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| Number | Title | Issue Date |
| 7977598 | Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing... | 07/12/2011 |
| 7434719 | Addition of Dto Hto detect and calibrate atomic hydrogen formed by dissociative electron attachment A method of detecting and calibrating dry fluxing metal surfaces of one or more components to be soldered by electron attachment using a gas mixture of reducing gas comprising hydrogen and deuterium, comprising the steps of: a) providing one or more components to be... | 10/14/2008 |
| 7423232 | Method for resistance welding/brazing a tube to a member A method for welding/brazing a tube to a member. The tube has an axially-extending first portion and has a tube form which extends transversely from the first portion. A filler material is obtained. The tube, the member and the filler material are positioned such th... | 09/09/2008 |
| 7316064 | Induction reflow apparatus and method of using the same A method for manufacturing an electrical contact includes providing a series of electrical contacts joined on a carrier strip to a plating station followed by an induction heating station. At the plating station, plating the electrical contacts with a conductive all... | 01/08/2008 |
| 7274095 | Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as ... | 09/25/2007 |
| 7218502 | Bonding member and electrostatic chuck A bonding member is provided, including, a ceramic member having a concave portion, a metal member having a convex portion corresponding to the concave portion of the ceramic member. A first bonding material joins a bottom portion of the concave portion of the ceram... | 05/15/2007 |
| 7120353 | Infrared sauna A portable compact sauna wherein a user's body is warmed to sweating primarily by direct absorption of infrared radiation. Broad infrared radiation emitters or sources are placed around the inside of a narrow cabinet so as to be in close proximity to various parts o... | 10/10/2006 |
| 6998560 | Method for metallurgically joining a tube to a member A method for metallurgically joining a tube to a member. A tube having a flange is obtained, and a member is obtained. A welding/brazing electrode wheel is obtained having an axis of rotation and having a rim. The tube and the member are positioned with the flange c... | 02/14/2006 |
| 6967307 | Method and process of contact to a heat softened solder ball array A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting “softening” temperature, whereby the compression force required to connect all balls in a BGA is achieved at muc... | 11/22/2005 |
| 6776330 | Hydrogen fluxless soldering by electron attachment A method of dry fluxing metal surfaces of one or more components to be soldered, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the t... | 08/17/2004 |
| 6723943 | Manufacturing metallic strip for packaging having a coating made up of a metallic layer and a polymer film, and the strip obtained Process for manufacturing metallic strip for packaging comprising strip steel covered on at least one of its faces with a coating containing a sub-layer of tin and an external film of polymer, according to which: on one hand, a layer of tin is deposited on at... | 04/20/2004 |
| 6674042 | Method and device for forming porous metal parts by sintering A process for forming metal components of controlled porosity by welding, in which a predetermined amount of metal elements (50) of oblong shape is introduced into a mold (10) in which it is distributed isotropically. The metal elements are then subjected... | 01/06/2004 |
| 6614003 | Method and process of contact to a heat softened solder ball array A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting "softening" temperature, whereby the compression force required to connect all balls in a BGA is achieved... | 09/02/2003 |
| 6552293 | Metallic members joining method and reflow soldering method In each odd-numbered unit current-supplying period of a plurality of unit current-supplying periods making up a set current-supplying time, a control unit subjects only positive switching elements to continuous switching operations at an inverter frequenc... | 04/22/2003 |
| 6544623 | Honeycomb cell structure and method of manufacture A honeycomb cell structure has a plurality of first strips each formed into a generally zig-zag configuration and placed side by side to form a plurality of rows of cells in a generally honeycomb configuration with nodes between adjacent cells in each row... | 04/08/2003 |
| 6459064 | Assembling electroconductive parts by electric current heating The invention concerns a method for assembling electroconductive pass by electric current heating. Said method is characterised in that it consists in moving forward electrodes (10, 20) with different polanties, towards the parts (30, 40) to be assembled,... | 10/01/2002 |
| 6420681 | Method and process of contact to a heat softened solder ball array A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting "softening" temperature, whereby the compression force required to connect all balls in a BGA is achieved... | 07/16/2002 |
| 6329637 | Method and process of contract to a heat softened solder ball array A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting "softening" temperature, whereby the compression force required to connect all balls in a BGA is achieved... | 12/11/2001 |
| 6294750 | Method and apparatus for automatically adjusting air pressure in a pneumatic weld head A pressure regulator system for a pneumatically- or hydraulically-actuated weld head. The weld head includes a switching valve comprising several ports: an inflow port attached to a source of pressurized gas, preferably air; an exhaust port; a first line ... | 09/25/2001 |
| 6239400 | Method and device for connecting two millimeter elements A process and a device for bonding two millimeter elements. The process makes, at determined locations of each of the two millimeter elements, bonding zones set to the potential of a second plane. Then, the process makes the bond by determined connections... | 05/29/2001 |
| 6159545 | Method for applying a fluid material in joint regions around an airfoil Material in fluid form is applied to a region where a joint is to be formed between an airfoil and an adjacent structure by simultaneously directing streams of the material into the joint region on the suction side of the airfoil and into the joint region... | 12/12/2000 |
| 6147326 | Soldering device with a plurality of spaced soldering tips and method of use A soldering device includes an elongated hot bar and a plurality of spaced soldering tips supported along the hot bar for soldering multiple connections. A method of using the soldering device is also described.... | 11/14/2000 |
| 6121576 | Method and process of contact to a heat softened solder ball array A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting "softening" temperature, whereby the compression force required to connect all balls in a BGA is achieved... | 09/19/2000 |
| 5957365 | Brazing rod for depositing diamond coating to metal substrate using gas or electric brazing techniques A brazing rod for use in depositing an abrasive metal coating on a metal substrate. The brazing rod comprises particulate abrasive material selected from the group consisting of diamond particles and mixtures of diamond particles and carbide particles and... | 09/28/1999 |
| 5908568 | Method and device for contacting the winding wire of a coil A connecting pin of a coil, which has an end section with an end section of a winding wire wound thereon with a plurality of turns, is initially provided with a drop of a fluxless soft solder and then arranged in the vicinity of the points of two opposite... | 06/01/1999 |
| 5902495 | Method and apparatus for establishing a solder bond to a solder ball grid array Apparatus and method for establishing a solder bond between a solder ball grid array and a circuit mounted on a substrate includes a bonding tool having a bonding tip for applying heat to the site of one or more of the solder balls in the solder ball grid... | 05/11/1999 |
| 5884651 | Valve and associated soldering method A valve, which has heat-sensitive parts, has at least one connecting tube to which a pipe is arranged to be soldered using local heating. The connecting tube consists of a material of such low thermal conductivity that the heat-sensitive parts remain belo... | 03/23/1999 |
| 5831247 | Apparatus and method for producing an electronic component provided with bumps The invention provides an apparatus and a method for producing an electronic component provided with bumps, in which the operation of placing a solder ball serving as a material of a bump onto an electrode of a work is monitored, and if a solder ball plac... | 11/03/1998 |
| 5793010 | Electromagnetic field enhanced brazing method A brazing process is enhanced by the employment of an external electromagnetic field. In complex joints of large components, gravity and surface tension forces acting on the molten braze alloy are insufficient for completely filling the interfacial gap. A... | 08/11/1998 |
| 5760371 | Water-cooled stator coil header repair process A process is disclosed for repairing leaks in turbine generators that have water cooled stator coils with hollow conductor strands. Such generators have a tendency to leak where the stator coil joins a header. Once a leak is detected the repair is accompl... | 06/02/1998 |
| 5742021 | High thermal conductivity substrate and the method of brazing a cap thereto Temperature gradients between a ceramic substrate of high thermal conductivity and the braze materials used to attach a metallic device such as a cap are reduced by using an embedded internal heat source in the substrate to minimize the thermal gradient, ... | 04/21/1998 |
| 5695667 | Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component A pickup head 11 has a lower surface with absorbing holes 9 for picking up a plurality of soldering balls 1 from a soldering ball reservoir 15 by suction force of vacuum. Pickup head 11 mounts these soldering balls 1 on electrodes 5 formed on substrate 4 ... | 12/09/1997 |
| 5694411 | Ultraviolet range laser and method for manufacturing the same An ultraviolet range laser comprising a vacuum vessel having an open end portion hermetically sealed with an output mirror glass substrate, which is featured in that the output mirror glass substrate is formed of a glass material which is capable of allow... | 12/02/1997 |
| 5674412 | Butt splicer for copper based tapes Apparatus and method for butt-splicing hard-rolled and.backslash.or wide copper and copper alloy tapes employs a rolling electrode and varies the contact angle of the tape ends during soldering.... | 10/07/1997 |
| 5670063 | Method for making an interface connection through an insulating part This interface connection through a hole (2) in a high-temperature-resistant and vacuum-proof insulating part (1), particularly of ceramic, glass, or a single crystal, consists of a metallic lead (4, 17) inserted into the hole (2) and having a coefficient... | 09/23/1997 |
| 5651495 | Thermoelectric cooler assisted soldering An improved method for soldering a thermoelectric cooler between an electronic device and a heatsink. Thermoelectric coolers are assembled by soldering parts together using a first solder. The bottom surface of the thermoelectric cooler is first soldered ... | 07/29/1997 |
| 5506383 | Wafer scale multi-chip module A wafer scale multi-chip semiconductor module used to interconnect and house a plurality of integrated circuit chips. The wafer scale multi-chip semiconductor module has an interconnect network extending between the integrated circuit chips along the subs... | 04/09/1996 |
| 5484974 | Making electric-resistance-soldered multilayer tubing Tubing is made by advancing a flat metal strip in a travel direction along a path through a forming station and then through a soldering station and then through a cooling station. The strip is shaped in the forming station into a multilayer tubular shape... | 01/16/1996 |
| 5485392 | Manual soldering process monitoring system A system for monitoring the soldering process which comprises a soldering ans including a means for monitoring analog heat flow, a means, connected to said soldering means, for converting analog heat flow readings into a digital temperature data points, a... | 01/16/1996 |
| 5345056 | Plasma based soldering by indirect heating A method of soldering without the use of flux, wherein a plurality of solder bumps are deposited on a first surface and a plurality of solder pad locations are prepared on a second surface. The first and second surfaces are placed immediately adjacent to ... | 09/06/1994 |
