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| Number | Title | Issue Date |
| 8186565 | Method of bonding aluminum-boron-carbon composites An aluminum-boron-carbon (ABC) ceramic-metal composite bonded to a metal or metal-ceramic composite other than ABC composite is made by forming a porous body comprised of particulates being comprised of a boron-carbon compound that has a particulate layer of titaniu... | 05/29/2012 |
| 8186566 | Method for cohesively bonding metal to a non-metallic substrate A process for cohesive bonding between a metal surface and a nonmetallic substrate is provided. The non-metallic substrate may comprise a plurality of microfilaments and/or nanofilaments dispersed into and below the surface of the substrate. The application of press... | 05/29/2012 |
| 8167187 | Method and device for producing a bondable area region on a carrier A method and a device is provided for levelling an area region on the surface of a metal or metallization layer of a carrier. The area region is made planar by the action of a stamp or of a roller. ... | 05/01/2012 |
| 8146794 | Boom and arm member of construction machine excellent in weld zone fatigue strength and method of improvement of its fatigue strength The present invention provides a boom and arm member of a construction machine excellent in weld zone fatigue strength and a method of improvement of its fatigue strength, that is, a boom and arm member of a construction machine superior in weld zone fatigue strengt... | 04/03/2012 |
| 8118209 | Ultrasonic welding apparatus and ultrasonic welding method An ultrasonic welding apparatus 1 includes an anvil equipped with a terminal clamp 3 for disposing an electrical contact part 31 connected to an electronic device and a core wire weld part 32 which ranges to the electrical contact part | 02/21/2012 |
| 8047420 | Method for producing a welded joint between electrical conductors by means of an ultrasonic welding method A method for production of a welded connection between at least one first electrical conductor and at least one second electrical conductor, in which the conductors are brought into a compression chamber enclosed by delimitation elements and welded therein by an ult... | 11/01/2011 |
| 8025202 | Method for manufacturing sealed battery A sealed battery includes an ultrasonic fusion process whereby layers of a positive electrode substrate exposed portion are ultrasonically fused to form a positive electrode fused portion at the positive electrode substrate exposed portion, and layers of a negative ... | 09/27/2011 |
| 8020746 | Method and device for controlling the generation of ultrasonic wire bonds A method for generating a wire bond between a wire and an electrical contact member is provided. The method comprising the steps of: pressing a first surface of a portion of the wire against a second surface of the electrical contact member with a first force while ... | 09/20/2011 |
| 8020747 | Soldering method and soldering apparatus Along with miniaturization of a solder connection portion in a bump repair or a local reflow, a void generated at the time of soldering remains in a solder to remarkably reduce connection strength, and there occurs a non-connection phenomenon in which the solder con... | 09/20/2011 |
| 8011559 | Active material-augmented vibration welding system and method of use A method for controlling welding forces of a weld tip to a work piece during a vibration-welding process includes positioning an Active Material (AM) element adjacently to a welding interface, and varying a property of the AM element to regulate the welding force. T... | 09/06/2011 |
| 7954690 | Inkjet print head, inkjet print head manufacturing method and inkjet print head mounting tool An inkjet print head for which an ink flow path formation member, arranged on a printing element board, is prevented from being peeled off or being damaged, and the printing element board in an appropriate state can be mounted on a support member. According to the p... | 06/07/2011 |
| 7934633 | Ribbon bonding tool and process An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underly... | 05/03/2011 |
| 7909228 | Ribbon bonding tool and process An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underly... | 03/22/2011 |
| 7896219 | Method and apparatus for ultrasonic welding of terminals A method and apparatus for welding of battery terminals to an interconnect includes: juxtaposing two or more battery cell terminals to each other to create a terminal stack including an innermost terminal and an outermost terminal; juxtaposing a battery cell interco... | 03/01/2011 |
| 7850056 | Electronic component mounting apparatus and electronic component mounting method In a direction parallel to a direction 5 of ultrasonic vibrations imparted from an ultrasonic vibrator 1, the shape of a center portion 3a of a tool 3 and the shape of an end portion 3b of the tool 3 are change... | 12/14/2010 |
| 7828193 | Method of mounting an electronic component and mounting apparatus In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps. The electrode terminals of the substrate and the electrode terminals of the electronic com... | 11/09/2010 |
| 7828192 | Amplitude adjustment of an ultrasonic horn A system and method for maintaining a substantially constant gap between a horn and an anvil includes the act of positioning a horn proximal an anvil, so that a gap is established between the horn and the anvil. An alternating current (AC) signal is applied to a con... | 11/09/2010 |
| 7819302 | Aluminum end caps ultrasonically welded to end of aluminum tube An aluminum tubular unit for long-term, leak-free storage of fluids is formed in which an aluminum cap is ultrasonically welded to an end of the aluminum tube. The ultrasonic weld is formed from a device capable of producing a torsional vibration pattern. The ultras... | 10/26/2010 |
| 7789287 | Method of bonding The present invention provides a bonding method in which a bonded portion having a sufficient bonding strength can be obtained at a relatively low temperature, for example, in die bonding a semiconductor chip. A metal paste 20 was applied to a semiconductor c... | 09/07/2010 |
| 7712650 | Method of mounting a semiconductor chip When a semiconductor chip is mounted using ultrasonic vibration, a method of mounting makes it possible to bond the semiconductor chip and bonding patterns with sufficient bonding strength without making the construction of a circuit board complex. The method of mou... | 05/11/2010 |
| 7658313 | Ball forming device in a bonding apparatus and ball forming method A ball forming device and method used in a bonding apparatus, including a bonding arm, a capillary attached to the bonding arm, an electronic flame off prove for forming a ball at the tip of a wire passing through the capillary, and a gas atmosphere forming unit for... | 02/09/2010 |
| 7648057 | Ultrasonic flange joining method In an ultrasonic joining method for joining a flange portion of a first member to a portion of a second member, a first horn and a second horn are arranged on the flange portion on a side opposite to the second member, and the first horn is vibrated in a condition t... | 01/19/2010 |
| 7600665 | Method for welding conductors The invention concerns a method for welding electric conductors using ultrasound, whereby the conductors (32) are introduced into a compression chamber (30) that is bounded by at least two boundary elements and are welded after the compression chamber ... | 10/13/2009 |
| 7597235 | Apparatus and method for producing a bonding connection One aspect relates to a bonding apparatus for producing a bonding connection between a bonding wire and a bonding partner. The bonding apparatus includes a heel shaper, which is provided for avoiding damage to the bonding wire in the heel region during the bonding o... | 10/06/2009 |
| 7581667 | Tool head for attaching an electrical conductor on the contact surface of a substrate and method for implementing the attachment A tool head for attaching an electrical conductor on the contact surface of a substrate, comprising a vibration exciter for generating linear ultrasonic vibrations; a bonding tool that is able to contact the contact surface and/or the conductor, a contact pressure b... | 09/01/2009 |
| 7568607 | Apparatus and method for welding a pour spout fitment to a container Apparatus for use in welding a pour spout fitment (22) to a container (32) comprises an ultrasonic welding horn (18) formed with a recess (20) at one end for receiving part of the fitment (22), an anvil (2) between an annula... | 08/04/2009 |
| 7568608 | Ultrasonic stir welding process and apparatus An ultrasonic stir welding device provides a method and apparatus for elevating the temperature of a work piece utilizing at least one ultrasonic heater. Instead of relying on a rotating shoulder to provide heat to a workpiece an ultrasonic heater is utilized to pro... | 08/04/2009 |
| 7549567 | Component mounting tool, and method and apparatus for mounting component using this tool Component 3 is pressed onto a circuit board 4 so that their respective metal interconnects 5, 6 are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle 14 holding the component 3. Friction is... | 06/23/2009 |
| 7523849 | Ultrasonic welding method, ultrasonic welding device and pipe joined by the same An ultrasonic welding method and an ultrasonic welding device are provided to join a first member having a substantial pipe shape and a second member at a joining surface by pressure-applying and vibration-exciting. In an arranging process, each of a first horn memb... | 04/28/2009 |
| 7445140 | Production method of ultrasonic weld assembly When a weld area of weld surface between a flange portion 3a of a pipe 3 and a flange portion 4a of a pipe connection member 4 is S and total energy consumed on the weld surface is Et, ultrasonic welding is carried out to pr... | 11/04/2008 |
| 7441689 | Orbital friction welding method and device for carrying out said method The invention relates to an orbital friction welding method and a friction welding device for welding workpieces by means of friction welding units, wherein the workpieces are pressed against each other in the contact plane during the application of the oscillation ... | 10/28/2008 |
| 7431193 | Vibration stress relief of weldments A method of stress relief for stainless steel combustion turbine components includes vibrating the components during welding at a subharmonic frequency. The proper frequency is selected to be below a harmonic frequency, and to produce an amplitude in the range of ¼... | 10/07/2008 |
| 7427009 | Capillary for wire bonding A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of th... | 09/23/2008 |
| 7424966 | Method of ultrasonic mounting and ultrasonic mounting apparatus using the same A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip 52 to a substrate 50 using an ultrasonic mounting app... | 09/16/2008 |
| 7413108 | Wedge-bonding of wires in electronic device manufacture with reversible wedge bonding tool In the manufacture of electronic devices (22, 22′), e.g. discrete semiconductor power devices or ICs, a reversible bonding tool (10) is used having a bonding tip or wedge (1, 2) at each of its opposite ends (11, 12). After extensive use... | 08/19/2008 |
| 7404513 | Wire bonds having pressure-absorbing balls A semiconductor device with a chip having at least one metallic bond pad (101) over weak insulating material (102). In contact with this bond pad is a flattened metal ball (104) made of at least 99.999% pure metal such as gold, copper, or silver... | 07/29/2008 |
| 7392923 | Ultrasonic welding machine, as well as tool for an ultrasonic welding machine An ultrasonic welding machine having a tool in the form of, for example, a sonotrode. In order to allow for an optimal utilization of the working surfaces of the sonotrode, it is proposed to move or mount the sonotrode in a desired position with respect to the eleme... | 07/01/2008 |
| 7377416 | Ultrasonic welding horn for welding a seam in an imaging receptor belt In ultrasonic welding of a seam, such as for creation of an imaging belt, an ultrasonic welding horn is applied to an overlap area. The welding horn has a contact surface within a certain set of dimensions comparable to the overlap area. The welding horn defines a c... | 05/27/2008 |
| 7370786 | Bonding method and bonding apparatus Disclosed are a bonding method for a semiconductor chip, which employs an ultrasonic bonding scheme that prevents wear-out of the top surface of a mount tool and ensures both high reliability and high productivity, and a bonding apparatus which is used to carry out ... | 05/13/2008 |
| 7370784 | Friction stir welding apparatus and robot employing the apparatus A friction stir welding apparatus capable of stably applying a pressure force without enlarging the apparatus, and a robot having thereof are provided. A rotating tool (22) is provided with a rotational shaft (26) and a hollow surrounding shaft (27 | 05/13/2008 |
