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| Number | Title | Issue Date |
| 8157157 | Solder ball loading mask, apparatus and associated methodology A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the ... | 04/17/2012 |
| 7753253 | Dispensing device and mounting system A dispensing device (4) for charging underfill agent into a gap between a substrate (K) and a chip (C) includes means for storing underfill agent (66, 67), a chamber (52) provided for containing substrate (K) to be charged with underfill agent a... | 07/13/2010 |
| 7635077 | Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby A method of forming a sensor for sensing a physical property of a media. A substrate is provided having circuitry thereon including at least one electrical contact and a die is provided having disposed thereon corresponding electrical contacts and a sensing element ... | 12/22/2009 |
| 7428979 | Process for soldering an electronic component on an electronic card, process for repairing the card and installation for using the process A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated at a first temperature, and a solder alloy melted at a second temper... | 09/30/2008 |
| 7371615 | Heat sink and method for its production A method for producing a heat sink for cooling a semiconductor device including forming plural base members, the base member being each in plate or block-shape, the base member each having paths shaped on one or both sides of surfaces thereof, and the base member ea... | 05/13/2008 |
| 7364063 | Thermally coupling an integrated heat spreader to a heat sink base The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating w... | 04/29/2008 |
| 7361978 | Laser diode packaging A laser diode package includes a heat sink, a laser diode, and an electrically nonconductive (i.e. insulative) substrate. The laser diode has an emitting surface and a reflective surface opposing the emitting surface. The laser diode further has first and second sid... | 04/22/2008 |
| 7347354 | Metallic solder thermal interface material layer and application of the same A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert c... | 03/25/2008 |
| 7348493 | Metal-ceramic circuit board A metal-ceramic circuit board is characterized by being constituted by bonding directly on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive metal member of an electronic circuit. The base plate has a proof stres... | 03/25/2008 |
| 7342409 | System for testing semiconductor components A system for testing semiconductor components includes an interconnect, an alignment system for aligning a substrate to the interconnect, a bonding system for bonding the component to the interconnect, and a heating system for heating the component and the interconn... | 03/11/2008 |
| 7320940 | Method for manufacturing electronic device including package In a method for manufacturing an acceleration sensor device, a lid for covering an opening of a package body is prepared by stamping. The lid is plated and plating films are formed on surfaces of the lid. The burrs formed on the surfaces of the lid in the plating pr... | 01/22/2008 |
| 7319591 | Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature wit... | 01/15/2008 |
| 7319270 | Multi-layer electrode and method of forming the same An interconnect includes an opening formed in a dielectric layer. A conductive barrier is deposited in the opening, over which a first conductive layer is deposited. A conductive oxide is deposited over the first conductive layer, and a second conductive layer, form... | 01/15/2008 |
| 7311242 | Design of an insulated cavity The invention relates to a method for connecting a connecting surface of a first silicon wafer [WA1] with a connecting surface of a second silicon wafer [WA2] so as to form an insulated cavity after assembly, at least one of the two silicon wafers [WA]... | 12/25/2007 |
| 7304377 | Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device On a piezoelectric substrate 23, there are provided surface acoustic wave devices F1 and F2 in which predetermined circuit patterns are formed, and a package substrate 11 comprising side vias 16 formed in a caved manner in ... | 12/04/2007 |
| 7288471 | Bumping electronic components using transfer substrates A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic compo... | 10/30/2007 |
| 7286764 | Reconfigurable modulator-based optical add-and-drop multiplexer An optical add and drop multiplexer system comprising a first module for providing a first signal; a second module for providing a second signal; and a modulator for receiving a channel of the first signal at a first location, the first location configured to actuat... | 10/23/2007 |
| 7278564 | Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus The invention provides a method of mounting an electronic component where an electronic component can be reliably electrically-connected to a substrate. A substrate defines a through-hole that extends through the substrate, from connection electrodes formed on the l... | 10/09/2007 |
| 7278207 | Method of making an electronic package An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of diele... | 10/09/2007 |
| 7271028 | High density electronic interconnection This is an interconnection between electronic devices and other assemblies (e.g. printed circuits). The electronic devices are mounted on high temperature insulating bases, such as ceramic substrates. The insulating base has a conductive pattern to connect the elect... | 09/18/2007 |
| 7259450 | Double-packaged multi-chip semiconductor module A plurality of semiconductor die is packaged into one component. The inventive design comprises devices which have been singularized, packaged and thoroughly tested for functionality and adherence to required specifications. A plurality of packaged devices is then r... | 08/21/2007 |
| 7242078 | Surface mount multichip devices A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame... | 07/10/2007 |
| 7241966 | Wafer level package fabrication method using laser illumination The present invention relates to a WLP fabrication method capable of welding a lid wafer with a device wafer by using laser illumination. The WLP fabrication method can rapidly weld bonding metal strips of device and lid wafers with each other in order to couple the... | 07/10/2007 |
| 7224066 | Bonding material and circuit device using the same A circuit device is provided in which the bonding reliability of a brazing material such as soft solder is improved. A circuit device of the present invention includes conductive patterns, a bonding material which fixes circuit elements to the conductive patterns, a... | 05/29/2007 |
| 7220494 | Metal dusting resistant product A product resistant or immune to carburization, metal dusting, coking, oxidation, and having sufficient mechanical strength for use at temperatures greater than 400° C. The product consists of a load-bearing member and a corrosion resistant member, wherein the corr... | 05/22/2007 |
| 7196413 | Heat dissipation assembly and method for producing the same A heat dissipation assembly in which a heat generator and a heat dissipator are integrated via an electrically insulating and thermally conductive sheet, at least one surface of which a thermally conductive grease is applied to, in which the thermally conductive gre... | 03/27/2007 |
| 7193860 | Leadframe-based module DC bus design to reduce module inductance A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative ... | 03/20/2007 |
| 7185545 | Instrumentation and method for monitoring change in electric potential to detect crack growth Instrumentation for monitoring crack growth using a change in electric potential across a starter crack as the crack propagates is disclosed. The instrumentation includes a specimen of a material to be analyzed for crack growth propagation having a surface with a st... | 03/06/2007 |
| 7180006 | Tape substrate and method for fabricating the same A tape substrate including an insulating film, a copper foil pattern formed on the insulating film at one side of the insulating film, and provided with a connecting area where an electronic element is to be mounted, a barrier layer plated on the copper foil pattern... | 02/20/2007 |
| 7177081 | High contrast grating light valve type device A grating light valve has with a plurality of spaced reflective ribbons are spatially arranged over a substrate with reflective surfaces. The grating light valve is configured to optimized the conditions for constructive and destructive interference with an incident... | 02/13/2007 |
| 7170919 | Diode-pumped solid-state laser gain module A laser gain device (10) holds a laser slab (60) which is pumped by pump energy from at least one diode array assembly (24). An angle at which pump energy from the diode array assembly (24) impinges the laser slab (60) is adjustabl... | 01/30/2007 |
| 7161806 | Heat sink and method for its production The present invention provides a liquid-cooling type heat sink which has a high pressure-resistibility and is resistible against the corrosion or erosion-corrosion or electrolytic etching, and a method for its production. The heat sink of the present inventio... | 01/09/2007 |
| 7157111 | MOCVD selective deposition of C-axis oriented PBGEOthin films on InOoxides A method of selectively depositing a ferroelectric thin film on an indium-containing substrate in a ferroelectric device includes preparing a silicon substrate; depositing an indium-containing thin film on the substrate; patterning the indium containing thin film; a... | 01/02/2007 |
| 7152308 | Wirebonder to bond an IC chip to a substrate Thick film bond surfaces (8) on a support structure (10), such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit (16) having raised bosses (24) engages with and compresses the bond surf... | 12/26/2006 |
| 7143929 | Ceramic circuit board and method for manufacturing the same In the ceramic circuit board, within the through hole of the ceramic substrate is arranged the metal column which is 0 to 150 μm shorter relative to the thickness of the ceramic substrate; the metal circuit plates are attached to both surfaces of the ceramic substr... | 12/05/2006 |
| 7128256 | Z-interconnections with liquid crystal polymer dielectric films A multilayered stack and method of formation. First and second dielectric layers are formed, respectively including first and second liquid crystal polymer (LCP) dielectric materials, with an electrically conductive plug through the first dielectric layer. A first a... | 10/31/2006 |
| 7114644 | Joining method by Au-Sn brazing material The present invention provides a method of joining members to be joined by use of an Au—Sn brazing material, in which joining is performed by adjusting the composition and thickness of the Au—Sn brazing material so that the Sn content of the joint after joining ... | 10/03/2006 |
| 7101781 | Integrated circuit packages without solder mask and method for the same This invention relates to an integrated circuit package and a method for the same, especially relates to the integrated circuit package without a solder mask and the method for the same. A solder wettable metal is used as the material of the first solder pad and a n... | 09/05/2006 |
| 7092423 | Semiconductor laser device, optical disk apparatus and optical integrated unit A semiconductor laser device includes: a first cladding layer, which is made of a nitride semiconductor of a first conductivity type and is formed over a substrate; an active layer, which is made of another nitride semiconductor and is formed over the first cladding... | 08/15/2006 |
| 7092890 | Method for manufacturing thin GaAs die with copper-back metal structures A thin GaAs Substrate can be provided with a copper back-metal layer to allow the GaAs Substrate to be packaged using conventional plastic packaging technologies. By providing the GaAs Substrate with a copper back-metal layer, the GaAs Substrate can be made thinner ... | 08/15/2006 |
