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| Number | Title | Issue Date |
| 7270019 | Collecting line assembly for monitoring and locating leaks An assembly for monitoring and locating leaks in an installation includes a collecting line formed of a material that is impermeable to a substance to be monitored. The collecting line has a multiplicity of openings spaced apart in its longitudinal direction. The op... | 09/18/2007 |
| 7164097 | Solder ball bonding method and bonding device Provided are a solder ball bonding method and a solder ball bonding device for performing bonding of a plurality of electrode portions formed on objects to be bonded by melting solder balls. The solder balls are suctioned by using a plurality of suction nozzles that... | 01/16/2007 |
| 7061103 | Chip package structure A chip package structure is disclosed. The chip package structure essentially comprises a carrier, one or more chips, a heat sink and an encapsulating material layer. At least one of the chips is flip-chip bonded and electrically connected to the carrier or another ... | 06/13/2006 |
| 7003874 | Methods of bonding solder balls to bond pads on a substrate Methods and apparatuses for bonding solder balls to bond pads are described. In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with individual bond pads over a substrate. While the ball portions are with... | 02/28/2006 |
| 6972394 | Method for connecting microchips to an antenna arranged on a support strip for producing a transponder The invention relates to a method of connecting micro-chip modules to antennas arranged on a first carrier tape for the manufacture of transponders. The method is characterised in that the micro-chips are packaged in a preceding bonding process to form a chip module... | 12/06/2005 |
| 6946190 | Thermal management materials A thermally-conductive compound for forming a layer which is conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The compound is an admixture of a thermal grease component and a di... | 09/20/2005 |
| 6936963 | Process for encapsulating a component made of organic semiconductors A process for encapsulating a component made of organic semiconductors is provided which includes steps of: a) providing a housing including a substrate with electrical connections and a cover; b) mixing a soldering glass with at least one of a binder and a solvent;... | 08/30/2005 |
| 6911726 | Microelectronic packaging and methods for thermally protecting package interconnects and components Apparatus and methods are provided wherein the reflowable electrically conductive interconnect material coupling the interconnects and/or land-side components of a microelectronic package is protected from elevated temperatures, such as those associated with reflow ... | 06/28/2005 |
| 6652615 | Seal for filter element An improved seal and method of making is disclosed for sealing a filter element to a filter mounting. The improved seal comprises a bonding pad formed from a sintered matrix of randomly oriented metallic fiber. The bonding pad is disposed between the filt... | 11/25/2003 |
| 6525293 | Method for closing and/or joining a connecting joint or joining seam between two pieces of galvanized sheet metal A method for closing and/or joining a connecting joint or joining seam between two pieces of galvanized sheet metal, in which zinc or a zinc alloy whose melting point is similar to that of zinc is heated to melting temperature and is continuously introduc... | 02/25/2003 |
| 6455804 | Continuous metal matrix composite consolidation A method for the fabrication of large metal matrix composite structures comprising the continuous brazing of aluminum matrix braze-clad tape using an infrared laser to melt the braze clad on the tape while applying pressure to the tape and simultaneously ... | 09/24/2002 |
| 6394158 | Method and device for thermally bonding connecting surfaces of two substrates A method for the thermal connection of overlapping connecting surfaces (19, 20) of two substrates (17, 18), at least one substrate (18) being 5 transparent and laser energy being applied to the connecting surfaces (19, 20) from a rear side (26) of the tra... | 05/28/2002 |
| 6390355 | Method for forming a metallic contact on an electronic printed circuit board and a product therefrom A method for forming a metallic contact and manufacturing a product having an electronic component 101 and a printed circuit board 100 (PCB) includes dispensing a slurry solder paste mixture 104 including a metallic powder 105 and an acidic fluid 106, pla... | 05/21/2002 |
| 6384366 | Top infrared heating for bonding operations A method and apparatus are provided for reliably heating the bonding areas of a substrate and/or a die or dies of a stacked die assembly or a flip-chip assembly to ensure high-quality solder or wire bonds between the substrate and the die. Embodiments inc... | 05/07/2002 |
| 6369345 | Method and apparatus for reflowing solder paste using a light source A method and apparatus for coupling a microelectronic component (114) to a printed circuit board (112) are disclosed. The component (114) is coupled to the circuit board (112) by placing leads (116) of component (114) in contact with conducting pads (118)... | 04/09/2002 |
| 6329625 | Method of making a seal An improved seal and method of making is disclosed for sealing a filter element to a filter mounting. The improved seal comprises a bonding pad formed from a sintered matrix of randomly oriented metallic fiber. The bonding pad is disposed between the filt... | 12/11/2001 |
| 6284996 | Method for mounting integrated circuits on printed circuit boards An improved method for mounting tape carrier package type integrated circuits on printed circuit boards. In the method, some of leads of the integrated circuit are preliminarily soldered with corresponding lead pattern on the printed circuit board after t... | 09/04/2001 |
| 6180909 | Apparatus and method for sealing fluid filter by infrared heating An apparatus and method is disclosed for sealing a filter element to a support member. An array of bonding fibers is interposed between the filter element and the support member. Infrared energy is applied for a period of time sufficient to at least parti... | 01/30/2001 |
| 6049656 | Method of mounting an integrated circuit on a printed circuit board A method of mounting an integrated circuit having a plurality of leads on a printed circuit board (PCB), by: removing foreign substances on the PCB; spreading a flux on lead patterns formed on the PCB; aligning the leads of the integrated circuit on the l... | 04/11/2000 |
| 5846476 | Optical curing process for intergrated circuit package assembly In semiconductor device assembly operations, the use of an optical heat source 28, such as a tungsten halogen lamp module, is to replace ovens and heater blocks for curing die-attach material and molding compound with reduction in cycle time, cost, footpr... | 12/08/1998 |
| 5786559 | Weld-braze process A weld-braze process is disclosed for forming high-strength metal joints using a localized heat source in combination with braze filler material. Braze filler material is sandwiched between the metal members to be joined at predetermined weld locations an... | 07/28/1998 |
| 5648005 | Modified quartz plate to provide non-uniform light source The present invention relates generally to a new apparatus and method for providing a non-uniform light source. More particularly, the invention encompasses an apparatus that uses a modified quartz plate to provide a non-uniform light source. A method for... | 07/15/1997 |
| 5626280 | Infrared transparent soldering tool and infrared soldering method A soldering tool that comprises a selected salt, including Group I and II halides such as potassium chloride, for example, that is transparent to infrared energy. A selected salt is formed into a tool having a specific shape for placement during soldering... | 05/06/1997 |
| 5532457 | Modified quartz plate to provide non-uniform light source The present invention relates generally to a new apparatus and method for providing a non-uniform light source. More particularly, the invention encompasses an apparatus that uses a modified quartz plate to provide a non-uniform light source. A method for... | 07/02/1996 |
| 5497546 | Method for mounting lead terminals to circuit board Load terminals are mounted to a circuit board by providing a solder layer on each lead terminal and on each conductive inner wall surface of respective holes formed in the circuit board. The lead terminals are thrust into respective holes, and contacting ... | 03/12/1996 |
| 5471027 | Method for forming chip carrier with a single protective encapsulant The present invention relates generally to a new apparatus and method for a chip carrier. More particularly, the invention encompasses an apparatus and a method that uses a chip carrier having a single encapsulant to provide both flip chip fatigue life en... | 11/28/1995 |
| 5447683 | Braze for silicon carbide bodies Dense monolithic SiC or SiC ceramic composites are strongly bonded using brazing compositions which, in their preferred composition, include a braze alloy consisting essentially of less than 50 weight percent silicon and at least two metals from the group... | 09/05/1995 |
| 5413275 | Method of positioning and soldering of SMD components The invention relates to a method of positioning and soldering of electronic components on a printed circuit board. To this end, soldering material is first heated to a suitable molten temperature, after which the component is put in the liquid soldering ... | 05/09/1995 |
| 5298715 | Lasersonic soldering of fine insulated wires to heat-sensitive substrates A combination of laser energy and ultrasonic energy is used for soldering an insulated wire to a pad located on a substrate. The combined laser energy and ultrasonic energy strips the insulation from the wire and solders the resulting bare wire to the pad... | 03/29/1994 |
| 5272307 | Method and apparatus for laser soldering of microelectronic lead-pad assemblies on ceramic substrates This invention relates to an method and apparatus for soldering microelectronic lead connections to pads on a ceramic substrate with the aid of a fiber based Neodymium:yttrium-aluminum-garnet (Nd:YAG) laser. Such structures of this type, generally, provid... | 12/21/1993 |
| 5272310 | Soldering method The present invention relates to a method of soldering electronic components to each other. When a member to be bonded is soldered to a base material by irradiating the member to be bonded with laser lights, the laser lights are incident upon a laser ligh... | 12/21/1993 |
| 5250782 | Method for the closing, by laser, of electronic circuit packages, notably hybrid circuit packages, minimizing mechanical stresses A method for the closing, by laser, of packages of electronic circuits, notably hybrid circuit packages, said method minimizing mechanical stresses. The soldering is done along a soldering path on the lid of the package. The soldering path is divided into... | 10/05/1993 |
| 5239156 | Apparatus and method for laser joining of superconducting tapes Two Nb3 Sn superconducting tapes are overlapped by an amount equal to about two times the width of the superconducting tapes. A filler material of material substantially similar to the tapes is placed between the two tapes in the overlapped reg... | 08/24/1993 |
| 5228109 | Light beam heating apparatus and method utilizing a fiber optic cable with random fiber array A light beam irradiation apparatus includes a light source, a reflector for condensing light emitted from the light source, and a fiber cable for transmitting light reflected by the reflector. The fiber cable accommodates at least one bundle of optical fi... | 07/13/1993 |
| 5142117 | Proximity heater for an ultrasonic bonding tool A heating element is held in position by a rigid holder constructed to surround an ultrasonic bonding tool and is itself fastened in a fixed position relative to the bonding tool, such that the rigid holder and the heating element are held in close proxim... | 08/25/1992 |
| 5128506 | Method and apparatus for selective infrared soldering using shielding fixtures An apparatus and method is disclosed for making additional solder joints on a printed wiring assembly which includes a printed wiring board and components soldered previously thereto. Additional components, along with additional solder to be reflowed to f... | 07/07/1992 |
| 5017170 | Brazing method for mounting a tension shadow mask A process is disclosed for use in the manufacture of a color cathode ray tube in which an in-process flat glass faceplate has on its inner face a centrally located phosphor screen. A metal color selection electrode support structure with an electrode-rece... | 05/21/1991 |
| 4978835 | Method of clamping electrical contacts for laser bonding A method of bonding a first plurality of electrical contacts to a second plurality of electrical contacts by aligning the first and second contacts, placing a diaphragm member against the first contacts and applying a differential pressure, such as a vacu... | 12/18/1990 |
| 4894509 | Laser assisted heater bar for multiple lead attachment A laser assisted miniature heater 10 includes an elongated hollow bar 12 having a high thermal conductivity and a supporting member 14 for conveying an optical fiber 16 which transmits laser radiation to an interiorly disposed hollow cavity 18. The interi... | 01/16/1990 |
| 4856702 | Method for manufacturing semiconductor components In a method for manufacturing an alloy contact between a wafer-shaped semiconductor substrate (4) and a metal contact wafer (6) a material bond for which the alloy layer reaches only slightly into the interior of the semiconductor substrate (4) is achieve... | 08/15/1989 |
