Bizarre Patents
Combination Beverage Container and Spittoon
A combination beverage container and spittoon includes a bottom portion including outer wall and a first inner wall defining a spittoon space.
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| Number | Title | Issue Date |
| 7886956 | Bonding apparatus and bonding stage height adjustment method for the bonding apparatus A bonding apparatus includes: a reference plane; a bonding arm configured to be rotated about a rotation center that is arranged separately from the reference plane and to move a capillary attached at a tip end thereof obliquely toward and away from the reference pl... | 02/15/2011 |
| 7597234 | Method for mounting a flip chip on a substrate The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding pads on the substrate location. Reference marks are attached to the bo... | 10/06/2009 |
| 7380697 | Welding condition monitoring device A welding condition monitoring device for monitoring the welding state of a welding work portion by taking an image thereof by an image sensor having a wide dynamic range and capable of taking an image covering a very bright welding portion and relatively dark porti... | 06/03/2008 |
| 7353976 | Wire bonder A Wire Bonder contains a bondhead and a rocker arranged on the bondhead that is rotatable on a horizontal axis. A horn with a flange is attached to the rocker in which a capillary is clamped. At least one sensor is attached to the bondhead that detects vibrations of... | 04/08/2008 |
| 7342409 | System for testing semiconductor components A system for testing semiconductor components includes an interconnect, an alignment system for aligning a substrate to the interconnect, a bonding system for bonding the component to the interconnect, and a heating system for heating the component and the interconn... | 03/11/2008 |
| 7337939 | Bonding apparatus A bonding apparatus is constituted by a bonding tool, a substrate stage, a moving mechanism for moving the bonding tool and the substrate stage, an up-and-down mechanism for moving up and down said bonding tool, and a chip recognition camera. The bonding apparatus i... | 03/04/2008 |
| 7300216 | Optical connector adapter for interfacing a beam splitter/combiner to optical waveguides and method of forming the same An optical connector adapter includes a substrate having at least one optical waveguide for transporting optical signals. The substrate includes opposing ends, a top reference surface and side reference surface aligned relative to the at least one optical waveguide.... | 11/27/2007 |
| 7299545 | Alignment method and mounting method using the alignment method Positioning recognition marks are read by movable recognition device for positioning objects to be bonded to each other. An alignment method includes a step of reading the recognition marks during movement of the recognition device before its complete stop, and a st... | 11/27/2007 |
| 7286735 | Multi-axis optical device alignment apparatus An alignment system for aligning optical components is disclosed. The alignment system presents a kinematic, de-coupled alignment solution that facilitates rapid alignment between optical components while preserving a simple design. In one embodiment, the alignment ... | 10/23/2007 |
| 7264994 | Method of fabricating a semiconductor device A package substrate is placed in a first predetermined position on a supporting equipment. A chip guide equipment and a magnetic-field-generating equipment in a second predetermined position are placed near the package substrate. A semiconductor chip having a photoe... | 09/04/2007 |
| 7234874 | Optical connector adapter for connecting optical pump sources to optical waveguides and method of forming same An optical connector adapter includes a substrate having optical waveguides for transporting optical signals. The optical connector adapter is for connecting optical pump sources to the optical waveguides using passive alignment. The substrate has opposing ends, a t... | 06/26/2007 |
| 7199816 | Device and method for picking up image of component, and component mounting apparatus An image pickup camera is arranged, so that a plurality of components are adapted to be sequentially imaged by corresponding image pickup device with a timing whereby light for imaging is prevented from affecting the other image pickup operation while the components... | 04/03/2007 |
| 7191929 | Method of measuring thickness of bonded ball in wire bonding A method of measuring a thickness of a ball bonded to a pad is disclosed. The method includes: taking an image of the pad and the ball at each step position through an image taking means being shifted in a vertical direction at predetermined step intervals; obtainin... | 03/20/2007 |
| 7159754 | Apparatus and method for corrective soldering The invention relates to a method for soldering an object comprising several soldered joints. The method comprises the steps of mechanically soldering of at least some of the soldered joints, visually assessing the soldered joints, and correctively soldering the vis... | 01/09/2007 |
| 7133731 | Component mounting sequence optimizing method, component mounting device, program for executing component mounting sequence optimizing method, and recording medium in which the program is recorded The present invention provides a component mounting sequence optimizing method, a component mounting device, a program for executing the component mounting sequence optimizing method, and recording medium in which the program is recorded, in the component mounting d... | 11/07/2006 |
| 7124928 | Optical component installation and train alignment process utilizing metrology and plastic deformation A micro-optical train manufacturing process includes a step of characterizing the position of optical components on an optical bench, typically using a metrology system. These optical components are then aligned with respect to each other in a passive alignment step... | 10/24/2006 |
| 7108167 | Wire bonder with a device for determining the vectorial distance between the capillary and the image recognition system and method A Wire Bonder comprises a bondhead that can be moved in a horizontal plane that has a capillary clamped to a horn and parts of an image recognition system. The tip of the capillary and the optical axis of the image recognition system are separated by a vectorial dis... | 09/19/2006 |
| 7103956 | Method of fabricating a spherical cavitation chamber A method of fabricating a spherical cavitation chamber. Depending upon the chamber's composition and wall thickness, chambers fabricated with the disclosed techniques can be used with either low or high pressure systems. During chamber fabrication, initially two sph... | 09/12/2006 |
| 7079370 | Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing... | 07/18/2006 |
| 7072742 | Accurate blending module and method An accurate blending module for retrofitting existing laboratory or industrial systems or use as a standalone device and a method of use. The module includes a proportioning submodule that receives and merges at least two liquid feeds. The merged stream flows to a b... | 07/04/2006 |
| 7069102 | System and method to customize bond programs compensating integrated circuit bonder variability A computerized system and method for customizing bond programs in order to compensate first for variabilities in an integrated circuit (IC) “slave” bonder, and second to any irregularities in a “slave” circuit positioned on the slave bonder for attaching con... | 06/27/2006 |
| 7050622 | Image comparison apparatus, image comparison method, and program for causing computer to execute image comparison An image comparison apparatus includes an observation image capturing means for capturing at least one of a macroscopic observation image of a specimen and a microscopic observation image of the specimen, a photographing means for photographing an observation image ... | 05/23/2006 |
| 7044182 | Bonding apparatus with position deviation correction A bonding apparatus that makes correction ΔX=(Xn−Xc) in positioning of bonding tool and substrate where the imaging center of first camera shows deviation +Xc with respect to the imaging center of second camera, and deviation +Xn occurs when bonding tool moves fr... | 05/16/2006 |
| 7044355 | Bonding apparatus and bonding external appearance inspection device A wire bonder 50 in which light rays 66 that leave an object on a carrying stand 60 pass through a light path 80 that passes through a parallel flat plate and reach an imaging camera 70 as light rays 68. The light path 80... | 05/16/2006 |
| 7043835 | Method for centering a workpiece on the cylindrical axis of a bore A method and system for precisely centering a workpiece within a cylindrical bore such that the center of the workpiece is coaxial with the central axis of the bore. An arbor is used within the cylindrical bore to sense and calculate the location of the central axis... | 05/16/2006 |
| 7031509 | Method and apparatus for correcting inclination of IC on semiconductor wafer There are provided a recognition device, a wafer turning member, a turning device, and a control device. A first detection point for recognition and a second detection point for recognition are recognized, on the basis of the result of which a semiconductor wafer is... | 04/18/2006 |
| 7027639 | High speed optical image acquisition system with extended dynamic range A high-speed image acquisition system includes a source of light; a sensor for acquiring a plurality of images of the target; a system for determining relative movement between the source and the target; and an image processor for processing the acquired images to g... | 04/11/2006 |
| 7021520 | Stacked chip connection using stand off stitch bonding The present invention provides a structure, apparatus, and method for wire bonding in which a first wire bond is formed between first and second components, a second wire bond is formed between the second component and a third component such that the second wire bon... | 04/04/2006 |
| 6995504 | Spacers for field emission displays The disclosed method for forming a field emission display includes forming a cathode and an anode, forming a plurality of photoresist posts over the cathode, and coating the posts with a coating material. The coating material forms sidewalls around the posts. The ph... | 02/07/2006 |
| 6983872 | Substrate alignment method and apparatus The invention provides a method and apparatus for aligning a substrate. The apparatus comprises a ball pick head for picking up a plurality of solder balls in a ball pick-up process and depositing them onto the substrate, and a vision system adapted to view and obta... | 01/10/2006 |
| 6972487 | Multi chip package structure having a plurality of semiconductor chips mounted in the same package The present invention relates to a semiconductor device having an MCP (Multi Chip Package) structure in which a plurality of semiconductor chips are mounted in the same package, a manufacturing method therefor and a semiconductor Substrate used therein. Atop a first... | 12/06/2005 |
| 6955284 | Device for positioning a tool in relation to a workpiece The device for positioning a tool (1) in relation to a workpiece (6) controls drives (2, 3, 4) in relation to three spatial axes (x, y, z) through two cameras (10, 11), the first (1) of which takes an image essentially along a spat... | 10/18/2005 |
| 6945446 | Wire bonding method and apparatus A bonding method and apparatus that uses a position detection camera which takes images of a workpiece and a light path conversion device which directs the image of an area near the lower end of a capillary to the position detection camera. The image acquired by the... | 09/20/2005 |
| 6940168 | Enhanced pad design for substrate A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made be... | 09/06/2005 |
| 6918528 | Transducer tool holder A transducer horn for holding a tool, such as a capillary, for a wire bonder has a pair of resilient arms which flex to clamp about a tool placed in a passage between the arms. The arms have free distal ends between which a wedge is inserted to open the passage to a... | 07/19/2005 |
| 6905256 | Optical connector adapter for interfacing single or multichannel waveguide devices to fiber and method of forming same An optical connector adapter advantageously interfaces waveguide devices using passive alignment. The connector adapter includes a substrate for transporting optical signals and having opposing ends and a top reference surface and single side reference surface. A ca... | 06/14/2005 |
| 6876761 | Jig for calibrating component recognition apparatus, component recognition calibrating method using the jig, and component mounting apparatus using the jig A calibration jig for a component recognition device and a component recognition calibration method using the jig which can stabilize the mounting accuracy of a component to a to-be-mounted object and improve amount quality. An opening is formed at a to-be-picked up... | 04/05/2005 |
| 6824037 | Bonding device The present invention solves a problem with a wire bonding device, that during a wire bonding process, a cover at the periphery of a working hole warps upward to cause inadvertent sparking to occur across the cover that has warped upwards and a torch electrode. This... | 11/30/2004 |
| 6820792 | Die bonding equipment Die bonding equipment for fine pitch ball grid array package includes: a semiconductor chip pickup stage for inspecting a status of a loaded semiconductor chip and a corresponding position thereof; an alignment stage on which the semiconductor chip fixed on a mount ... | 11/23/2004 |
| 6762848 | Offset measurement method, tool position detection method and bonding apparatus In measuring the position of a bonding tool accurately in offset correction in a bonding apparatus, the tool is moved to approach a reference member, the tool is illuminated with a reference pattern by a laser diode, and the deviation between the reference member an... | 07/13/2004 |
