Did You Know...
...that the Slinky toy was the result of a failed attempt by engineer Richard James to produce an antivibration device for ship instruments? His goal was to develop a spring that would instantaneously counterbalance the wave motion that rocks a ship at sea. Instead, he developed the Slinky.
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| Number | Title | Issue Date |
| 7367773 | Apparatus for combining or separating disk pairs simultaneously Various methods and apparatus are provided for merging and demerging pairs of disks. In one embodiment, pairs of merged disks are first separated and then transferred to separate cassettes such that all of the disks in the separate cassettes are oriented in the same... | 05/06/2008 |
| 7322098 | Method of simultaneous two-disk processing of single-sided magnetic recording disks Various methods and apparatus for simultaneously processing two single-sided hard memory disks is provided. Disks are positioned in pairs, with one surface of one disk positioned adjacent one surface of the second disk, with the disk surfaces touching or with a slig... | 01/29/2008 |
| 7323844 | Circuit and method for control of a stepper motor A circuit for the control of a stepper motor having a rotor configured as a permanent magnet and a stator configured of at least first and second energized excitation coils enclosing the rotor. Each end terminal of the first excitation coil is connected to the posit... | 01/29/2008 |
| 7267841 | Method for manufacturing single-sided sputtered magnetic recording disks An information-storage media is provided that includes: (a) a substrate disk 312 having first and second opposing surfaces; (b) a first interface layer 304 on the first surface, the first interface la... | 09/11/2007 |
| 7180709 | Information-storage media with dissimilar outer diameter and/or inner diameter chamfer designs on two sides A single-sided magnetic hard disk 200 is provided that includes opposing first and second sides 300 and 308 having opposing first and second chamfers 408 and 412, respectively. The first chamfer 408 is dissimilar (or differe... | 02/20/2007 |
| 7168607 | Method and device for cleaning and then bonding substrates The invention relates to a method and to a device for cleaning and then bonding substrates. According to the invention, at least two opposite substrates are obliquely or vertically sprayed with a cleansing liquid by means of at least one nozzle and are preferably dr... | 01/30/2007 |
| 7168153 | Method for manufacturing single-sided hard memory disks Various apparatus and methods are provided for positioning and handling single-sided hard memory disks. A disk carrier is provided with ribs formed on the inside surface of opposing side walls. The ribs form disk receiving grooves or channels. The ribs further compr... | 01/30/2007 |
| 7165308 | Dual disk transport mechanism processing two disks tilted toward each other Various apparatus and methods are provided for handling and transporting pairs of gap merge disks. A transfer member is provided in one embodiment which engages the outer perimeter of a pair of disks at three locations. The transfer member is configured to induce an... | 01/23/2007 |
| 7153759 | Method of fabricating microelectromechanical system structures A method of simultaneously bonding components, comprising the following steps. At least first, second and third components are provided and comprise: at least one glass component; and at least one conductive or semiconductive material component. The order of stackin... | 12/26/2006 |
| 7122044 | Surgical stapling instrument and method thereof A stapler for stapling a tubular structure to another structure. The stapler has an anvil which is expandable from a collapsed position to an expanded position. The stapler has a recess which receives at least a portion of the tubular structure and a shoulder which ... | 10/17/2006 |
| 7121002 | Heat exchanger This invention relates to a heat exchanger which is produced by connecting two walls together at a plurality of points by compression molding and sealing the edges thereof. ... | 10/17/2006 |
| 7114643 | Friction fit target assembly for high power sputtering operation The present application pertains to unconventional sputter target/backing plate assemblies (10) for high power operation and to the low temperature method of making them. The sputter target/backing plate assemblies (10) comprise targets (12) and... | 10/03/2006 |
| 7107808 | Shearing method for thin plate A shearing method for a thin plate including forming a protruded product part having a first sagging part when the thin plate with a thickness of not more than approximately 0.3 mm is performed with a half die cutting by pressing the half die cutting punch slightly ... | 09/19/2006 |
| 7083871 | Single-sided sputtered magnetic recording disks An information-storage media is provided that includes: (a) a substrate disk 312 having first and second opposing surfaces; (b) a first selected layer 304 on the first surface, the first selected sele... | 08/01/2006 |
| 7083376 | Automated merge nest for pairs of magnetic storage disks Various methods and apparatus for handling a plurality of disks and repositioning them into pairs is provided. In one embodiment, a nest is configured to hold a cassette and includes a nest. The nest includes a curved surface with ribs or teeth extending therefrom w... | 08/01/2006 |
| 7083502 | Method for simultaneous two-disk texturing Various methods and apparatus for simultaneously texturing two single-sided hard memory disks is provided. The two disks are placed in a concentric contact merge orientation such that the outwardly facing surface of each disk may be simultaneously subjected to textu... | 08/01/2006 |
| 7065853 | Method of forming a hex nut from a planar material A hex nut formed from cutting and deforming a rigid planar material and having an integral attachment surface continuous with the deformable planar material allows attachment of the hex nut to any suitable surface. A rigid planar material such as a piece of flat met... | 06/27/2006 |
| 7052739 | Method of lubricating multiple magnetic storage disks in close proximity Various apparatus and methods are provided for lubricating hard memory disks. A mandrel is provided in one embodiment with three rows of teeth and provides a stable, three-point engagement with the inside edge of the disks at the center aperture. When removing disks... | 05/30/2006 |
| 7027246 | Method for servo pattern application on single-side processed disks in a merged state Methods and apparatus are provided for creating servo-tracks on the R-side of single-sided hard memory disks. The method includes placing two single-sided disks in a concentric contact merge orientation with the R-side of each disk facing outwardly. Two independent ... | 04/11/2006 |
| 7021522 | Bonding methods for microchannel plates Mating faces of a microchannel plate (MCP) (50) and a multi-layer ceramic body (80) unit are deposited with a thin film having protuberances (84) using a suitable metal selected for optimum diffusion at a desired temperatures and pressure. The m... | 04/04/2006 |
| 6946052 | Separating apparatus and processing method for plate member This invention is to guarantee that in separating a plate member such as a bonded substrate stack, a fluid is injected to an appropriate portion of the plate member. While a bonded substrate stack (50) is rotated, the vertical position of its peripheral porti... | 09/20/2005 |
| 6749103 | Low temperature sputter target bonding method and target assemblies produced thereby A low temperature target and backing plate bonding process and assemblies made thereby. A plurality of projections are formed in the harder member of the assembly. The assembly is bonded by conventional techniques around the peripheral assembly boundaries. The assem... | 06/15/2004 |
| 6579431 | Diffusion bonding of high purity metals and metal alloys to aluminum backing plates using nickel or nickel alloy interlayers An improved method for joining mating surfaces of a metallic sputter target and a backing plate of aluminum, aluminum alloy or aluminum matrix composite material to form a sputter target/backing plate assembly comprises the steps of roughening the mating ... | 06/17/2003 |
| 6521108 | Diffusion bonded sputter target assembly and method of making same Low temperature diffusion bonding methods and target/backing plate assemblies bonded by the methods are disclosed. In accordance with the methods, copper and/or cobalt targets are bonded to backing plate members via the use of an interlayer selected from ... | 02/18/2003 |
| 6071389 | Diffusion bonded sputter target assembly and method of making A sputter target assembly includes a cobalt target diffusion bonded to an aluminum or copper backing plate by means of a titanium interlayer. The sputter target assembly may be made by hot vacuum pressing or, preferably, by hot isostatically pressing the ... | 06/06/2000 |
| 5973928 | Multi-layer ceramic substrate decoupling A multi-layer ceramic module comprises a multi-layer ceramic substrate having an upper side and a lower side, at least one semiconductor chip mounted on the upper side of the substrate, a plurality of module pins projecting from the lower side of the subs... | 10/26/1999 |
| 5920464 | Reworkable microelectronic multi-chip module A reworkable cold welded microelectronic multi-chip module contains cold welded microelectronic chips in which the chip's cold weld metal bonding pads (3) are constructed of a metal having one hardness and the corresponding cold weld metal bonding pads of... | 07/06/1999 |
| 5831309 | Semiconductor element for an electronic or opto-electronic semiconductor component Semifinished products designed as composite bodies for electronic or opto-electronic semiconductor components are known. The composite bodies are made of a disk-shaped, transparent quartz glass substrate and a wafer made of a semiconductor material. The d... | 11/03/1998 |
| 5709336 | Method of forming a solderless electrical connection with a wirebond chip A dendrite surface is provided on each of the electrical contacts of a substrate, such as a test board, chip carrier, or printed wiring board. The electrical contacts on the substrate are arranged in a mirror image of the input/output pads on a wirebond c... | 01/20/1998 |
| 5634265 | Electrical interconnect using particle enhanced joining of metal surfaces A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includ... | 06/03/1997 |
| 5549237 | Apparatus and method for cold welding thin wafers to hard substrates An apparatus for coating and bonding parts in a vacuum includes a floating mount assembly holding one part and applying a bonding load to the parts. A pivoting mount assembly holds one part and is pivoted between a coating position and a bonding position.... | 08/27/1996 |
| 5547119 | Electrical machine and method of manufacturing the electrical machine The method of intimately joining a hard magnetic part to a soft magnetic part in the manufacture of an electrical machine comprising polishing the joining surfaces such that the surface roughness hight is about less than or equal to two nanometers and joi... | 08/20/1996 |
| 5529238 | Gold to gold substrate bonding system utilizing interferometric planarization feedback A bonding system with interferometric inspection for real time planarity feedback and control is used to bond two substrates at atmospheric pressure. The interferometric vision system includes a crt monitor display to display the relative planarity betwee... | 06/25/1996 |
| 5471151 | Electrical interconnect using particle enhanced joining of metal surfaces A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includ... | 11/28/1995 |
| 5456404 | Method of testing semiconductor chips with reusable test package A method for testing semiconductor chips using a test package having electrical contacts which have in them metallized particles which pierce the surface of the pads of a semiconductor chip, the chips being mounted on a flexible substrate which can deflec... | 10/10/1995 |
| 5386920 | Vacuum package tubeless enclosure with self-welded flanges A vacuum package assembly (20) is prepared by self-welding the flanges (32 and 43) of two housings (28 and 36) together under an applied pressure, while the housings (28 and 36) and any enclosed structure or device are contained within an evacuated enclos... | 02/07/1995 |
| 5366135 | Method of making composite electrical contact A method for making a bimetallic or trimetallic electrical contact. Features that only its shank portion, made of copper or copper alloy, is covered by a thin layer of silver or silver alloy for protecting the shank portion from environmental erosion. Thi... | 11/22/1994 |
| 5314107 | Automated method for joining wafers A method for joining a number of first and second wafers (11,12) having one polished surface in preparation for direct wafer bonding is provided. The method involves placing a number of first (11) and the same number of second (12) wafers into slots (16) ... | 05/24/1994 |
| 5280013 | Method of preparing high temperature superconductor films on opposite sides of a substrate A superconducting electronic circuit device, useful when impedance matching is desired, especially suited to microwave frequencies, consisting of a thin dielectric layer with superconducting layers on both sides. A superconductor such as Yttrium Barium Co... | 01/18/1994 |
| 5265791 | Metal alloy solid state joining by local interfacial strain control This invention relates to the solid state joining of metal alloy pieces in order to form an integral structure. Such structures of this type, generally, allow the metal alloy pieces to be joined by local interfacial strain control.... | 11/30/1993 |
