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| Number | Title | Issue Date |
| 7320424 | Linear split axis wire bonder A wire bonding machine for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. A bonding head conveyance syst... | 01/22/2008 |
| 7320423 | High speed linear and rotary split-axis wire bonder A wire bonding machine is disclosed for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. At least a portio... | 01/22/2008 |
| 7284686 | Mounting method of bump-equipped electronic component and mounting structure of the same In a mounting method for mounting a bump-equipped electronic component 5 with a plurality of metallic bumps 6 on a substrate 2 with a plurality of electrodes 3, during the process of connecting the metallic bumps 6 to the electrode... | 10/23/2007 |
| 7261230 | Wirebonding insulated wire and capillary therefor An improved method of bonding an insulated wire (14) that has one end connected to a first bond pad (16) to a second bond pad (18) includes moving a tip of a capillary (20) holding the bond wire (14) over the surface of the second ... | 08/28/2007 |
| 7251884 | Method to build robust mechanical structures on substrate surfaces A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated f... | 08/07/2007 |
| 7223939 | Electrical connector for a window pane of a vehicle A window pane has a substrate formed from glass and includes an electrical device. The electrical device includes an electrical conductor. An electrical connector is operatively connected to and in electrical communication with the conductor for transferring electri... | 05/29/2007 |
| 7219419 | Component mounting apparatus including a polishing device Component (3) is pressed onto a circuit board (4) so that their respective metal interconnects (5), (6) are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle (14) holding the component (... | 05/22/2007 |
| 7216794 | Bond capillary design for ribbon wire bonding A device (100) and method (200) for bonding a ribbon wire (104) to a workpiece (106) comprising feeding the ribbon wire through a passageway (116) of an ultrasonic bond capillary (102) and clamping the ribbon wire against an... | 05/15/2007 |
| 7178233 | Process for producing a collapsed filled via hole A process for producing a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole. The sheet is produced by placing a resin sheet and conductive metal sheet in this or... | 02/20/2007 |
| 7156201 | Ultrasonic rod waveguide-radiator The present invention comprises an ultrasonic resonant rod waveguide-radiator with at least three cylindrical sections, one of which is an entrance section having a planar entrance surface and another of which is an exit section having a planar exit surface, and at ... | 01/02/2007 |
| 7137547 | Process for forming electrical/mechanical connections A method of making a connection to a surface of an electronic carrier, the method comprising the steps of: providing a mass of malleable material on the surface of the electronic carrier; connecting the mass to said surface; and extruding the mass into a bore of a t... | 11/21/2006 |
| 7134591 | Method of and apparatus for testing a wire bond connection A method and apparatus for the nondestructive testing of a bond connection between a bond wire and a substrate or pad which utilizes an ultrasonic tool for bonding the bond wire to the substrate or pad. The test force is applied in the plane of the bond connection t... | 11/14/2006 |
| 7134201 | Window pane and a method of bonding a connector to the window pane A method of bonding a connector to an electrical conductor. The conductor is applied to a glass substrate and the connector is placed over the conductor. An ultrasonic welding apparatus is used to oscillate the connector relative to the conductor to bond the connect... | 11/14/2006 |
| 7134190 | Wire harness manufacturing machine The present invention is an automated wire harness machine (40) capable of manufacturing a wire harness (42) unique in-part due to the automation process. The novel wire harness is generally a plurality of bundled, preferably un-stripped, insulated wir... | 11/14/2006 |
| 7091063 | Electronic assembly comprising solderable thermal interface and methods of manufacture To accommodate high power densities associated with high performance integrated circuits, heat is dissipated from a surface of a die through a solderable thermal interface to a lid or integrated heat spreader. In one embodiment, the die is mounted on an organic subs... | 08/15/2006 |
| 7078809 | Chemical leadframe roughening process and resulting leadframe and integrated circuit package A chemical leadframe roughening process includes cleaning and chemically micro-etching a raw copper leadframe to remove organic material and oxide material from the surface. The surface of the leadframe is then roughened using an organic and peroxide solution, resul... | 07/18/2006 |
| 6938481 | Sight glass and low temperature method of manufacturing the same An improved lower cost sight glass and a method for producing the same is disclosed, whereby the sight glass is made by placing a transparent component in secure contact with a metallic ring. The contact may optionally be effectuated by temporarily altering the rela... | 09/06/2005 |
| 6923361 | Bonding apparatus A bonding apparatus including: a horn holder pivotably connected at a first connecting portion to a bonding head, an ultrasonic horn having a capillary and held in the horn holder, a linking arm pivotably connected at a second connecting portion to the horn holder a... | 08/02/2005 |
| 6912906 | Method and apparatus for the production and quality testing of a bonded wire connection Method of producing a bonded wire connection between an electronic component or a subassembly and a carrier by introducing energy from an ultrasound transducer into a wire that is to be bonded. According to this method, during the introduction of energy the impedanc... | 07/05/2005 |
| 6905058 | Bonding tool and wire bonder Bonding tool for ultrasonic wire bonding, with a knife (3) that is inserted into or closely apposed to the bonding tool so as to be longitudinally movable with respect thereto, in order to cut a projecting part of a bonded wire immediately behind a bonded con... | 06/14/2005 |
| 6709769 | Component for multilayer printed circuit board, method of production thereof and associated multilayer printed circuit board A method is described for the manufacture of a Copper-Aluminium-Copper component (C-A-C “sandwich”) which can be used in the production of multilayer printed circuit boards, obtained by means of joining two external sheets of copper to one internal sheet of alum... | 03/23/2004 |
| 6662992 | Method and apparatus for reducing adhesive build-up on ultrasonic bonding surfaces A method for reducing adhesive build-up on ultrasonic bonding surfaces of ultrasonic bonding systems is disclosed. The method includes providing an ultrasonic bonding surface. A pad is provided proximate to, and in fluid contact with, the ultrasonic bondi... | 12/16/2003 |
| 6659329 | Soldering alloy A new soldering technique and solder alloy for wetting and joining hard-to-wet materials including titanium alloys such as nitinol uses a solder alloy containing tin and an active wetting promoting element such as aluminum in the presence of ultrasound. A... | 12/09/2003 |
| 6467679 | Wire bonding method A wire bonding apparatus equipped with a chip heating assembly which is installed above a heater block that contains heaters so as to heat the chip portion of a device such as a semiconductor device, and a cooling pipe which is installed in the heater blo... | 10/22/2002 |
| 6176416 | Method of making low-profile wire connection A method of making low profile wire connection comprising steps of: connecting a wire to a first bonding point, moving a capillary straight up a first length, moving the capillary away from a second bonding point thus making the first reverse action to be... | 01/23/2001 |
| 6173878 | Device for connecting metallic materials The invention relates to a device for connecting metallic materials, in particular electrical conductors such as flexible cables, by means of a transducer (10) which generates ultrasonic oscillations and contains a sonotrode (16) with a sonotrode head (14... | 01/16/2001 |
| 6152348 | Device for the application of joint material deposit Device for the singled-out application of joining material deposits (30), particularly solder beads, from a joining material reservoir (11) with an application device (13) and a singling-out device (12) for singling-out joining material deposits from the ... | 11/28/2000 |
| 6095396 | Bonding load correction method and wire bonding apparatus A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values that limit an electric power not only in a state in which ... | 08/01/2000 |
| 6095401 | System and method for supression of bubble generation during ultrasonic welding of a printer cartridge A system and method for suppression of air bubble generation in the ink supply and nozzles of an ink-containing printer cartridge when ultrasonic welding is performed on the ink-containing printer cartridge. The printer cartridge has a top end and a botto... | 08/01/2000 |
| 5634586 | Single point bonding method A single point bonding method used in individually bonding, for example, the leads of a pad of a chip to a pad of a circuit board, including the steps of forming a pressure scar at the free end of each lead by a bonding tool, catching the irregular portio... | 06/03/1997 |
| 5493069 | Method of ultrasonically welding together two conductors An improved method of ultrasonically welding together two conductors having differing lateral dimensions comprising selecting a welding capture fixture having lateral sides spaced apart by a distance substantially equal to the lateral dimension of a first... | 02/20/1996 |
| 5492263 | Method for wire bonding an aluminum wire to a lead of an electronics package A method is provided for wire bonding an aluminum wire to a surface of a lead of an electronics package. The method entails a nickel plating process and an ultrasonic bonding process which together cooperate to form a reliable and highly repeatable joint ... | 02/20/1996 |
| 5476208 | Superconducting joint for foils used in superconducting magnets Method for forming welded joints on superconducting foils to form long lengths of foil for use in superconducting magnet tapes including fixturing for controlling the accurate positioning of sheared foils and control of the overlap to be welded.... | 12/19/1995 |
| 5403785 | Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby An IC chip package is fabricated from a substrate carrying an IC chip and formed with a conductive pattern of conductors for electrical connection to the IC chip, and a leadframe having a plurality of connector leads with inner and outer lead sites for el... | 04/04/1995 |
| 5341979 | Method of bonding a semiconductor substrate to a support substrate and structure therefore A method and means of bonding a semiconductor die (10) to a support substrate (35) using a thermosonic bonding apparatus (50). The semiconductor die (10) has bonding pads (14, 15, 17) on a first major surface (12), and the support substrate (35) has conta... | 08/30/1994 |
| 5288006 | Method of bonding tab inner lead and bonding tool A bonding tool having a round pointed end smaller than the bonding pad for the semiconductor element is urged with a bonding force F1 and pressed down into the inner lead of a TAB tape such that the bonding tool end and inner lead come in close... | 02/22/1994 |
| 5288007 | Apparatus and methods for making simultaneous electrical connections The present invention relates generally to apparatus and methods for making simultaneous electrical connections, and more particularly to making these electrical connections simultaneously using a new bond tip configuration. Various methods and processes ... | 02/22/1994 |
| 5277356 | Wire bonding method A method of bonding an end of an aluminum wire to a lead comprises the steps of: forming a plurality of parallel bonding grooves on a surface of the lead; pressing the wire end against the grooved surface of the lead with the wire end held in parallel to ... | 01/11/1994 |
| 5251805 | Wire bonding method and apparatus A wire bonding method and apparatus for welding a wire with at least one end formed with a ball and a pad of a printed wiring board. A bonding head moves downward slowly to crush the ball to form a flat surface, and will move upward once to adjust a relat... | 10/12/1993 |
| 5249728 | Bumpless bonding process having multilayer metallization A method of electrically connecting a tape automated bonding lead to an aluminum input/output pad of an integrated circuit includes sequentially sputtering an adhesive layer, a diffusion barrier layer and a gold layer on the input/output pad. The adhesive... | 10/05/1993 |
