Bizarre Patents
Behavior Modification Wristwatch
A wristwatch including a watch band and a watch body having an octagon shaped perimeter and being red in color and having the word STOP thereon to resemble a stop sign.
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| Number | Title | Issue Date |
| 7334316 | Method of sealing a generator stator bar and a stator bar end fitting A method of sealing a generator stator bar and a stator bar end fitting receiving the end including the steps of: brazing the fitting to the end of the stator bar with a braze material; applying a metallic barrier coating material to the end of the stator bar in the... | 02/26/2008 |
| 7322507 | Transducer assembly, capillary and wire bonding method using the same A transducer assembly and wire bonding method has a vibration unit for generating an ultrasonic wave. A body section is coupled to the vibration unit for transferring the ultrasonic wave. A tapered horn is coupled to the body section for transferring and concentrati... | 01/29/2008 |
| 7270258 | Method of fabrication of semiconductor integrated circuit device Productivity is to be improved in assembling a semiconductor integrated circuit device. A matrix substrate is provided and semiconductor chips are disposed on a first heating stage, and then the matrix substrate is disposed above the semiconductor chips on the first... | 09/18/2007 |
| 7207837 | Connector and a mounting method therefor A circuit board connector (1) has a housing (10), male terminals (20) and fixing members (30). Each fixing member (30) is formed by bending a metal plate into an L-shape to define a mounting portion (31) to mount the fixing ... | 04/24/2007 |
| 7075028 | Sub-micron adjustable mount for supporting a component and method Attaching an attachment surface of an electrically conductive workpiece to an electrically conductive support surface is described. In one aspect, a biasing force is distributed at least partially around a weld region of the workpiece to urge the attachment surface ... | 07/11/2006 |
| 6974615 | Binding member for coaxial cable and an electric connector for coaxial cable both using resin solder, and a method of connecting the binding member to coaxial cable or the electric connector To easily connect a coaxial cable to electric connecting devices or a printed circuit board, to prevent the conductors of the cable from being disturbed, to secure the shielding performance of the signal line, and to enable connection of a very fine wire by means of... | 12/13/2005 |
| 6824037 | Bonding device The present invention solves a problem with a wire bonding device, that during a wire bonding process, a cover at the periphery of a working hole warps upward to cause inadvertent sparking to occur across the cover that has warped upwards and a torch electrode. This... | 11/30/2004 |
| 6715666 | Wire bonding method, method of forming bump and bump A wire bonding method, a bump forming method and a bump which are capable of preventing contact of a wire with a substrate or a conductive lead after the wire is bonded to a bump, and which are capable of preventing generation of bending in the wire during bonding o... | 04/06/2004 |
| 6320155 | Plasma enhanced wire bonder A method and apparatus for simultaneously cleaning and bonding a wire to a bonding surface is presented. In accordance with the invention, a gas is energized to form a plasma, which is then directed in a directional pressurized flow at the wire and bondin... | 11/20/2001 |
| 6237833 | Method of checking wirebond condition A method of checking a wirebond condition is provided, wherein the wirebond condition results from the bonding of a conductive wire to an object such as a semiconductor chip and a lead. The wire is guided by a bonding tool. According to the checking metho... | 05/29/2001 |
| 6239400 | Method and device for connecting two millimeter elements A process and a device for bonding two millimeter elements. The process makes, at determined locations of each of the two millimeter elements, bonding zones set to the potential of a second plane. Then, the process makes the bond by determined connections... | 05/29/2001 |
| 6182882 | Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe A method of bonding wire between at least one pair of bond locations in a semiconductor device and the bonder. A conveyor is provided having a conveying surface for conveying in a predetermined direction a partially fabricated semiconductor device having ... | 02/06/2001 |
| 6131792 | Balancing of x and y axis bonding by 45 degree capillary positioning A method of bonding wire and the bonder which includes providing a wire bonder for bonding wire to a bonding location. The wire bonder has a first bonding head designed to form a stitch bond while travelling in a first predetermined direction, the first b... | 10/17/2000 |
| 6129255 | Wire bonding apparatus A bonding apparatus comprising a capillary through which a wire passes, a torch electrode that makes a substantially horizontal pivotal movement so as to be brought under the capillary, and a rotary motor that drives the torch electrode, thus allowing the... | 10/10/2000 |
| 6100511 | Method of bonding insulating wire and device for carrying out this method A method and device for electrically connecting enameled wire ends with contact surfaces. The enameled wire is stripped and pressed against the contact surface. The wire is charged with at least one of an electromagnetic and an acoustical energy. The enam... | 08/08/2000 |
| 6042932 | Braided buss bar with selectively clad solder pad attachments A flexible buss bar adapted for electrical connection with circuitry carried by a glass pane is provided, as well as a method of attaching a flexible buss bar to a glass pane. The flexible buss bar includes a flexible conductor having at least one metalli... | 03/28/2000 |
| 5975403 | Feeder of wire solder A movement detector of the feeder of wire solder directly touches the wire solder, and the movement detector includes (a) a rotating body which revolves when the wire solder moves along a feeding direction and (b) a rotation detector which produces a rota... | 11/02/1999 |
| 5908568 | Method and device for contacting the winding wire of a coil A connecting pin of a coil, which has an end section with an end section of a winding wire wound thereon with a plurality of turns, is initially provided with a drop of a fluxless soft solder and then arranged in the vicinity of the points of two opposite... | 06/01/1999 |
| 5831247 | Apparatus and method for producing an electronic component provided with bumps The invention provides an apparatus and a method for producing an electronic component provided with bumps, in which the operation of placing a solder ball serving as a material of a bump onto an electrode of a work is monitored, and if a solder ball plac... | 11/03/1998 |
| 5760371 | Water-cooled stator coil header repair process A process is disclosed for repairing leaks in turbine generators that have water cooled stator coils with hollow conductor strands. Such generators have a tendency to leak where the stator coil joins a header. Once a leak is detected the repair is accompl... | 06/02/1998 |
| 5700987 | Alignment and bonding techniques A method for aligning and soldering a first device (11) to a substrate (16) comprises the steps of providing a plurality of solder elements (17) between the first device and the substrate, aligning the first device, and then reflowing and cooling the sold... | 12/23/1997 |
| 5421752 | Method of making a pin grid array and terminal for use therein A grid array 10 of terminals 20 secured with a fusible electrically conductive material 34 usable in conjunction with a source of constant amplitude high frequency alternating current of known frequency is formed by the steps of: selecting a plurality of ... | 06/06/1995 |
| 5391082 | Conductive wedges for interdigitating with adjacent legs of an IC or the like A probe for making electrical connections to the legs of an already mounted integrated circuit carries rows of tapered wedges. The wedges within a row are spaced apart by an amount that corresponds to the width of the IC's legs. For n-many legs on a side ... | 02/21/1995 |
| 5387139 | Method of making a pin grid array and terminal for use therein A grid array 10 of terminals 20 secured with a fusible electrically conductive material 34 usable in conjunction with a source of constant amplitude high frequency alternating current of known frequency is formed by the steps of: selecting a plurality of ... | 02/07/1995 |
| 5359170 | Apparatus for bonding external leads of an integrated circuit A hot bar apparatus for effecting solder bonds for high density electronic components has a diamond or diamond-like (i.e. a generally diamond crystal lattice with graphite impurities) surface that makes contact with the leads of the electronic component a... | 10/25/1994 |
| 5357074 | Electrical interconnection device A device 10 usable in conjunction with a source of constant amplitude high frequency alternating current of known frequency for providing sufficient thermal energy to melt a fusible electrically conductive material 32 includes an integral member formed fr... | 10/18/1994 |
| 5336118 | Method of making a pin grid array and terminal for use therein A grid array 10 of terminals 20 secured with a fusible electrically conductive material 34 usable in conjunction with a source of constant amplitude high frequency alternating current of known frequency is formed by the steps of: selecting a plurality of ... | 08/09/1994 |
| 5290984 | Device for positioning cable and connector during soldering A device for positioning a cable end and an associated connector during inductive heat soldering of the connector to the cable includes a housing having a pair of terminals connectable to a source of radio frequency (RF) current. A connector positioning s... | 03/01/1994 |
| 5286945 | Apparatus for heating workpieces to bond the same An apparatus according to the present invention comprises a fixed electrode rod and a movable electrode unit movable toward and away from the fixed electrode rod. The movable electrode unit includes a first electrode rod for holding a set of workpieces wi... | 02/15/1994 |
| 5279028 | Method of making a pin grid array and terminal for use therein A grid array 10 of terminals 20 secured with a fusible electrically conductive material 34 usable in conjunction with a source of constant amplitude high frequency alternating current of known frequency is formed by the steps of: selecting a plurality of ... | 01/18/1994 |
| 5271147 | Outer bonding tool for tape carrier and method of producing semiconductor device An outer bonding tool is used for bonding outer leads of a tape carrier on corresponding pads which are formed on a circuit substrate by solder after bonding inner leads of the tape carrier and electrodes of a generally rectangular semiconductor chip. The... | 12/21/1993 |
| 5240166 | Device for thermally enhanced ultrasonic bonding with localized heat pulses A single point bonding tool for use in ultrasonically bonding a fine or ultrafine wire to another electrical conductor, has a thin film resistor integrally formed thereon. The thin film resistor is integrally formed on the bonding tip by standard photolit... | 08/31/1993 |
| 5241156 | Hand-held heating device for electrical component installation/removal and improved tips for use therewith A component installation/removal tweezer-type handpiece having two arms and a tinnable or nontinnable tip including a pair of legs respectively removably mounted with respect to the arms and a plurality of serially connected bands attached to the first an... | 08/31/1993 |
| 5201450 | Heat block of wire bonding machine A heat block of a wire bonding machine including an inner lead heating part for bonding each one end of wires to each inner lead of a lead frame, a chip heating part for bonding the other ends of the wires to a semiconductor chip, and a differentially hea... | 04/13/1993 |
| 5192843 | Pin attachment tool and method of capacitive brazing A method is provided to replace a damaged pin in a module for an integrated circuit assembly without damaging the circuit device or chip mounted in a circuitized substrate. This method comprises brazing a new pin to the base of the old pin by capacitive d... | 03/09/1993 |
| 5175409 | Self-soldering flexible circuit connector A flexible circuit which may be a strap or a board or the like has a plurality of conductors exposed on one surface in a predetermined array and a heater disposed on the opposed surface so as to heat the exposed conductors. The exposed conductors may have... | 12/29/1992 |
| 5130509 | Apparatus for reflow soldering A solder reflow apparatus for securing a plurality of aligned juxtaposed electronic components of various kinds to a solder-clad metal strip, wherein the substrate of the clad metal strip defines a conductive medium which is electrically heated to a prope... | 07/14/1992 |
| 5109147 | Soldering tip for magnetic wire hookup A small solder tip, which advantageously allows for the rapid production of reliable solder joints without the addition of extra solder, flux or striping the insulation on the wire. The solder tip is preferably formed of tungsten carbide and is used in co... | 04/28/1992 |
| 5103071 | Surface mount technology breakaway self regulating temperature heater Soldering of surface mount connector terminals to contact pads on a circuit board is facilitated by configuring the terminals and their solder tails as spaced integrally-formed projections of a selectively actuable heater. Thermal energy developed in the ... | 04/07/1992 |
| 5094381 | System for automated mounting of electronic components to circuit boards The apparatus of the present invention may be utilized for the automated bonding of electronic components to a circuit board. A placement and bonding head is attached to a manipulatable robotic arm and is utilized to select an electronic component having ... | 03/10/1992 |
