Quotables
"Flight by machines heavier than air is unpractical and insignificant, if not utterly impossible."
Simon Newcomb, astronomer ; Said in 1902, less than two years before the first flight at Kitty Hawk
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7182240 | Solder coated lid A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a Sn—Sb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a pac... | 02/27/2007 |
| 4833276 | Shield structure of electronic equipment In a shield structure of an electronic equipment including a printed circuit board on which electronic parts are mounted, a box having an upper opening for receiving the printed circuit board, and a shielding planar cover for shieldably covering the upper... | 05/23/1989 |
| 4771151 | Self-heating lid for soldering to a box A lid to be bonded to provide a hermetic seal has bonded thereto a thermally autoregulating heater for activating a heat activated sealing and bonding material to produce the desired seal between the lid and box wherein the temperature is regulated to pro... | 09/13/1988 |
| 4640436 | Hermetic sealing cover and a method of producing the same A hermetic sealing cover assembly for a semiconductor device, etc. has a seal ring and a metallic cover joined thereto. The seal ring has a thin layer of gold, silver, platinum or palladium. The cover has a film of a material of high solderability, such a... | 02/03/1987 |
| 4640438 | Cover for semiconductor device packages Covers for semiconductor packages are made by diffusion pressure bonding a coated substrate to a preform at a temperature below the melting point of the preform alloy. An alloy preform is coated on one side with a thin layer of the preform alloy component... | 02/03/1987 |
| 4436220 | Hermetic package using membrane seal An improved solderable hermetically sealed container and method for sealing same is provided which comprises in a preferred embodiment, a hollow container having a solderable peripheral surface defining the opening to the container, a thin, solderable met... | 03/13/1984 |
| 4331258 | Sealing cover for an hermetically sealed container A sealing cover for an hermetically sealed container comprises an environmentally resistant metal lid, an intermediate plated metallic "picture frame", and a solder deposit metallurgically bonded to that "frame". Such a cover is particularly adapted for t... | 05/25/1982 |
| 4192433 | Hermetic sealing cover for a container for semiconductor devices A cover unit for hermetically sealing a container for a semiconductor device comprises a metallic cover element, a preformed ring of substantially chemically unreacted thermosetting plastic and a preformed ring of an alloy consisting of about 63% tin and ... | 03/11/1980 |
| 4190176 | Sealing cover unit for a container for a semiconductor device A cover unit for hermetically sealing a container for a semiconductor device comprises a rectangular metallic cover element such as a cobalt-nickel-iron alloy and a plurality of contiguous turns of wire of a heat-fusible material such as a gold-tin eutect... | 02/26/1980 |
