Class 228/111.5 - Soldering or liquid phase bonding

Subclass of Class 228 - Metal fusion bonding
Definition: Process under 110.1 comprising fusion bonding by use of
No. of patents: 71
Last issue date: 12/27/2011

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Number	Title	Issue Date
8083121	Paste for soldering and soldering method using the same In the soldering method, metal-powder-contained flux is disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprising a core metal formed of metal such as tin and zinc and a surface metal covering surfaces ...	12/27/2011
7624906	Ultrasonic brazing of aluminum alloy and aluminum matrix composite A method of ultrasonic brazing metal matrix composite, which forms a reinforced composite bond without filling welding wire with reinforcement or adding alloy element to generate ceramic phase, includes the steps of setting a filler metal; introducing ultrasonic vib...	12/01/2009
7604152	Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same A soldering technology, particularly a lead-free soldering technology, that can secure the reliability of a whole electronic device is provided. In a method for manufacturing a printed circuit board for electronic devices with a substrate to which a plurality of ele...	10/20/2009
7293567	Application of acoustic and vibrational energy for fabricating bumped IC die and assembly of PCA's A method and apparatus are disclosed for improving a screen printing process by applying vibrational energy to assist in the print release, cleaning, and drying processes. The vibrational energy or acoustic pressure waves may be created by a transducer where the wav...	11/13/2007
7275440	Loop-shaped ultrasound generator and use in reaction systems Ultrasound for use in chemical reactions is generated by an electromagnet formed from an ultrasound transducer whose central feature is a loop of magnetostrictive material wound with coils oriented to produce an oscillating magnetostrictive force when an oscillating...	10/02/2007
7264146	Ultrasonic tool and ultrasonic bonder An ultrasonic tool, for bonding two materials to each other by joining a face of one of the materials to a face of the other material using the action of ultrasonic waves applied to one of the materials through another face of the one of the materials, wherein the u...	09/04/2007
7220388	Micro-channel chemical concentrator Apparatus and method for increasing the concentration of a chemical substance in a fluid comprise a micro-fluidic elongated channel formed in a substrate, with the channel being in fluid-flow communication with an ambient region along its elongated dimension. In gen...	05/22/2007
7202088	Arrangement for the parallel testing of materials The present invention relates to an arrangement, in particular for the parallel testing of a plurality of building blocks of a material library for performance characteristics, in which the arrangement has a block containing at least one reaction module and at least...	04/10/2007
7156281	Bonding device and bonding tool A bonding device is for bonding an object to be bonded under pressure to a surface to be bonded by allowing a load and vibration to act on the object to be bonded. The bonding device includes a bonding tool 14 abutting on the object to be bonded, and a pressi...	01/02/2007
7111466	Microreactor and substance production method therewith A microreactor comprises a reaction chamber, into which prescribed materials are introduced, a production chamber, and a channel for connecting the reaction chamber and the production chamber together. A plurality of temperature adjusting devices (e.g., Peltier elem...	09/26/2006
7104406	Micro-filter for filtering blood cells A micro-filter for filtering blood cells has a plurality of filtering channel structures, each having a first through hole and a first concave portion connecting to each other, and a plurality of through channel structures respectively connect to the filtering chann...	09/12/2006
7055733	Oxidation ceramic to metal braze seals for applications in high temperature electrochemical devices and method of making A method of joining metal and ceramic parts, wherein an alumina forming metal part and a ceramic part are provided. A braze material in placed between the alumina forming metal part and the ceramic part, and the combination is then heated in an oxidizing atmosphere,...	06/06/2006
7040526	Electronic parts assembling and testing method, and electronic circuit baseboard manufactured by the method A method for assembling and testing an electronic circuit baseboard includes at least a step of soldering at least one electronic part to an electronic circuit baseboard using Pb excluded solder. One of erroneous wiring, erroneous mounting, malfunction, and defectiv...	05/09/2006
7032806	Methods of positioning components using liquid prime movers and related structures A liquid prime mover can be used to position a component on a substrate. For example, a liquid material can be provided on the substrate adjacent the component such that the component has a first position relative to the substrate. A property of the liquid material ...	04/25/2006
7028536	Sealing interface for microfluidic device A threadless interface for a fluidic system includes a microfluidic device having an outer surface and an internal near-surface channel having a first width and disposed at a first depth relative to the outer surface, with the first width being less than about two t...	04/18/2006
7030320	Water cutoff structure of covered wire A water cutoff structure of a covered wire comprising an upper side member and a lower side member for carrying out water cutoff to the covered wire by sandwiching a covered wire constituted by covering core lines by a pair of water cutoff members made of a resin re...	04/18/2006
7004282	Ultrasonic horn An ultrasonic horn in accordance with the present invention comprises a horn body having a longitudinal transmission axis, a proximal end attachable at least indirectly to a source of ultrasonic vibrations, and a distal end with an active end face. The end face is p...	02/28/2006
6994153	Heat discharger suitable for application to heat pipes One object of the present invention is to realize a heat discharger having a high precision and in which heat conduction efficiency is maintained at the bonding between the heat pipe and heat sink. A heat discharger comprises a heat pipe and a heat sink formed separ...	02/07/2006
6967287	Water cutoff structure of covered wire In a water cutoff structure of a covered wire, a water cutoff portion of an upper side member of a water cutoff member is formed in a recessed shape which is a shape of a curved face along an outer shape of the covered wire. Further, a water cutoff portion of a lowe...	11/22/2005
6932262	Bonding method and bonding apparatus Disclosed are a bonding method for a semiconductor chip, which employs an ultrasonic bonding scheme that prevents wear-out of the top surface of a mount tool and ensures both high reliability and high productivity, and a bonding apparatus which is used to carry out ...	08/23/2005
6928731	Ultrasonic bonding process for making a microfluid device A piezoelectric ceramic ink-jet print head is made by an inventive ultrasonic bonding process. Specifically, there are several improved features of ink jet print heads, including a more cost-effective bonding process using an ultrasonic bonding technique, an improve...	08/16/2005
6926187	Ultrasonic manufacturing apparatus The present invention pertains to a multilayer flexible wiring board. The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiri...	08/09/2005
6902934	Methods for identifying optimizing catalysts in parallel-flow microreactors A chemical processing microsystem useful for identifying and optimizing, materials (e.g., catalysts) that enhance chemical processes or for characterizing and/or optimizing chemical processes is disclosed. The chemical processing microsystem comprises a plurality of...	06/07/2005
6761302	Device mounting method When a substrate electrode (6) formed on a semiconductor substrate (5) and a device electrode (14) formed on an optical device (13) are joined to each other by solder to mount the device (13) on the substrate (5), a solder p...	07/13/2004
6726086	Liquid phase diffusion bonding to a superalloy component A method for the manufacturing or repair of a superalloy gas turbine component including a liquid phase diffusion bonding process wherein the brazing heat treatment used for the diffusion bonding of a powder material to the component is accomplished by a heat cycle ...	04/27/2004
6691909	Sonotrode for ultrasonic welding apparatus An apparatus and method for ultrasonically welding workpieces that reduces sonotrode adhesion during the ultrasonic welding process. The sonotrode includes a contact surface wherein a fluid is deposited on the contact surface prior to the welding process....	02/17/2004
6659329	Soldering alloy A new soldering technique and solder alloy for wetting and joining hard-to-wet materials including titanium alloys such as nitinol uses a solder alloy containing tin and an active wetting promoting element such as aluminum in the presence of ultrasound. A...	12/09/2003
6620722	Bumping process A process of forming a solder bump on a semiconductor device including vibrating a solder reservoir carrier in a vertical direction while pressure and heat are applied to the solder reservoir. An engagement surface of the solder reservoir is contacted wit...	09/16/2003
6534195	Connection structure for metallic members and connecting method therefor Sn--Zn alloy is plated on at least one of a first metallic member and a second metallic member, Sn--Ag alloy is used as a solder, the first metallic member and the second metallic member are connected by the solder, and a connection structure of metallic ...	03/18/2003
6471111	Method and apparatus for acoustic pressure assisted wave soldering A method and apparatus are disclosed for improving the release of molten solder from a module via the introduction of acoustic pressure waves to the module and/or molten solder wave. The acoustic pressure waves may be created by a transducer where the wav...	10/29/2002
6409072	Chemical microreactors and method for producing same Chemical microreactors for chemical systhesis and their methods of manufacture are known, but have disadvantages such as extremely high manufacturing costs or poor flexibility for adaptation to various cases of application. These disadvantages are avoided...	06/25/2002
6371356	Manufacturing method of a magnetic head with use of a capillary having a recess A magnetic head includes a metal plate having a conductive pattern, and a slider having a head element and a connecting terminal electrically connected to the head element, and fixed on the metal plate. The connecting terminal and the conductive pattern a...	04/16/2002
6367683	Solder braze alloy The invention, which permits active solder braze technology to be used in a more versatile manner, relates to a solder braze alloy and to a method for joining workpieces by soldering by means of a solder braze alloy. The novel alloy is characterized in th...	04/09/2002
6198599	Magnetic head with bonded balls having a capillary mark A magnetic head includes a metal plate having a conductive pattern, and a slider having a head element and a connecting terminal electrically connected to the head element, and fixed on the metal plate. The connecting terminal and the conductive pattern a...	03/06/2001
6148515	Method of bonding aluminum members The method of the present invention comprises the steps of: providing a first aluminum member and a second aluminum member to be bonded to each other; forming a zinc alloy soldering layer on the surface while applying ultrasonic vibration to any one of the fir...	11/21/2000
6138894	Method for coupling a circuit component to a substrate A technique is utilized for coupling a circuit component to a substrate. The circuit component, such as a die, includes a plurality of contacts on one of its surfaces. The contacts may take the form of gold bumps. Solder is placed between the contacts of ...	10/31/2000
6138897	Self-aligining end effector for friction soldering metals to glass plate Method of aligning a metallic solderable object to a glass plate comprising loading a solderable object onto an end effector of a robotically supported spindle of a spindle assembly, handing a support from the spindle assembly that extends beneath the axi...	10/31/2000
6123248	Soldering method and soldering apparatus Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of lead is prepared. The content of other metallic components ...	09/26/2000
6073832	Soldering method and apparatus Method and apparatus, by which the relative displacement between molten solder and a terminal pin is caused and further, a coating formed on an end portion of a coil is removed by molten solder and thus the terminal portion is firmly soldered to the termi...	06/13/2000
6047876	Process of using an active solder alloy A process for joining workpieces by active soldering. The process includes cleaning the surfaces of the workpieces to be joined; heating the workpieces to be joined; placing an active, low-temperature solder material on at least one of the surfaces of the...	04/11/2000

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Class 228/111.5 - Soldering or liquid phase bonding