Bizarre Patents
User-operated amusement apparatus for kicking the user's buttocks
An apparatus including a user-operated and controlled apparatus for self-infliction of repetitive blows to the user's buttocks by a plurality of elongated arms bearing flexible extensions that rotate under the user's control.
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| Number | Title | Issue Date |
| 8070042 | Process for joining stainless steel part and silicon carbide ceramic part and composite articles made by same A process for joining a stainless steel part and a silicon carbide ceramic part, comprising steps of: providing a stainless steel part, a SiC ceramic part, and a Al foil; bringing surfaces of the stainless steel part, SiC ceramic part, and Al foil into contact, with... | 12/06/2011 |
| 8061580 | Method of forming and assembly of metal parts and ceramic parts A method of forming and assembling at least two parts together that may be metal, ceramic, or a combination of metal and ceramic parts. Such parts may have different CTE. Individual parts that are formed and sintered from particles leave a network of interconnecting... | 11/22/2011 |
| 8038049 | Hermetic seal A seal design provides positive compression to produce a hermetic seal around a feedthrough pin in a hermetically sealed device, including an implantable medical device. One embodiment of the seal design uses a plurality of “micro-flanges” placed along the lengt... | 10/18/2011 |
| 8002166 | Method of producing metal to glass, metal to metal or metal to ceramic connections A method of manufacturing metal to glass, metal to metal and metal to ceramic connections to be used in SOFC applications, said connections being produced as a mixture of a base glass powder and a metal oxide powder. As a result, the inherent properties of the glass... | 08/23/2011 |
| 7959058 | Hybrid composite welded joint The present invention's composite-to-metal attachment methodology—bolt-free and adhesive-free—features the implementation of an intermediary structure containing metallic fibrous material. The intermediary structure couples a first adherend (which contains nonme... | 06/14/2011 |
| 7905385 | Joining ceramics to metal The present disclosure relates to methods for joining ceramics to metals and a tool for use in the methods. A medical device and a method of manufacturing a medical device is also disclosed. ... | 03/15/2011 |
| 7900808 | Soldering method and system thereof A soldering system includes a circuit board having first soldering terminals, a soldering object having second soldering terminals, soldering blocks disposed between the circuit board and the soldering object for electrically interconnecting the first soldering term... | 03/08/2011 |
| 7857193 | Method of forming and assembly of parts A method of assembling two or more parts together that may be metal, ceramic, metal and ceramic parts, or parts that have different CTE. Individual parts are formed and sintered from particles that leave a network of interconnecting porosity in each sintered part. T... | 12/28/2010 |
| 7857194 | Method of joining metals to ceramic matrix composites A method of joining metals to a ceramic material such as a ceramic matrix composite is provided which utilizes a compliant interlayer having a coefficient of thermal expansion between the coefficient of thermal expansion of the metal and that of the ceramic matrix c... | 12/28/2010 |
| 7837085 | Hermetic seal A seal design provides positive compression to produce a hermetic seal around a feedthrough pin in a hermetically sealed device, including an implantable medical device. One embodiment of the seal design uses a plurality of “micro-flanges” placed along the lengt... | 11/23/2010 |
| 7832616 | Methods of securing a thermocouple to a ceramic substrate Methods of securing a thermocouple to a ceramic substrate are provided. The thermocouple includes a pair of wires that define a junction, and the method comprises directly bonding the junction of the thermocouple to the ceramic substrate. In one form, the junction i... | 11/16/2010 |
| 7766216 | Self-centering braze assembly methods Braze and electrode wire assemblies, e.g., used with an implantable microstimulator, include a wire welded in the through-hole of an electrode, which electrode is brazed to a ceramic case that is brazed to a metal ring that is welded to a metal can. The braze joints... | 08/03/2010 |
| 7762448 | Process for producing a composite body A composite body which can withstand high thermal stresses is formed by high-temperature soldering at least a part of a high-temperature-resistant, metallic or nonmetallic component and at least a part of a high-temperature-resistant, nonmetallic component. Prior to... | 07/27/2010 |
| 7686205 | Method of joining members having different thermal expansion coefficients Provided is a method of joining members having different thermal expansion coefficients, capable of joining them at a temperature lower than the melting point of Ag to obtain a joining layer having excellent durability to a thermal cycle. First Ag particles 3... | 03/30/2010 |
| 7429152 | Uncoated cutting tool using brazed-in superhard blank An uncoated cutting tool that comprises a body containing a pocket. A polycrystalline cubic boron nitride blank has a cutting tip. The blank is brazed into the pocket using a braze alloy whereby there is a braze joint between the body and the polycrystalline cubic b... | 09/30/2008 |
| 7428979 | Process for soldering an electronic component on an electronic card, process for repairing the card and installation for using the process A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated at a first temperature, and a solder alloy melted at a second temper... | 09/30/2008 |
| 7419083 | Method for metal ornamentation A method for metal ornamentation, particularly for making granulated metal ornaments, is used to arrange single and single line granulated arrangements or patterns and to set gemstones within a workpiece. The method places pre-formed spherical granules in seats defi... | 09/02/2008 |
| 7398912 | Different materials bonded member and production method thereof A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given... | 07/15/2008 |
| 7392929 | Weldable synthetic material A synthetic material is applied to a structure of an article of manufacture such as an automotive vehicle. Typically, the material assists in or at last does not interfere with manufacturing steps applied to the article of manufacture. ... | 07/01/2008 |
| 7336009 | Hobby servo enhancements An independent and modular apparatus is disclosed for extending the operational capacity of a servo motor. The apparatus includes a frame member having a servo motor and a rotatable shaft mounted therein. The output shaft of the servo motor and the rotatable shaft a... | 02/26/2008 |
| 7331499 | Manufacturing method for a ceramic to metal seal A method of bonding a ceramic part to a metal part by heating a component assembly including the metal part, the ceramic part, and a thin essentially pure interlayer material placed between the two parts heated at a temperature that is greater than the temperature o... | 02/19/2008 |
| 7328832 | Gold/nickel/copper brazing alloys for brazing WC-Co to titanium alloys A brazing material including about 40 to about 60 percent by weight gold, about 5 to about 16 percent by weight nickel and about 35 to about 55 percent by weight copper. ... | 02/12/2008 |
| 7322776 | Cutting tool inserts and methods to manufacture The present invention relates to cutting tool inserts. A cutting tool insert includes an abrasive tip of a hard material, an abrasive or superabrasive material. A cutting tool insert is bonded to an insert body by mechanical force. The mechanical forces are generate... | 01/29/2008 |
| 7318547 | Method for assembling parts made of materials based on SiC by non-reactive refractory brazing, brazing composition, and joint and assembly obtained by said method Method for assembling at least two pieces of silicon carbide based materials by non reactive refractory brazing, wherein these pieces are put into contact with a non reactive brazing solder composition and the assembly formed by the pieces and the brazing solder com... | 01/15/2008 |
| 7311995 | Electrochemical cell An electrochemical cell has an outer case formed of one of ceramics and glass. An electrochemical cell element is hermetically sealed in the outer case. The electrochemical cell element contains a positive pole, a negative pole, and a non-aqueous electrolyte contain... | 12/25/2007 |
| 7302990 | Method of forming concavities in the surface of a metal component, and related processes and articles A method of forming at least one concavity of a selected size and shape within a surface of an internal passageway of a metallic component comprises: depositing a ceramic-based material by a direct-write technique onto a ceramic core which is suitable for forming th... | 12/04/2007 |
| 7293688 | Gold/nickel/copper/aluminum/silver brazing alloys for brazing WC-Co to titanium alloys A brazing material including about 2 to about 30 percent by weight gold, about 4 to about 14 percent by weight nickel, about 25 to about 65 percent by weight copper, about 1 to about 3 percent by weight aluminum and about 20 to about 55 percent by weight silver.... | 11/13/2007 |
| 7288729 | Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring l... | 10/30/2007 |
| 7285734 | Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring l... | 10/23/2007 |
| 7278564 | Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus The invention provides a method of mounting an electronic component where an electronic component can be reliably electrically-connected to a substrate. A substrate defines a through-hole that extends through the substrate, from connection electrodes formed on the l... | 10/09/2007 |
| 7270548 | Electrical connector and method for connecting it to the glass pane of a motor vehicle An electrical connector for electrical devices such as heating panels, antennas, or the like that are provided on glass panes on motor vehicles, having at least one soldering area to be soldered onto the glass pane and having a connector area joined electrically con... | 09/18/2007 |
| 7261753 | Bonding structure and bonding method for cemented carbide element and diamond element, cutting tip and cutting element for drilling tool, and drilling tool A cutting tip for a drilling tool includes a cemented carbide cutting base 11, a diamond element 12 supported by the cutting base 11, and a bonding layer formed between the cutting base 11 and the diamond element 12 in order to bon... | 08/28/2007 |
| 7252872 | Joined structures of ceramics An object of the present invention is to provide a joined structure effective for preventing crack formation after thermal cycles. The joined structure has a ceramic member 1, a metal member 4 to be joined, and a metal fixed member 3 fixed to th... | 08/07/2007 |
| 7251884 | Method to build robust mechanical structures on substrate surfaces A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated f... | 08/07/2007 |
| 7250208 | Composite product with a thermally stressable bond between a fiber reinforced material and a further material In a material bond for a composite product composed of a fiber-reinforced material and a further material, such as an anode for an x-ray tube, wherein the fibers of the fiber-reinforced material exhibit a preferred orientation, and wherein the magnitude of the coeff... | 07/31/2007 |
| 7247514 | Semiconductor device and method for producing the same A method for producing a semiconductor device of the present invention includes forming a surface electrode on a semiconductor element, forming a solder layer by plating on one principal surface of the surface electrode, mounting the semiconductor element on the sub... | 07/24/2007 |
| 7241975 | Igniter systems with associated lead frame Resistive igniter systems are provided that comprise a metal substrate with an associated resistive igniter element in electrical connection through braze applied to the metal substrate. Igniter systems of the invention can enable significantly simplified manufactur... | 07/10/2007 |
| 7234541 | DLC coating for earth-boring bit seal ring An earth-boring bit has a seal assembly with a seal face having a DLC coating. The seal assembly locates between a bearing pin and a cone of the bit. The seal assembly has at least one rigid ring that rotates against a mating surface. The DLC coating is diamond-like... | 06/26/2007 |
| 7222775 | Process for the metallization and/or brazing with a silicon alloy of parts made of an oxide ceramic unable to be wetted by the said alloy The invention relates to a process for the metallization with a silicon alloy melting at a temperature T1 of certain zones of the surface of a part made of an oxide ceramic unable to be wetted by the said alloy, the said process comprising, in succession, a step of ... | 05/29/2007 |
| 7219825 | SnAgAu solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same Provided are a solder bump, a method of manufacturing the same, and a method of bonding a light emitting device using the method of manufacturing the solder bump. In particular, the solder bump is formed of a compound including a first element through a third elemen... | 05/22/2007 |
