming apparatus In an apparatus for punching a metallic sheet to stamp out a bump and bonding it to a substrate, an AuSn sheet is heated to above a softening point thereof by a heater. A solenoid is energized to cause a punch and a die to stamp out a bump from the AuSn s... | 11/12/1996 |
| 5516032 | Method for forming bump electrode The invention relates to a method for forming bump electrodes on an electronic part such as a chip or a substrate. Conventional methods for forming bump electrode had a factor causing high cost, but with the invention, instead of solder balls, low cost so... | 05/14/1996 |
| 4944446 | Automatic preform dispenser A method and apparatus for feeding preform wire into a preform dispenser, cutting a piece of preform, transferring the preform to a location over an integrated circuit ceramic package, and placing the preform in the package prior to placing and attaching ... | 07/31/1990 |
| 4832246 | Automatic soldering machines An automatic spot soldering machine incorporates apparatus for automatically sequencing through operations for forming soldered joints at a predetermined position. The sequence includes preforming a quantity of solder from a length of solder wire and posi... | 05/23/1989 |
| 4668292 | Vehicle traction material and bag therefor A vehicle traction material comprises a water scavenging agent such as an oxide, and a parting agent such as a stearate or oleate for keeping the material noncaking and free flowing. A relatively dense abrasive agent in either powdery or granular form imp... | 05/26/1987 |
| 4663815 | A method and apparatus for surface mount compatible connector system with mechanical integrity An electrical component for mechanical mouting and electrical connection with respect to plated through holes of a printed circuit board compatibly with a surface mount attaching process includes an electrically non-conducting body, plural generally elong... | 05/12/1987 |
| 4231505 | Method and apparatus for producing solar collector panels A method of and apparatus for fabricating a solar collector panel including providing a thermal conductive, heat absorbing plate having a plurality of grooves therein, feeding discrete lengths of solder strips having transverse curvatures into said groove... | 11/04/1980 |
| 3978569 | Apparatus for applying solder rings to terminal posts An apparatus consisting of a pair of rollers with tangentially meeting perimeters for crimping successive portions of a continuous strip of solder into rings around a strip of terminal posts carried in parallel manner upon a common carrier strip. The roll... | 09/07/1976 |
| 3958742 | Manufacture of supports for semiconductor devices Apparatus in which gold tape is to be servered and placed on selected parts of support members of supports for semiconductor devices has means to feed the tape to severing means including a reciprocatable dog to engage the tape. The dog may pierce or inde... | 05/25/1976 |
