Bizarre Patents
A self defense weapon formed as a memo pad and which is easily held by a person's fingers, therefore making it possible to provide protection from a mugger and also to quickly and easily write a record or a message without failure of missing or forgetting significant information under a stressful situation.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8152045 | Jet stack brazing in a diffusion furnace A method for batch brazing jet stacks in a diffusion furnace. The method may include inserting fusible parts into slots of quartz boats and transporting the quartz boats into an interior of a reaction chamber of a diffusion furnace. An operator may seal the interior... | 04/10/2012 |
| 7980447 | Jet stack brazing in a diffusion furnace A method and apparatus for batch brazing jet stacks in a diffusion furnace. The method may include inserting fusible parts into slots of quartz boats and transporting the quartz boats into an interior of a reaction chamber of a diffusion furnace. An operator may sea... | 07/19/2011 |
| 7789286 | Method and apparatus for assessing the quality of spot welds A method and apparatus for evaluating the size and/or quality of a spot weld. The apparatus includes a two-dimensional array of ultrasonic transducers arranged with a delay line for positioning adjacent a surface of a weld. A layer of gel is placed between the delay... | 09/07/2010 |
| 7775415 | Method and apparatus for assessing the quality of spot welds A method and apparatus for evaluating the size and/or quality of a spot weld. The apparatus includes a two-dimensional array of ultrasonic transducers arranged with a delay line for positioning adjacent a surface of a weld. A layer of gel is placed between the delay... | 08/17/2010 |
| 7419085 | Optical processing apparatus The invention presents a optical processing apparatus capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire sol... | 09/02/2008 |
| 7380697 | Welding condition monitoring device A welding condition monitoring device for monitoring the welding state of a welding work portion by taking an image thereof by an image sensor having a wide dynamic range and capable of taking an image covering a very bright welding portion and relatively dark porti... | 06/03/2008 |
| 7370785 | Wire bonding method and apparatus A wire bonding apparatus and method involving a computer 41 that has a height position counter 44 that produces height position signals for a capillary 5 by processing signals from a position sensor 29 that detects the position of the bonding arm 20 in the vertical ... | 05/13/2008 |
| 7367360 | Integrated piping plate, machining method for same, machining apparatus for same, and machining equipment for same A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both sur... | 05/06/2008 |
| 7367104 | Method and device for the production of a trimmed metal strip The invention relates to a method for production of a metal strip from a strip (6), cast directly from molten metal (4), whereby a trimming of the strip edges (9, 9′) of the strip (6) is carried out, characterised in that the strip edge... | 05/06/2008 |
| 7353976 | Wire bonder A Wire Bonder contains a bondhead and a rocker arranged on the bondhead that is rotatable on a horizontal axis. A horn with a flange is attached to the rocker in which a capillary is clamped. At least one sensor is attached to the bondhead that detects vibrations of... | 04/08/2008 |
| 7305884 | In situ monitoring of reactive material using ultrasound The present invention provides a device and method of non-destructively monitoring reactive material through a substrate for changes in material properties that designate the condition of the reactive material during cure and service life. A transducer is placed on ... | 12/11/2007 |
| 7303113 | Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect. ... | 12/04/2007 |
| 7282663 | Forge welding process An automated method for forge welding tubulars including heating the tubular ends to be joined in a welding chamber while the heated tubular ends are maintained aligned and parallel relative to each other and at a small spacing, whereupon the heated tubular ends are... | 10/16/2007 |
| 7245024 | Electronic assembly with reduced leakage current An electronic assembly includes a substrate and at least one surface mounted electronic component. The substrate includes a first side and a second side opposite the first side. The first side of the substrate includes a plurality of conductive traces formed thereon... | 07/17/2007 |
| 7222818 | Shipping spool A spool is provided having opposing identical end flanges coupled to a central barrel. An annular rim portion of the flanges is provided with a plurality of openings positioned at different radial and circumferential positions. The openings are sized such that if th... | 05/29/2007 |
| 7201802 | Apparatus for providing a substrate with viscous medium Solder paste application, inspection and correction. Following or during application of solder paste on a substrate, the result thereof is inspected and any detected errors are registered. Following an evaluation as to whether correction of these errors is required ... | 04/10/2007 |
| 7196294 | Method and resistive bridge circuit for the detection of solder-joint failures in a digital electronic package A solder-joint detection circuit uses a resistive bridge and a differential detector to detect faults in the solder-joint network both inside and outside the digital electronic package during operation. The resistive bridge is preferably coupled to a high supply vol... | 03/27/2007 |
| 7191929 | Method of measuring thickness of bonded ball in wire bonding A method of measuring a thickness of a ball bonded to a pad is disclosed. The method includes: taking an image of the pad and the ball at each step position through an image taking means being shifted in a vertical direction at predetermined step intervals; obtainin... | 03/20/2007 |
| 7159753 | Wire body based welding representation A computing environment is provided with the ability to at least contribute to generate a representation for a weld bead to be used to weld a number of components of an article of manufacture together at one or more edges of the components in the manufacturing of th... | 01/09/2007 |
| 7158233 | Alignment mark, alignment apparatus and method, exposure apparatus, and device manufacturing method An alignment mark includes a first mark usable for global alignment measurement in the direction of a scribe line, and a second mark usable for pre-alignment measurement in a direction perpendicular to the direction of the scribe line. The first mark is formed by ar... | 01/02/2007 |
| 7134591 | Method of and apparatus for testing a wire bond connection A method and apparatus for the nondestructive testing of a bond connection between a bond wire and a substrate or pad which utilizes an ultrasonic tool for bonding the bond wire to the substrate or pad. The test force is applied in the plane of the bond connection t... | 11/14/2006 |
| 7047615 | Forming gas turbine transition duct bodies without longitudinal welds A method of making combustion turbine transition duct bodies without longitudinal welds by hydroforming two duct bodies back to back with bellows thrusters secured to the duct body open ends. This enables the manufacturing of duct bodies with detailed features and h... | 05/23/2006 |
| 7028717 | Water stop for a loop installation in a pre-insulated pipeline A high temperature pre-insulated piping system is shown which has a special water stop located along the length of the piping. The water stop has an internal disk which forms a pair of isolated chambers within the water stop. The internal disk is formed of a materia... | 04/18/2006 |
| 7025243 | Bondhead for wire bonding apparatus A bondhead is provided that comprises a bondhead body for holding a bonding tool, such as an ultrasonic transducer, and a bondhead actuator coupled to the bondhead body for moving the bonding tool with respect to a bonding surface. A wire clamping device, which may ... | 04/11/2006 |
| 7017792 | Integrated piping plate, machining method for same, machining apparatus for same, and machining equipment for same A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both sur... | 03/28/2006 |
| 7009695 | Full frame thermal pump probe technique for detecting subsurface defects An area of a substrate is imaged with and without heating, to obtain a hot image and a cold image respectively. The hot and cold images are compared with one another to identify one or more locations as being defective, e.g. if the result of comparison at one locati... | 03/07/2006 |
| 7004370 | Device and method for determining parameters of a welding system The invention relates to a device and method for determining parameters of a welding system. According to the invention, a welding area (18, 21, 22) is subjected to the action of ultrasonic waves, preferably to the action of shear waves, by using an ultrasoun... | 02/28/2006 |
| 7004372 | Method for determining optimum bond parameters when bonding with a wire bonder A predetermined number of bond cycles is carried out in order to find optimum bond parameters for a wire bonder. The bond parameters to be optimized are each varied within a predefined range. With each bond cycle, after attachment of the wire to the connection point... | 02/28/2006 |
| 7006225 | Alignment mark, alignment apparatus and method, exposure apparatus, and device manufacturing method An alignment mark includes a first mark usable for global alignment measurement in the direction of a scribe line, and a second mark usable for pre-alignment measurement in a direction perpendicular to the direction of the scribe line. The first mark is formed by ar... | 02/28/2006 |
| 6978807 | Water stop for a line installation in a pre-insulated pipeline A high temperature pre-insulated piping system is shown which has a special water stop located along the length of the piping. The water stop has an internal disk which forms a pair of isolated regions within the water stop. The internal disk is formed of a material... | 12/27/2005 |
| 6962281 | Bonding apparatus and bonding method having process for judging bonding state In a bonding apparatus having an ultrasonic horn 3 coupled to an ultrasonic vibrator 5 and a bonding tool 4 coupled to the ultrasonic horn 3, and applying ultrasonic bonding to a work 11, by providing an ultrasonic detector 7 | 11/08/2005 |
| 6948369 | Methods for ultrasonic inspection of spot and seam resistance welds in metallic sheets and a spot weld examination probe system (SWEPS) An external focused ultrasonic beam, non-destructive, open-air, inspection method of sheet metal spot and seam weldments using a probe in combination with motion measurement of the probe over the weldments during inspection without immersion of the material. Reflect... | 09/27/2005 |
| 6940168 | Enhanced pad design for substrate A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made be... | 09/06/2005 |
| 6935552 | High-precision method and apparatus for evaluating creep damage A high-precision method for evaluating creep damage of high tension heat resistant steel used in high temperature exposed apparatuses involves comparing particle size behavior varying with creep damage progress of crystal grains having a crystal orientation differen... | 08/30/2005 |
| 6935548 | Dissipative ceramic bonding tool tip Methods for making and using dissipative ceramic bonding tool tips for wire bonding electrical connections to bonding pads on integrated circuit chips and packages. The method of using the dissipative ceramic bonding tool tip includes dissipating charge while bondin... | 08/30/2005 |
| 6913842 | Liquid phase diffusion welded metal-made precision machine component and production method thereof A precision machine part is made of a plurality of pieces with a transient liquid phase diffusion bonding alloy provided between the pieces to bond them together. The precision machine part has one or more conveyance passages formed in it, has a longitudinal axis an... | 07/05/2005 |
| 6912906 | Method and apparatus for the production and quality testing of a bonded wire connection Method of producing a bonded wire connection between an electronic component or a subassembly and a carrier by introducing energy from an ultrasound transducer into a wire that is to be bonded. According to this method, during the introduction of energy the impedanc... | 07/05/2005 |
| 6905058 | Bonding tool and wire bonder Bonding tool for ultrasonic wire bonding, with a knife (3) that is inserted into or closely apposed to the bonding tool so as to be longitudinally movable with respect thereto, in order to cut a projecting part of a bonded wire immediately behind a bonded con... | 06/14/2005 |
| 6902101 | Bump bonding method apparatus In a bump bonding technique for forming a bump on an IC, including forming a ball at the tip of a gold wire protruding from a capillary, and providing a metal-to-metal joint by applying ultrasonic vibration from a ultrasonic head through the capillary while pressing... | 06/07/2005 |
| 6896171 | EMAT weld inspection A method for inspecting welds between welded tubular ends includes arranging a series electromagnetic acoustic transducer (EMAT) assemblies in circumferential direction adjacent to an inner and/or outer surface of at least one of the welded tubular ends and inducing... | 05/24/2005 |
