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| Number | Title | Issue Date |
| 7357288 | Component connecting apparatus When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection... | 04/15/2008 |
| 7342402 | Method of probing a device using captured image of probe structure in which probe tips comprise alignment features An image of an array of probes is searched for alignment features. The alignment features are then used to bring contact targets and the probes into contact with one another. The alignment features may be a feature of one or more of the tips of the probes. For examp... | 03/11/2008 |
| 7270258 | Method of fabrication of semiconductor integrated circuit device Productivity is to be improved in assembling a semiconductor integrated circuit device. A matrix substrate is provided and semiconductor chips are disposed on a first heating stage, and then the matrix substrate is disposed above the semiconductor chips on the first... | 09/18/2007 |
| 7213737 | Graphite braze bar inserts Disclosed is a braze bar carrier system for utilization in holding and maintaining the alignment of a plurality of components in an apparatus during a brazing process. The braze bar carrier system includes a graphite insert that prevents the brazing flux from wettin... | 05/08/2007 |
| 7210611 | Formed structural assembly and associated preform and method A superplastically formed structural assembly is provided, as is an associated preform and method for forming such an assembly. The assembly includes a skin member and a support member that are joined to define a space between the members and between the joints. The... | 05/01/2007 |
| 7141873 | Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument A semiconductor device including: a semiconductor chip; a wiring board on which the semiconductor chip is mounted; and a plurality of external terminals provided on the wiring board. The external terminals include at least one first external terminal and two or more... | 11/28/2006 |
| 7076867 | Pressurizing method A pressurizing method for pressurizing a second component arranged on a first component, against the first component by using a pressurizing apparatus having a stage on which the first component is mounted, a tool, and a protection sheet supplying section. The tool ... | 07/18/2006 |
| 7075036 | Electronic part compression bonding apparatus and method An electronic part compression bonding apparatus includes a compression bonding unit which bonds the electronic parts onto the substrate by thermocompression, a pressure supply unit, a pressure control unit which controls pressure, a heating unit which heats the com... | 07/11/2006 |
| 7070659 | System for filling openings in semiconductor products Explosive forces are used to fill interconnect material into trenches, via holes and other openings in semiconductor products. The interconnect material may be formed of metal. The metal may be heated prior to the force filling step. The explosive forces may be gene... | 07/04/2006 |
| 7051916 | Friction stir welding method The end of a hollow member 10 is abutted against the end of a hollow member 20. The end of a face plate 21 is supported on a protrusion 15. A small-diameter portion 52 of a rotary tool 50 is inserted into the abutted area, a... | 05/30/2006 |
| 7040012 | Method of electrically and mechanically connecting electronic devices to one another A method is provided for electrically and mechanically connecting a first electronic device to a second electronic device. At least one electric contact of the first device is located against an electric terminal of the second device. The electric contact is tacked ... | 05/09/2006 |
| 6993832 | Chip mounting device A chip mounting device of the present invention includes: an adhesive application unit 11; a temporary crimp unit 12; and a main crimp unit 13. In the unit 11, a camera 21 is used for detecting base material marks for each section ... | 02/07/2006 |
| 6995469 | Semiconductor apparatus and fabricating method for the same This conductor apparatus mounts through a bump a semiconductor chip having an electrode pad on a circuit board having a connection pad at a position opposite to the electrode pad. The bump comprises a first protruding electrode provided on the electrode pad, a secon... | 02/07/2006 |
| 6975016 | Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof A three-dimensional (3-D) integrated chip system is provided with a first wafer including one or more integrated circuit (IC) devices; a second wafer including one or more integrated circuit (IC) devices; and a metal bonding layer deposited on opposing surfaces of t... | 12/13/2005 |
| 6938338 | Method of making an electronic contact Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged... | 09/06/2005 |
| 6939735 | Microelectronic assembly formation with releasable leads A first microelectronic element is provided with leads having anchor ends connected to contacts and tip ends moveable with respect to the first microelectronic element. The leads can be provided on a carrier sheet that is assembled to the first microelectronic eleme... | 09/06/2005 |
| 6939738 | Component built-in module and method for producing the same A component built-in module including a core layer formed of an electric insulating material, and an electric insulating layer and a plurality of wiring patterns, which are formed on at least one surface of the core layer. The electric insulating material of the cor... | 09/06/2005 |
| 6907652 | Pipe connecting method A method of connecting a first pipe to a second pipe having an end part fitting into an end part of the first pipe, comprising arranging the end part of the second pipe within the end part of the first pipe, arranging a sleeve of a deformable material between said e... | 06/21/2005 |
| 6880742 | Separating seam welding device Shown is a device and a process for the simultaneous separating and welding of foils or foil tubes (5) where the device comprises at least one welding terminal (2) and an opposing terminal (3), | 04/19/2005 |
| 6488198 | Wire bonding method and apparatus A process and apparatus are described for wire bonding circuit pads of large scale integrated design. The bonding process employs a capillary tool that applies heat and pressure to the wires in order to bond them to the circuit pad. The circuit pad is sup... | 12/03/2002 |
| 6375061 | Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide ... | 04/23/2002 |
| 6311888 | Resin film and a method for connecting electronic parts by the use thereof This invention provides a resin film preferably used for mounting a semiconductor chip on a substrate through flip-chip connection, and a method based on the use of such a resin film. The resin film has a laminated B/A/B structure where a first resin laye... | 11/06/2001 |
| 6269999 | Semiconductor chip mounting method utilizing ultrasonic vibrations A semiconductor chip mounting method to prevent the occurrence of particles created while mounting the semiconductor chip onto a substrate using ultrasonic thermocompression bonding. The mounting method of the present invention utilizing ultrasonic vibrat... | 08/07/2001 |
| 6204467 | Method and apparatus for resistive welding A method and apparatus for resistive welding using an electrode holder having an elongated cylinder. The cylinder has a closed end and an open end. The cylinder contains a moveable piston. The piston includes a compression surface and an end adapted to re... | 03/20/2001 |
| 6202915 | Ultrasonic vibration bonding method An ultrasonic vibration bonding method comprising placing metal portions to be bonded formed on a base portion of a first member upon metal portions to be bonded of a second member, pressing the first and second members with a resonator and a mounting tab... | 03/20/2001 |
| 6199742 | Method and tooling arrangement for diffusing braze weight pressure in brazing of aerostructure honeycomb sandwich panel A method of brazing together a lightweight metallic aerostructure sandwich panel having at least two spaced face sheets and an intermediate honeycomb core layer comprises: providing a tooling base having a determinable upper surface; assembling spaced upper an... | 03/13/2001 |
| 6193136 | Component mounting method and apparatus Sealant 11 is supplied in advance to one or both of the electrical bonding areas 5,6 of the component 3 and the mounting surface 4, and as the component 3 is brought in contact with the mounting surface 4, the sealant 11 is compressed and filled therebetw... | 02/27/2001 |
| 6164518 | Wire bonding method and apparatus So as to obtain constant heights and shapes of a plurality of loops of bonded wires regardless of the position on the semiconductor chip where bonding is performed, the height position of a bonding tool at a bonding point when the first wire is bonded bet... | 12/26/2000 |
| 6126062 | Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide ... | 10/03/2000 |
| 6029879 | Enantiomorphic friction-stir welding probe A friction-stir welding probe tip is disclosed which has right-handed threads on one portion of the probe and left-handed threads on another portion of the probe such that weld material is drawn to the middle of the weld as the friction-stir welding probe... | 02/29/2000 |
| 6006981 | Wirefilm bonding for electronic component interconnection A system (30) is provided for interconnecting a first component (10) having multiple first bonding sites (16) and a second component (12) having multiple second bonding sites (18). The system (30) includes a leadframe (40) coupled to the first component (... | 12/28/1999 |
| 6003754 | Airfoil for a gas turbine engine and method of manufacture A fabricated gas turbine engine component and method of manufacturing. In one embodiment the component having a structural member with a cover member metalurgically bonded thereto. The bonding of the cover member being controlled by an apparatus that sequ... | 12/21/1999 |
| 6003756 | Airfoil for gas a turbine engine and method of manufacture A fabricated gas turbine engine component and method of manufacturing. In one embodiment the component having a structural member with a cover member metalurgically bonded thereto. The bonding of the cover member being controlled by an apparatus that sequ... | 12/21/1999 |
| 5899376 | Transfer of flux onto electrodes and production of bumps on electrodes A process of transferring a flux on electrodes of a semiconductor chip, a film carrier, or a substrate, the process comprising: using a transfer apparatus including a transfer baseplate having protrusions corresponding to said electrodes; dipping the tips... | 05/04/1999 |
| 5894982 | Connecting apparatus A heater tool, which bonds by thermocompression outer leads of a TCP to electrodes on an array substrate, is fixed to a support block and is movable between a compression-bonding position, wherein the distal end portion of the heater tool presses the TCP ... | 04/20/1999 |
| 5749511 | Method and apparatus for connecting two workpieces together In a method for connecting two workpieces together by a welded seam, the workpieces are held in a welding station between opposed tracks consisting of a plurality of members. The tracks run around guide rollers in a conveying direction. A clearance (a) be... | 05/12/1998 |
| 5667132 | Method for solder-bonding contact pad arrays Solder bonding of first and second contact pad arrays is accomplished by forming contact structures, such as posts with vertical or tapered sides, on the contact pads of the first array and solder bumps on the second array. The respective contact structur... | 09/16/1997 |
| 5655700 | Ultrasonic flip chip bonding process and apparatus A process for bonding a flip chip (20), of the type having an active face provided with conductive bumps, to a substrate (22) so that its active face is oriented toward the substrate (22). The flip chip (20) is coupled through a vacuum to the distended en... | 08/12/1997 |
| 5511719 | Process of joining metal members A process of joining metal members, comprising the steps of: providing a first group of a plurality of metal members, each member having a solder bead formed thereon; providing a second group of a plurality of metal members, each member having a solder be... | 04/30/1996 |
| 5478006 | Printed-circuit substrate and its connecting method A printed-circuit substrate is provided with: a film-shaped support base having an electrical insulating property and elasticity, which includes a resin mold section for supporting an IC; a plurality of foil-shaped electrodes which are connected to the IC... | 12/26/1995 |
