Celebrity Inventors
Mark Twain (Samuel L. Clemens) received Patent No. 121,992 for "An Improvement in Adjustable and Detachable Straps for Garments." He later received two more patents: one for a self-pasting scrapbook and one for a game to help players remember important historical dates.
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| Number | Title | Issue Date |
| 7637412 | Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece Stenciling machines and methods for forming solder balls on microelectronic workpieces are disclosed herein. In one embodiment, a method for depositing and reflowing solder paste on a microelectronic workpiece having a plurality of dies includes positioning a stenci... | 12/29/2009 |
| 7591406 | Soldering method, soldering device, bonding method, bonding device, and nozzle unit Provided is a nozzle unit for use in a bonding device in which bonding between a first member and a second member is effected by providing a bonding member that has been melted by heating at a bonding position where the first member and the second member are to be b... | 09/22/2009 |
| 7407081 | Methods and apparatus for transferring conductive pieces during semiconductor device fabrication In a first aspect, a programmable transfer device is provided for transferring conductive pieces to electrode pads of a target substrate. The programmable transfer device includes (1) a transfer substrate; and (2) a plurality of individually addressable electrodes f... | 08/05/2008 |
| 7404511 | Laser trimming problem suppressing semiconductor device manufacturing apparatus and method A semiconductor device manufacturing apparatus includes a substrate holding section that holds a semiconductor wafer substrate, a discharge mechanism that discharges liquid drops of metal paste from a discharge nozzle toward a surface of the semiconductor wafer subs... | 07/29/2008 |
| 7347348 | Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece Stenciling machines and methods for forming solder balls on microelectronic workpieces are disclosed herein. In one embodiment, a method for depositing and reflowing solder paste on a microelectronic workpiece having a plurality of dies includes positioning a stenci... | 03/25/2008 |
| 7296725 | Feed devices and methods for injection molded solder systems A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second lea... | 11/20/2007 |
| 7150096 | Universal tool for uniformly applying a force to a plurality of components on a circuit board A method for applying pressure to circuit components during a manufacturing operation. The method utilizes a plurality of compressed air pressure cylinders which are supported on a plurality of horizontal arms along different axes over a circuit board. Compressed ai... | 12/19/2006 |
| 7131565 | Feed devices and methods for injection molded solder systems A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second lea... | 11/07/2006 |
| 6899261 | Method and arrangement for a martensite-free brazing process An apparatus for brazing a connecting piece of electrically conducting material such as metal, to a metal surface by means of a new type of temperature-controlled brazing whereby for certain types of material a brazing is obtained that is free of martensite formatio... | 05/31/2005 |
| 6722553 | Controlled and programmed deposition of flux on a flip-chip die by spraying A method and apparatus are provided for controllably dispensing flux on a substrate having a plurality of conductive terminals. Flux having a viscosity range between 10 centipoises and about 150 centipoises is sprayed on the substrate and the conductive terminals at... | 04/20/2004 |
| 6708863 | Heat bonding method and heat bonding device In heat bonding method and device, first and second marks (MA, MB) formed on the film carrier (52) are measured before performing heat bonding of outer leads (54) formed on a film carrier (52) to electrodes (58) formed on a transparent pl... | 03/23/2004 |
| 6705507 | Die attach system and process using cornercube offset tool A system and method having applications in semiconductor areas for accurate die placement on a substrate that takes into account any positional offset from the reference position due to variations caused by thermal change and other nonrandom systemic effects. The sy... | 03/16/2004 |
| 6699306 | Control method for copper density in a solder dipping bath This method controls a copper density in a dip solder bath holding a molten solder alloy containing at least copper as an essential composition thereof during a dip soldering step of one of a printed circuit board with a surfaced copper foil and a compone... | 03/02/2004 |
| 6502738 | Wire bonding apparatus A wire bonding apparatus comprising: a spool motor rotates a spool around which a wire is wound, a tension-applying device that is disposed beneath the spool, a wire pay-out sensor disposed away from a gas-jet-out side of the tension-applying device so as... | 01/07/2003 |
| 6464125 | Rework and underfill nozzle for electronic components A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor ... | 10/15/2002 |
| 6213374 | Feeder of wire solder Beads or ridges formed by metal work such as knurling provide peaks and valleys on a shaft of a rotary disc, which is part of an abnormal detector of wire solder, so that frictional force between the wire solder is strengthened. Further, the same peaks an... | 04/10/2001 |
| 6079607 | Method for high frequency bonding A method of forming a ball weld during the fabrication of a semiconductor device wherein a pad (3) and a gold ball (9) to be bonded to the pad is provided over the pad. Ultrasonic energy from an ultrasonic energy source (11) is applied to the ball to soft... | 06/27/2000 |
| 5538175 | Adjustment of a solder wave process in real-time In a wave solder manufacturing process, a test device is used to measure the contact-area between a solder wave and a printed wiring board. In particular, the test device is a printed wiring board (PWB) that includes at least two arrays of electrical cont... | 07/23/1996 |
| 5115959 | Soldering machine for rope chain An automatic soldering machine for soldering a rope chain comprises a pair of gears, each with a peripheral surface defining a trench which engages one of the strands of the rope chain and which is rotatable to precisely feed and place successive link jun... | 05/26/1992 |
| 4899920 | Apparatus for removal and installing electronic components with respect to a substrate This invention relates to a method and apparatus for removing and installing surface mounted devices (SMD's) with respect to a substrate such as a printed circuit board (PCB).... | 02/13/1990 |
| 4890781 | Automated flow solder machine A computer controlled flow solder machine is controlled by a computer, operating in conjunction with two other computers, to control the operation of the machine and to control and monitor the process parameters for each circuit board processed through th... | 01/02/1990 |
| 4850524 | Vertical strip clad welding method and apparatus Method and apparatus for vertical strip clad overlay welding. The method comprises matching the vertical travel of a special welding shoe to an appropriate amount of strip electrode melt-off necessary to maintain a preset molten pool level within a reserv... | 07/25/1989 |
| 4824006 | Die bonding apparatus A die bonding apparatus comprising a paste supply section having a needle for supplying paste onto a package to secure a semiconductor pellet, a driving section for moving the paste supply section in the directions of X, Y and Z, respectively, a follow-up... | 04/25/1989 |
| 4583674 | Apparatus for applying stripes of solder to opposite sides of circuit boards Printed circuit boards 10 having connector terminals 14 and 16 overlaying contact pads 17 and 18 are loaded into fixtures 22 which are conveyor 31 advanced through a pair of solder applying stations 33 and 34 whereat solder is laid and melted at the junct... | 04/22/1986 |
| 4373657 | Devices and method for delivery of solder and brazing material A soldering device having a guide body for receiving and delivering a filler metal to form a weldment. The guide body has an end portion which is positioned in the path of the heat from the burner to preheat the filler metal therein. The temperature of th... | 02/15/1983 |
| 4288020 | Tracking type welding apparatus A tracking type welding apparatus wherein a torch follows a probe along a weld seam and the probe senses lateral seam deviations and stores them in a pin cam and wherein the deviations are later used to move the torch in the same manner. The pin cam is re... | 09/08/1981 |
| 4179059 | Automatic pipe welding apparatus and method A TIG pipe welding method which employs two sets of machine guide surfaces on the pipe ends. First radially inner guide surfaces cooperate with a sensor coupled to the welding torch to continuously monitor the arc gap between the welding electrode and the... | 12/18/1979 |
| 3946930 | Apparatus for jet soldering containers This disclosure relates to a jet soldering apparatus for applying a jet of solder to a side seam of a can body formed in a bodymaker. The soldering apparatus includes a heated metal block having an elongated cavity which terminates in a discharge orifice.... | 03/30/1976 |
