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| Number | Title | Issue Date |
| 7131565 | Feed devices and methods for injection molded solder systems A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second lea... | 11/07/2006 |
| 7096912 | Bonding apparatus A bonding apparatus including, on a supporting stand 12, two linear motors 130 and 140 and a bonding head supporting stage 114 which supports the bonding head 120 by means of fluid pressure so that the bonding head 120 is mo... | 08/29/2006 |
| 7086576 | Machine for constructing the side wall of a cylindrical tank The machine is adapted to supply, manipulate and position steel strip, fed from a coil, so as to bring it into gapped relationship beneath the side wall of a partly constructed, elevated tank. This is done so that the strip can be welded to the side wall to add a co... | 08/08/2006 |
| 6983872 | Substrate alignment method and apparatus The invention provides a method and apparatus for aligning a substrate. The apparatus comprises a ball pick head for picking up a plurality of solder balls in a ball pick-up process and depositing them onto the substrate, and a vision system adapted to view and obta... | 01/10/2006 |
| 6964364 | Weld guidance system and method A method and guidance system for accurately positioning a welding torch relative to a desired weld path. The method and system are based on ultrasonic sensing of information relating to the distance between the welding torch and surfaces on one or more components be... | 11/15/2005 |
| 6708863 | Heat bonding method and heat bonding device In heat bonding method and device, first and second marks (MA, MB) formed on the film carrier (52) are measured before performing heat bonding of outer leads (54) formed on a film carrier (52) to electrodes (58) formed on a transparent pl... | 03/23/2004 |
| 6669076 | Wire bonding device A wire bonding device in accordance with the present invention is provided, which comprises: an XY table (2), a first holding member (8) supported by the XY table (2), a camera (9) supported by the first holding member (8), a second holding member (5) sup... | 12/30/2003 |
| 6651865 | Position-, speed- and force-controllable chip accessing apparatus A position-, speed- and force-controllable chip accessing apparatus comprises a fixing seat, a rotational direction moving device, a linear direction moving device, and a position sensing device, characterized in that a flexible positioning means is provi... | 11/25/2003 |
| 6581817 | Die bonding device A die bonding device for installing electronic components S on a metal stem, comprising a bonding nozzle for suctioning an electronic component S and positioning the electronic component S on a component mounting face of the stem, a stem carrying head for... | 06/24/2003 |
| 6328196 | Bump bonding device and bump bonding method To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, ... | 12/11/2001 |
| 6318623 | Strip connecting apparatus Two position detectors for a leading strip and two position detectors for the trailing strip are provided so as to be separated each other by a certain distance along each of the strips in a transferring direction of the strips to detect a deviation of a ... | 11/20/2001 |
| 6315185 | Ball mount apparatus In a ball mount apparatus for mounting balls on a work by means of a mount head, the work is disposed under the mount head and the mount head is provided with a Z-axis driving mechanism for driving the mount head only in an up/down direction. A ball tray ... | 11/13/2001 |
| 6223971 | Driving unit of a welding equipment A small-sized motor is employed by a driving unit of a welding equipment wherein the inner diameter of a rotary shaft of the motor can be reduced as much as possible, and the entire length of the driving unit is reduced. The driving unit of a welding equi... | 05/01/2001 |
| 6204471 | Parts soldering apparatus and method To provide parts soldering apparatus and method which improve the productivity during parts soldering and increase the mounting accuracy of parts on a circuit board. The parts soldering apparatus of the present invention has: a stage for positioning a cir... | 03/20/2001 |
| 6010057 | Method for making a wire connections of predetermined shape In wire bonding a semiconductor chip to the lead frame or other substrate, increase of productivity is achieved by letting the capillary which guides the wire between the wiring points (4, 5) move faster along its trajectory in the two travel stages (s1, ... | 01/04/2000 |
| 6008476 | Apparatus for indexing and affixing components to a substrate An apparatus (400) used for indexing and affixing components to a substrate includes a vacuum conveyor and a controller (816) for controlling operation of the apparatus (400). The conveyor includes pallets (102), first and second tracks (414, 416), first ... | 12/28/1999 |
| 5653375 | Wire bonding apparatus A wire bonding apparatus includes a frame, an X, Y, table, installed on the frame, including a linear stepping motor with a first stator and a first inductor, a transducer, pivotably installed on the X, Y table, to one end of which a capillary for bonding... | 08/05/1997 |
| 5150829 | Apparatus for holding samples during solderability testing An apparatus is provided for use with a solderability testing machine to releasably engage a sample for immersion into a solder bath. The apparatus contains a pair of spring-loaded plates which serve to hold the sample so that only the desired portion of ... | 09/29/1992 |
| 5104033 | System and apparatus for and method of assembling workpieces An apparatus for assembling workpieces in which an assembling work is performed includes a workpiece setting jig, a setting station including a workpiece setting apparatus for setting a first workpiece on the workpiece setting jig, an assembling station i... | 04/14/1992 |
| 4896812 | Double downhill pipe welder A pipe welding apparatus which utilizes a pair of welding electrodes which are at least ninety degrees spaced apart relative to a cylindrical workpiece. The welding procedure only occurs during movement of each welding electrode from an upper position to ... | 01/30/1990 |
| 4832250 | Electronic circuit board rework and repair system An electronic circuit board rework and repair system having a carriage manually movable to successive station positions and having a table thereon movable along mutually orthogonal axes for positioning of a circuit board clamped to the table. At a first s... | 05/23/1989 |
| 4830261 | Eddy current tool positioning system A tool positioning system comprises a discontinuity detection means, such as an eddy current system, for detecting a discontinuity within a workpiece resulting from a joint between a first piece of material relative to a second piece of material, the disc... | 05/16/1989 |
| 4573627 | Indium bump hybrid bonding method and system In order to ensure total bonding together of two-dimensional arrays of inm bumps on circuit boards, additional bumps are placed on each board in a triangular pattern which contains the array of that board. Opposing sets of thrusters are used to move the ... | 03/04/1986 |
