Bizarre Patents
Crispy Chip Sandwich and Process of Producing a Sandwich Product
A food product comprising a multilayer cookie or snack having outer layers formed from a crispy type edible food product such as a potato chip or corn chip, etc. with an intermediate marshmallow layer being in contact with the inner surface of each crispy chip and one or more filler substances.
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| Number | Title | Issue Date |
| 7988029 | External deburring of welded pipe An external weld bead is removed and processed from a welded pipe traveling in a downstream direction. The weld bead is separated from the pipe, allowed to flow in a downstream direction, and is guided downstream and cut into chips at a location downstream of where ... | 08/02/2011 |
| 7942306 | Friction stir welding tool having a counterflow pin configuration A friction stir welding tool having one or more tapered flats for promoting flow of weld material toward the pin terminus and one or more counter-spiraling channels or threads which for promoting flow of the weld material toward the tool shoulder. ... | 05/17/2011 |
| 7753251 | Micro component removing apparatus A method and a apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surfac... | 07/13/2010 |
| 7748594 | Solder repairing apparatus and method of repairing solder A solder repairing apparatus includes a stage designed to place the surface of at least a specific part of an object along a reference plane within a specific spot defined on the stage. A heating unit applies a thermal energy to the specific spot. A dividing plate i... | 07/06/2010 |
| 7575146 | Selective rework apparatus for surface mount components An apparatus for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be remov... | 08/18/2009 |
| 7222772 | Flip chip bonder A flip chip bonder including a substrate holding mechanism and a chip die bonder for bonding a semiconductor chip having a plurality of electrodes projecting from its front surface to a substrate held on the substrate holding means. The flip chip bonder includes a c... | 05/29/2007 |
| 7168609 | Method and apparatus for removing known good die A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connect... | 01/30/2007 |
| 7152776 | Friction stir welding using a superabrasive tool A probe for friction stir welding MMCs, ferrous alloys, non-ferrous alloys, and superalloys, as well as non-ferrous alloys, the probe including a shank, a shoulder, and a pin disposed through the shoulder and into the shank, wherein the pin and the shoulder at least... | 12/26/2006 |
| 7124929 | Friction stir welding of metal matrix composites, ferrous alloys, non-ferrous alloys, and superalloys using a superabrasive tool A probe for friction stir welding MMCs, ferrous alloys, non-ferrous alloys, and superalloys, as well as non-ferrous alloys, the probe including a shank, a shoulder, and a pin disposed through the shoulder and into the shank, wherein the pin and the shoulder at least... | 10/24/2006 |
| 7104102 | Bending machine for profiles such as reinforcement round pieces or similar Bending machine (10) to obtain shaped elements from pre-cut profiles (11), equipped with a drawing assembly (14) which draws the profiles (11), first shearing means (13) arranged downstream of the drawing assembly (14) and b... | 09/12/2006 |
| 7051916 | Friction stir welding method The end of a hollow member 10 is abutted against the end of a hollow member 20. The end of a face plate 21 is supported on a protrusion 15. A small-diameter portion 52 of a rotary tool 50 is inserted into the abutted area, a... | 05/30/2006 |
| 6942137 | Die removal method and apparatus A method and apparatus for separating a semiconductor device from a substrate in a fixture with a shearing element, wherein the semiconductor device is attached to the substrate by solder connections to form an assembly, includes using the shearing element to apply ... | 09/13/2005 |
| 6913182 | Method and apparatus for controlled application of flux Apparatus and methods for applying atomized pulsed streams of flux to a surface such as a printed circuit board. The flux is applied discretely in selected locations and at selected thickness based upon pulse rate, fluid pressure, air pressure and traverse speed. Th... | 07/05/2005 |
| 6905058 | Bonding tool and wire bonder Bonding tool for ultrasonic wire bonding, with a knife (3) that is inserted into or closely apposed to the bonding tool so as to be longitudinally movable with respect thereto, in order to cut a projecting part of a bonded wire immediately behind a bonded con... | 06/14/2005 |
| 6880742 | Separating seam welding device Shown is a device and a process for the simultaneous separating and welding of foils or foil tubes (5) where the device comprises at least one welding terminal (2) and an opposing terminal (3), | 04/19/2005 |
| 6827248 | Cutting device for bonded wires Bond-wire cutting device for cutting off the part of a bond wire that extends beyond the bonding contact area after a bonded connection has been produced, with a knife that can be moved with a movement component perpendicular to the surface of a substrate and hence ... | 12/07/2004 |
| 6776325 | Electronic components carrier for collecting electronic components dropping from a circuit board and related method An electronic component carrier includes a frame, a circuit board clamp fixed to the frame for clamping a circuit board, a vibrating device for vibrating the circuit board while the circuit board is carried through a reflow oven and the temperature inside the reflow... | 08/17/2004 |
| 6745932 | Low strain chip removal apparatus A method and structure for a chip detach apparatus and method that limits the solder ball maximum shear rate and, more particularly, that delays the application of shear force until a minimum predefined temperature is reached. The chip detach apparatus and method ca... | 06/08/2004 |
| 6719188 | Rework methods for lead BGA/CGA A method and apparatus are provided for reworking electronic component assemblies where the components are joined by solder interconnections. A cutting device employing a heated wire, blade or other cutting element is forced against and through the solder interconne... | 04/13/2004 |
| 6712261 | Solid conductive element insertion apparatus An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to ... | 03/30/2004 |
| 6681352 | Method for testing damaged integrated circuits A method for testing packaged integrated circuits (ICs) having bent or broken leads. A lower portion of each lead is cut to leave a stub located close to the package body of the damaged IC. The damaged IC is then mounted onto a probe card having upward-fa... | 01/20/2004 |
| 6612477 | Strip joining apparatus A strip joining apparatus is provided wherein a time which a line is stopped is shortened, a number of installation spaces is decreased and precise notching may be performed. The strip joining apparatus comprising a first carriage 3 comprising a shearing ... | 09/02/2003 |
| 6540126 | Clamping band manufacturing machine and method of manufacturing clamping band The clamping band manufacturing machine is capable of full-automatically manufacturing the clamping bands and highly increasing the manufacturing efficiency. The machine comprises a main machine part and parts feeding mechanisms. In the main machine part,... | 04/01/2003 |
| 6513696 | Wedge bonding head The present invention provides a bonding head for a wedge wire bonding apparatus in which the bonding force of the transducer assembly, and also the clamping force of the wire clamping assembly are provided by permanent magnet motors including a coil form... | 02/04/2003 |
| 6497357 | Apparatus and method for removing interconnections A method for removing at least one molten or solid structure from a surface including: placing the surface with the at least one molten or solid structure in a fixture; disposing said wiper assembly acted on by a bias proximate the at least one molten or ... | 12/24/2002 |
| 6415975 | Determination of quality of bonding between a conductive ball and a conductive pad within an IC package The quality of bonding between a conductive ball and a conductive pad of a lead frame strip of an IC package are determined by etching the conductive ball from the conductive pad, and analyzing the bottom view of the conductive ball. The conductive ball i... | 07/09/2002 |
| 6409069 | Apparatus for manufacturing unit elements for chip components, and chip components mounting structure A chip component is manufactured through a step of burning a unburned unit element made of ceramics having prism-shaped parts at its ends, a step of polishing the edges of the burned unit element, and a step of forming a resistor conductor, an electrode c... | 06/25/2002 |
| 6386433 | Solder ball delivery and reflow apparatus and method An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrat... | 05/14/2002 |
| 6352787 | Method for producing an insulating pack for an insulating part The invention relates to a method for producing an insulating pack (10), according to which a stack (9) of metallic lamellae is cold-welded simultaneously along a predefined contour and separated from a remaining area. The insulating pack produced accordi... | 03/05/2002 |
| 6345425 | Rollformer with transverse scorer An apparatus includes a scoring device for making transverse score lines on a roll of sheet material, a dimpler device or dimpler roller for making dimples adjacent the score lines at predetermined width locations, and a rollformer adapted to continuously... | 02/12/2002 |
| 6276588 | Insert-type cutting blade for ultrasonic bonding wire termination A cutting blade assembly for an ultrasonic wire bonding machine has a replaceable carbide cutting blade so that the entire blade assembly need not be replaced after a given amount of blade wear.... | 08/21/2001 |
| 6227437 | Solder ball delivery and reflow apparatus and method of using the same An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrat... | 05/08/2001 |
| 6216937 | Process and apparatus to remove closely spaced chips on a multi-chip module A process and apparatus for removing flip chips with C4 joints mounted on a multi-chip module by applying a tensile force to one or more removal member bonded to the back of one or more flip chips during heating of the module to a temperature sufficient t... | 04/17/2001 |
| 6179196 | Apparatus for manufacturing circuit boards Apparatus for connecting a first area array component to a substrate with a joining material. The apparatus has a nozzle directing heat toward both the first area array component and the portion of the substrate beneath the first area array component to m... | 01/30/2001 |
| 6169268 | Method and apparatus for forming the ends of metallic tubes A method and apparatus for forming constricted ends on tube products on an automatic continuous basis. The apparatus includes a feeding station including a spindle for supporting a metallic tube. A forming station is positioned downstream from the feeding... | 01/02/2001 |
| 6158646 | Weld bead chopper A weld bead chopper is provided, for use in combination with a scarfing tool which is intended to scarf a longitudinal weld bead from a tube. The chopper has a) a chopper blade which is rotatable about an axis which is substantially perpendicular to a lon... | 12/12/2000 |
| 6073324 | Apparatus for cutting sheet metal disc from and welding sheet metal disc to sheet metal An apparatus for cutting sheet metal discs (31) from and welding sheet metal discs (31), or other smooth-contoured sheet metal pieces, to a sheet metal strip (20) or other workpiece, particularly an endless sheet metal strip, e.g., in a double-strip press... | 06/13/2000 |
| 5961025 | Ultrasonic wave splicing device An apparatus for splicing a trailing edge of a first web currently used for a web product with a leading edge of a second web to be used after the first web, comprises a cutting device for cutting the first and second web simultaneously on the superimpose... | 10/05/1999 |
| 5961026 | Apparatus and method for removing known good die using hot shear process Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed pro... | 10/05/1999 |
| 5957368 | Method of continuously hot rolling steel pieces A continuous hot rolling method is available for continuously hot finish rolling steel pieces. The trailing end of a preceding steel piece and the leading end of a succeeding steel piece are cut by a drum shear which sandwiches the steel piece between its... | 09/28/1999 |
