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"What, sir, would you make a ship sail against the wind and currents by lighting a bonfire under her deck? I pray you, excuse me, I have not the time to listen to such nonsense."
Napoleon Bonaparte ; When told of the Robert Fulton steamboat
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| Number | Title | Issue Date |
| 7371615 | Heat sink and method for its production A method for producing a heat sink for cooling a semiconductor device including forming plural base members, the base member being each in plate or block-shape, the base member each having paths shaped on one or both sides of surfaces thereof, and the base member ea... | 05/13/2008 |
| 7362580 | Electronic assembly having an indium wetting layer on a thermally conductive body Embodiments include electronic packages and methods for forming electronic packages. One method includes providing a die and a thermal interface material on the die. A metal body is adapted to fit over the die. A wetting layer of a material comprising indium is form... | 04/22/2008 |
| 7340828 | Method for producing metal/ceramic bonding circuit board There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required to carry out etching, when a molten metal is caused to contact to a c... | 03/11/2008 |
| 7331499 | Manufacturing method for a ceramic to metal seal A method of bonding a ceramic part to a metal part by heating a component assembly including the metal part, the ceramic part, and a thin essentially pure interlayer material placed between the two parts heated at a temperature that is greater than the temperature o... | 02/19/2008 |
| 7332792 | Magnetic layer processing A dielectric layer is formed over a substrate comprising a semiconductor material. A magnetic layer is formed over the dielectric layer. The magnetic layer comprises an amorphous alloy comprising cobalt. ... | 02/19/2008 |
| 7329837 | Ceramic igniters Ceramic igniters are provided that comprise at least three zones of differing electrical resistance, preferably in sequence a first conductive zone of relatively low resistance, a power booster or enhancement zone of intermediate resistance, and a further hot or ign... | 02/12/2008 |
| 7328830 | Structure and method for bonding to copper interconnect structures An integrated circuit structure and a method for fabricating the structure. The method comprises forming a copper bond pad for attaching the integrated circuit to a package. Copper oxide is removed from the pad by reduction in a hydrogen ion atmosphere. For attachin... | 02/12/2008 |
| 7312563 | Short arc lamp According to the present invention, a short arc lamp comprises a lamp main body having a reflective surface therein, a first opening on an optical axis thereof, and a second openings, a window member provided so as to close the second opening and to define a dischar... | 12/25/2007 |
| 7293689 | Two tier brazing for joining copper tubes to manifolds A brazing process for joining copper and copper alloy tubes to a fitting which includes first forming a layer of a high melting temperature noble metal on one end of a copper or copper alloy tube. The plated end is then brazed to a metal ferrule to form a copper all... | 11/13/2007 |
| 7285858 | Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate A confronting surface of a substrate faces a first surface of a semiconductor element. Extension layers are formed on the substrate at positions facing electrodes on the semiconductor element. A levee film is disposed on one of the confronting surface and the first ... | 10/23/2007 |
| 7270548 | Electrical connector and method for connecting it to the glass pane of a motor vehicle An electrical connector for electrical devices such as heating panels, antennas, or the like that are provided on glass panes on motor vehicles, having at least one soldering area to be soldered onto the glass pane and having a connector area joined electrically con... | 09/18/2007 |
| 7249411 | Methods for mounting surface-mounted electrical components Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. E... | 07/31/2007 |
| 7247975 | Thin-film piezoelectric element and method of making same Provided is a thin-film piezoelectric element which reduces the influence of an oxide film left on the electrode film on the degradation of element characteristics, and a method of making the thin-film piezoelectric element. The thin-film piezoelectric element has Z... | 07/24/2007 |
| 7241975 | Igniter systems with associated lead frame Resistive igniter systems are provided that comprise a metal substrate with an associated resistive igniter element in electrical connection through braze applied to the metal substrate. Igniter systems of the invention can enable significantly simplified manufactur... | 07/10/2007 |
| 7173823 | Fluid cooled electrical assembly A heat producing, fluid cooled assembly that includes a housing made of liquid-impermeable material, which defines a fluid inlet and a fluid outlet and an opening. Also included is an electrical package having a set of semiconductor electrical devices supported on a... | 02/06/2007 |
| 7161806 | Heat sink and method for its production The present invention provides a liquid-cooling type heat sink which has a high pressure-resistibility and is resistible against the corrosion or erosion-corrosion or electrolytic etching, and a method for its production. The heat sink of the present inventio... | 01/09/2007 |
| 7156283 | Method for making a solder between metallic balls of an electronic component and mounting lands of a circuit and soldering furnace therefor A method for producing a soldered joint between the metal balls present in either a ball grid array or a chip-scale package, and the receiving pads for a circuit printed on a substrate or the receiving pads of an integrated circuit. Solder cream or an adhesive flux ... | 01/02/2007 |
| 7128528 | Bearings for COrefrigerant compressor use, compressor using the same, and applications of the same The object of the present invention is to provide: high-reliability and long-life CO2 refrigerant compressor-use bearings that uses bearing materials high in wear resistance and in baking resistance, and; such a compressor, air conditioner, refrigerator, ... | 10/31/2006 |
| 7121717 | Ceramic element for a watch case and process for manufacturing this element This ceramic element, the visible surface of which includes features, is intended to be fitted onto a watch case. This visible surface has, at each feature, a hollow having the shape of said feature, with a depth at least equal to 0.05 mm, the side walls of said hol... | 10/17/2006 |
| 7118942 | Method of making atomic integrated circuit device A method of mass-producing a solid state device comprises providing an atomically smooth, solid state material layer no more than 40 Angstroms thick. This layer is uniformly and defect-freely bonded onto a substrate to provide an acceptable device yield. ... | 10/10/2006 |
| 7110241 | Substrate A substrate has a base, an intermediate layer, a conductive layer, and conductive films. The base is a ceramic insulator. The intermediate layer is on a main surface of the base. The conductive layer is on the intermediate layer. The conductive films are on the cond... | 09/19/2006 |
| 7087846 | Pinned electronic package with strengthened conductive pad An electronic package and information handling system utilizing same wherein the package substrate includes an internally conductive layer coupled to an external pad to provide reinforced adhesion of the pad to the substrate to substantially prevent cracking, separa... | 08/08/2006 |
| 7084350 | Green ceramic insert, ceramic insert, ceramic green body or green body composite and ceramic laminated composite produced thereby A green ceramic insert having a green ceramic body provided with a recess extending through the ceramic body is provided, the recess being filled with a paste which may be converted into an electrical plated hole. A ceramic insert made from a sintered green ceramic ... | 08/01/2006 |
| 7069645 | Method for producing a circuit board A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removin... | 07/04/2006 |
| 7036711 | PROCESS FOR THE MANUFACTURE OF METAL-CERAMIC COMPOUND MATERIAL IN PARTICULAR METAL-CERAMIC SUBSTRATES AND METAL-CERAMIC COMPOUND MATERIAL ESPECIALLY METAL-CERAMIC SUBSTRATE MANUFACTURED ACCORDING TO THIS PROCESS In a process for the manufacture of metal-ceramic compound material, especially metal-ceramic substrates, bonding compounds in the form of a plate-shaped ceramic substrate and an oxidized metal foil are bonded together by means of heating to a processing temperature... | 05/02/2006 |
| 7011991 | Method of making atomic integrated circuit device A method of mass-producing a solid state device comprises providing an atomically smooth, solid state material layer no more than 40 Angstroms thick. This layer is uniformly and defect-freely bonded onto a substrate to provide an acceptable device yield. ... | 03/14/2006 |
| 6986453 | Manufacturing method for a ceramic to metal seal The invention is a method of bonding a ceramic part to a metal part by heating a component assembly comprised of the metal part, the ceramic part, and a very thin essentially pure interlayer material of a compatible interlayer material placed between the two parts a... | 01/17/2006 |
| 6974070 | Joining of advanced materials by superplastic deformation A method for utilizing superplastic deformation with or without a novel joint compound that leads to the joining of advanced ceramic materials, intermetallics, and cermets. A joint formed by this approach is as strong as or stronger than the materials joined. The me... | 12/13/2005 |
| 6960487 | Method for manufacturing a dynamic quantity detection device A method for manufacturing a dynamic quantity detection device includes bonding a semiconductor chip that includes a detection element for detecting a dynamic quantity to a stand using a bonding layer. Initially, a semiconductor chip is formed that includes a detect... | 11/01/2005 |
| 6950575 | Optical module and a method for manufacturing an optical module The invention is a method for manufacturing an optical module where on forms a groove in a substrate for positioning a component such as an optical component. The optical component is provided to be bonded into the groove by a aluminum oxide bonding process. To prep... | 09/27/2005 |
| 6940147 | Integrated inductor having magnetic layer A dielectric layer is formed over a substrate comprising a semiconductor material. A magnetic layer is formed over the dielectric layer. The magnetic layer comprises an amorphous alloy comprising cobalt. ... | 09/06/2005 |
| 6938815 | Heat-resistant electronic systems and circuit boards Methods of making improved electronic systems and circuits boards, and more specifically to methods of making improved electronic systems and circuits boards using heat-resistant composite materials having superior mechanical, thermal, and electrical properties.... | 09/06/2005 |
| 6933471 | Ceramic igniters with sealed electrical contact portion Robust ceramic igniters are provided that include an improved sealing system which can significantly enhance operational life of the igniter. Preferred igniters comprise a conductive cold zone and hot zone with higher resisitivity. A hermetic sealant material covers... | 08/23/2005 |
| 6927492 | Solder pads and method of making a solder pad A device including a first solder pad and a second solder pad comprised of a post-soldering alloy composition on a substrate is provided. The alloy composition comprises two or more elements, and the post soldering alloy composition of the first solder pad has diffe... | 08/09/2005 |
| 6926190 | Integrated circuit assemblies and assembly methods A method for assembling chips onto substrates includes applying a flux-free, no-flow underfill material. In an embodiment, the method includes removing oxide from interconnects without the use of a flux and applying a flux-free, no-flow underfill. In an embodiment, ... | 08/09/2005 |
| 6877651 | Method of joining ceramic or graphite to metal with an alloy having high nickel or cobalt content, alloys for joining the same, and products formed therewith A brazed product has a metal substrate, a ceramic or graphite substrate, and a brazing alloy containing one of a high nickel content and cobalt content joining the ceramic or graphite substrate to the metal substrate. A method of joining these materials include prov... | 04/12/2005 |
| 6648207 | Method for applying self-fluxing coatings to non-cylindrical ferritic objects This disclosure describes a technique for fusing self-fluxing metallic coatings on non-cylindrical objects without the need to conduct the fuse operation in a vacuum furnace or some other type of protective environment. The technique consists of first app... | 11/18/2003 |
| 6592021 | Circuit board bonding method, branch circuit and its designing method, waveguide-microstrip transition, and application to HF circuit, antenna and communication system A circuit assembly having a thin and large-area dielectric substrate and an improved grounding condition. To make the assembly, a circuit board comprises the substrate, and a circuit pattern and a metal layer that are formed on respective sides of the sub... | 07/15/2003 |
| 6554179 | Reaction brazing of tungsten or molybdenum body to carbonaceous support Reaction-brazing of tungsten or molybdenum metal bodies to carbonaceous supports enables an x-ray generating anode to be joined to a preferred lightweight substrate. Complementary surfaces are provided on a dense refractory metal body and a graphite or a ... | 04/29/2003 |
| 6541075 | Method for forming a thermal barrier coating system An article includes a substrate and an adhesion layer overlying the substrate. The adhesion layer includes a first phase including particles, and a second phase including braze alloy that bonds the particles to the substrate. The article further includes ... | 04/01/2003 |
