Bizarre Patents
Wearable Device For Feeding and Observing Birds and Other Flying Animals
A device for feeding and observing flying animals comprising a hat, a support mounted on the hat and extending outward from the hat, and a feeder mounted on the support.
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| Number | Title | Issue Date |
| 7282997 | Thermal coupling device A micro-electronic power amplifier that defines a uniform thermal impedance includes an output stage including a single transistor array including a plurality of emitter leads and a single thermal coupling device that thermally couples together each of the emitter l... | 10/16/2007 |
| 7256364 | Method for simultaneous resistance brazing of adjacent conductor joints A method for simultaneously brazing adjacent conductor joints comprises the steps of arranging at least two pair of conductor joints in a row placing a brazing compound between the pairs of joints desired to be electrically connected placing a conductive spacer betw... | 08/14/2007 |
| 7189274 | Exhaust gas filter with at least one filter layer and method for producing a filter layer An exhaust gas filter for cleaning an exhaust gas of an internal combustion engine includes at least one strip-shaped filter layer made of a material through which a fluid can at least partly flow. The filter layer has a length in a longitudinal direction and a widt... | 03/13/2007 |
| 7157658 | Method and apparatus for fabricating dry cell batteries A method and apparatus is disclosed for fabricating a dry cell storage battery from a plurality of dry cells by soldering a battery strap to terminals of adjacent dry cells in a battery pack. A resistance heat solder apparatus is provided for soldering a joint defin... | 01/02/2007 |
| 7145113 | Heating device A heating device is constructed such that a heating member made of nickel-chromium or a high melting point metal is held in an electrically insulating member made of an oxide or nitride, and a solder connecting layer consisting of a nickel layer serving as buffer la... | 12/05/2006 |
| 7127792 | Method of manufacturing spring assembly A method of manufacturing a spring assembly, which includes two annular plates and compression coil springs, and which is adapted so that the compression coil springs are assembled to the annular plates by caulking projection portions formed on the two annular plate... | 10/31/2006 |
| 6781084 | Apparatus and method for brazing The present invention is directed to an apparatus and a method for brazing work pieces together and which eliminates the disadvantages associated with conventional apparatus currently in use for brazing parts together. In a preferred embodiment of the invention, the... | 08/24/2004 |
| 6599372 | Soldering flux A soldering flux includes a resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board. The resin can be non-ac... | 07/29/2003 |
| 6459064 | Assembling electroconductive parts by electric current heating The invention concerns a method for assembling electroconductive pass by electric current heating. Said method is characterised in that it consists in moving forward electrodes (10, 20) with different polanties, towards the parts (30, 40) to be assembled,... | 10/01/2002 |
| 6433296 | Method of forming a frame joint structure A seat frame assembly of a motorcycle has upper and lower pipes made of an aluminum alloy and having a rectangular cross-sectional shape. The upper and lower pipes have front ends constructed as joints, and solid spacers made of an aluminum alloy and havi... | 08/13/2002 |
| 6091044 | System for monitoring and controlling a welding/brazing operation A system for monitoring and controlling a welding/brazing operation on a workpiece having two spaced apart materials with a brazing material disposed therebetween. The system includes a welding apparatus having two spaced apart electrodes. A current is ap... | 07/18/2000 |
| 6078020 | Apparatus and method for manufacturing semiconductor device In semiconductor device manufacturing apparatus and method, in a joining process of a semiconductor pellet (2) and a package (1), the semiconductor pellet (2) is kept to a temperature equilibrium state under an actual use temperature condition while a low... | 06/20/2000 |
| 5753885 | Powder materials for use in resistance welding aluminum articles and method of resistance welding aluminum articles A powder material for use in resistance welding articles of aluminum comprises a mixture of 10-50% by weight of a liquid resin and the remaining proportion of a magnesium powder or a blend of magnesium and aluminum powders. Also a method of resistance wel... | 05/19/1998 |
| 5674412 | Butt splicer for copper based tapes Apparatus and method for butt-splicing hard-rolled and.backslash.or wide copper and copper alloy tapes employs a rolling electrode and varies the contact angle of the tape ends during soldering.... | 10/07/1997 |
| 5565117 | Method of resistance-welding workpieces of metal and resistance-welded weldment of metal Workpieces of aluminum alloy are resistance-welded while a powdery mixture of magnesium and a metal oxide is being interposed between regions of workpieces of aluminum alloy which are to be joined to each other. The metal oxide may comprise at least one m... | 10/15/1996 |
| 5560841 | Stator vane extraction A method in which the interface at which two components are bonded together, by a bonding material that has a lower melting temperature than the material from which the components are made, is heated to the melting temperature of the bonding material, all... | 10/01/1996 |
| 5382769 | Resistance brazed joints for carbon/carbon structures Carbon/carbon materials are joined together by the placement of a brazing alloy between the materials to be joined applying a clamping pressure and passing an electric current through the parts and brazing alloy until the brazing.multidot.k15H alloy melts... | 01/17/1995 |
| 5330097 | Hot diffusion welding method A hot diffusion welding method wherein a first part generally made from a material different from a second part and the second part made from copper alloy are united with an insert material interposed between the joint faces thereof under a heated and pre... | 07/19/1994 |
| 5192843 | Pin attachment tool and method of capacitive brazing A method is provided to replace a damaged pin in a module for an integrated circuit assembly without damaging the circuit device or chip mounted in a circuitized substrate. This method comprises brazing a new pin to the base of the old pin by capacitive d... | 03/09/1993 |
| 5126527 | High temperature solder device for flat cables A High Temperature Solder Device for Flat Cables includes a microwelder, an anvil which acts as a heat sink and supports a flexible flat ribbon cable that is to be connected to a multiple pin connector. The microwelder is made from a modified commercially... | 06/30/1992 |
| 5042571 | Variable perimeter heater A variable parameter heater for applying heat in a predetermined profile to a work surface. The heater has a plurality of elongated members which are interconnected to form a frame. Elongated members are slidingly adjustable to provide the intended heat p... | 08/27/1991 |
| 4933530 | Method for repairing a refrigeration sealed system A method and apparatus for bonding two tubes in a refrigeration sealed system by soldering. The apparatus includes a pair of jaws which are spring biased in the closed position and a pair of handles for opening the jaws against the spring bias force. The ... | 06/12/1990 |
| 4928870 | Process for joining ceramic parts with a reactive conducting material A thin metal foil or an array of fine wires or a graphite web, mat or the ke, having electrical conductivity was interposed between clean polished surfaces of ceramic parts which are to be joined, with application of pressure. A high current electrical di... | 05/29/1990 |
| 4645116 | Fluxless bonding of microelectronic chips Indium is used to bond semiconductor lasers to their heat-sinks without the presence of a corrosive liquid flux. Fluxless bonding is achieved in a vacuum chamber in reducing ambients of CO or H2. Low strain bonds are achieved at bonding tempera... | 02/24/1987 |
| 4602733 | Desoldering apparatus and method Apparatus for the selective removal of the solder and a connector soldered in the through hole of a circuit panel including means for heating the solder and a pair of aligned tubes placed against opposite surfaces of the panel surrounding the connecting t... | 07/29/1986 |
| 4582975 | Circuit chip Disclosed is a method for removing a hybrid or integrated circuit chip soldered to a support structure. An electrical energy source is applied to the hybrid circuit chip for raising the temperature of the circuit chip sufficiently so as to melt the solder... | 04/15/1986 |
| 4577083 | Soldering technique A solder application method and apparatus in which the solder element to be melted onto members to be electrically interconnected is the resistive heating element part of the solder heating circuit. A probe is provided for engagement with conductive metal... | 03/18/1986 |
| 4558200 | Electrical lead termination A method of attaching fine coil wire ends 22, 24 to terminal connectors 16, 18 wherein the terminals are rapidly heated into the red zone by common current flow therethrough from contact electrodes 26, 28 in the presence of a gaseous purge comprising a mi... | 12/10/1985 |
| 4492842 | Process of brazing using low temperature braze alloy of gold-indium tin A heat resistant brazing alloy of a major amount of gold, a lesser amount of indium and a minor amount of tin. The alloy is particularly suited for use in bonding electrical components to chip carrying substrates which are to be reworked.... | 01/08/1985 |
| 4486643 | Method for securing electrically conductive wires to a surface A method of securing a hot wire to holder wires within a carrier body by means of heating and soldering material applied to the holder wires. In this method, holder wires are provided with a layer of soldering material and secured in a carrier body, while... | 12/04/1984 |
| 4485290 | Bonding a workpiece to a body A workpiece such as a miniature stud (10) supports a chip (20) having a heat and light sensitive device therein. Such stud (10) is thermally bonded to an insulative body (12) to form a guide (14) for converting light to electrical pulses. A positive and a... | 11/27/1984 |
| 4441006 | Process of joining a contact The gap between upper and lower electrodes 1, 2 is measured at constant intervals of time while a contact 5 and a base 6 are pressed by the upper and lower electrodes under a constant pressure. Supply of an electric current to the upper and lower electrod... | 04/03/1984 |
| 4417119 | Liquid joint process A liquid joint process which includes the steps of feeding a liquid in a clearance formed between an electrical contact for joint and a carrier and around a joint part for joining the electrical contact and the carrier; a step of holding the electrical co... | 11/22/1983 |
| 4389557 | Semiconductor laser bonding technique In a method and apparatus for bonding a semiconductor laser chip to a heatsink and testing the bond obtained, temperature in the bonding operation is regulated by passing a small fixed current through the forward biased laser and monitoring corresponding ... | 06/21/1983 |
| 4382172 | Method for fabricating a watch case A method for fabricating a watch case comprising the steps of placing contact points of a bezel and a watch body to face to each other, applying pressure to said contact points through electrodes, and applying pulse current to said electrodes until said c... | 05/03/1983 |
| 4379216 | Method and apparatus for solder bonding multilayer tubing Tubing is made by continuously pulling steel strip at a predetermined feed speed from a supply, shaping the strip into a multilayer tube of a predetermined mass per unit length, and advancing the tube at the feed speed through a soldering station. The str... | 04/05/1983 |
| 4339651 | Method for soldering leads to electrical components A method is disclosed for soldering leads to electrical components such as capacitors on which a thin contacting layer of solder metal is provided. The leads are soldered on by pressing them into the contact layer by means of two electrodes. The leads are... | 07/13/1982 |
| 4332001 | Mounting structure for printed circuit board In order to assist the mounting of a printed circuit board to a metallic frame and the soldering of a conductive pattern of the former to the latter, a wire rod of high solderability is bent to conform substantially with the outline of the frame and is di... | 05/25/1982 |
| 4326117 | Weld braze technique High-strength metal joints are formed by a combined weld-braze technique. A hollow cylindrical metal member is forced into an undersized counterbore in another metal member with a suitable braze metal disposed along the bottom of the counterbore. Force an... | 04/20/1982 |
| 4195279 | Attaching of strain gages to substrates A method and apparatus for attaching strain gages to substrates is described, which is especially useful for field installation, and especially for materials which experience a drastic reduction in fatigue strength when heated as in spot welding. A strain... | 03/25/1980 |
