"That’s an amazing invention, but who would ever want to use one of them?"
President Rutherford B. Hayes ; Said in 1876, after Alexander Graham Bell demonstrated the telephone to him at the White House
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| Number | Title | Issue Date |
| 7795557 | Electronic flame-off electrode with ball-shaped tip An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration. ... | 09/14/2010 |
| 7360675 | Wire bonder for ball bonding insulated wire and method of using same An electrical contact device is provided for electrically grounding an uninsulated end-portion of insulated wire stored on a spool driven by a device comprises the following. An electrical connector fixes to the spool and is configured to receive an electrical conne... | 04/22/2008 |
| 7357288 | Component connecting apparatus When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection... | 04/15/2008 |
| 7339114 | Cable, cable connection method and cable welder A connection method for connecting an end of a signal wire (53) of a cable (51) to the connecting face of a contact (59) of a connector (52). The lengthwise direction of the connecting face of the contact (59) and the lengthwise di... | 03/04/2008 |
| 7320425 | Low-profile capillary for wire bonding A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less tha... | 01/22/2008 |
| 7299966 | Initial ball forming method for wire bonding wire and wire bonding apparatus An initial ball forming method for wire bonding wire and wire bonding apparatus that uses: a capillary through which a wire is passed; a torch electrode made of a low-melting-point material that contains, for instance, tin; and a direct-current high voltage power su... | 11/27/2007 |
| 7291551 | Sub-milliohm on-chip interconnection A method to form a very low resistivity interconnection in the manufacture of an integrated circuit device is achieved. A bottom conductive layer is formed overlying a substrate. The bottom conductive layer creates a first electrical coupling of a first location and... | 11/06/2007 |
| 7282667 | Welding wire positioning system An electrode position detection system for a welder having a laser that is projected in a lateral plane to laterally cross a welding wire at a location below a contact tip of a welding gun and a receiver that receive the laser bean after crossing the welding wire, a... | 10/16/2007 |
| 7265312 | Battery pack and method for constructing same An improved battery pack is proposed. The battery pack includes a housing, and first and second cells disposed in the housing, the first cell having a radius and a periphery. In addition, the battery pack includes a metal strap connecting the first and second cells,... | 09/04/2007 |
| 7234218 | Method for separating electronic component from organic board A method and electrical structure for separating electronic components from one another joined by solder interconnections. An electronic module is joined to a substrate via a solder interconnection, whereby the electronic module has an electrical heating component r... | 06/26/2007 |
| 7227095 | Wire bonders and methods of wire-bonding Wire bonders and methods of wire-bonding are disclosed herein. In one embodiment, a method includes attaching a wire to a terminal of a microelectronic component and generating an arc between a first electrode and a second electrode to sever the wire at a point at l... | 06/05/2007 |
| 7153811 | Multi-component catalyst system for the polycondensation manufacture of polyesters This invention relates to new multi-component catalyst systems for the polycondensation of polyesters. More particularly, this invention pertains to novel multi-component, germanium based catalyst systems for the polycondensation of PET (polyethylene terephthalate) ... | 12/26/2006 |
| 7128621 | Connecting structure and its connecting method, and rotating machinery and alternating current A connecting structure in which the electric cable having an insulated coating and the electrically conductive member with non-insulated coating are connected through a connecting terminal having a junction support member by applying an electric current, heating and... | 10/31/2006 |
| 7126078 | Sub-micron adjustable mount for supporting a component and method An arrangement is provided including an electrode extending to an electrode tip for contacting a workpiece. A welding configuration of the electrode tip is established by exposing the electrode tip to a selected welding environment for use in forming a weld having a... | 10/24/2006 |
| 7084346 | Method for electrically connecting a conductor to a contact The invention relates to a method for electrically connecting a conductor to a contact, according to which the electrical conductor that is coated with an insulation is first inserted between two legs of the contact, whereupon a welding device is placed against both... | 08/01/2006 |
| 7078644 | Resistance welding method, resistance welding apparatus, and method for manufacturing electronic component In a resistance welding method and a resistance welding apparatus which prevent a decrease in bonding strength between a lead wire and a metal member due to a partially formed current flow path and which immediately removes a defective component from a manufacturing... | 07/18/2006 |
| 7053328 | Method for connecting film-coated wire to subject member A film-coated wire is wound around a terminal at least one turn and pressed by an upper electrode of a resistance welding machine. A current is passed through the upper electrode when the wire is pressed, and heat is produced. The heat melts a film on the wire. The ... | 05/30/2006 |
| 7036225 | Process for treating coil end upon winding of coil A process for treating a coil end is provided, by which upon automatic winding of the coil, an electric connection between a portion of a wire at the front or rear end of the coil and a terminal of a winding object by arc welding can be securely carried out. A strip... | 05/02/2006 |
| 7035571 | Grid, scorotoron charger having the grid, process unit having the scorotoron charge, and image forming device installing the process unit A grid has a frame body in a U-shaped cross-section defining a main plate section and two side plate sections. A rectangular opening is formed at the main plate section, and a plurality of grid wires extend in a lengthwise direction of the main plate section and at ... | 04/25/2006 |
| 6936785 | Welding construction and a welding method using the same A welding construction (10) includes a weldable portion (11a) formed by bending a leading end of an electrically conductive plate (11). This weldable portion (11a) is formed with a tip (11c). Further, a slit ( | 08/30/2005 |
| 6903299 | Resistance welding tip assembly A resistance welding tip assembly having a welding tip support to which a welding tip is secured. A sleeve is constructed of an electrical insulating material, such as ceramic, and the sleeve includes a throughbore along a preset axis. The sleeve is slidably mounted... | 06/07/2005 |
| 6896170 | Wire bonder for ball bonding insulated wire and method of using same A wire bonder for bonding an insulated wire to a surface is disclosed. The bonder includes a bond head, having a bonding position adjacent to said surface and a wire preparation position spaced apart from the surface. There is a wire holder on the bond head, the wir... | 05/24/2005 |
| 6822184 | Process to weld steel to copper A process for joining a steel terminal to a copper electrode comprises applying a thin silver-copper flash to the surface of a copper electrode and bringing a steel surface into contact with the flash during high frequency welding. The weldment is improved compared ... | 11/23/2004 |
| 6822867 | Electronic assembly with solderable heat sink and methods of manufacture A electronic device and method for extracting heat from a heat producing component having front and back sides, the front side is disposed across from the back side, and the front side is attached to a substrate including multiple holes. A thermal interface material... | 11/23/2004 |
| 6797910 | Production apparatus of planer type semiconductor device and fabrication method of planer type semiconductor device In a planer type semiconductor device production apparatus having an interconnector to lead out an output of a planer type semiconductor element electrically connected with an external output electrode of the planer type semiconductor element through parallel gap we... | 09/28/2004 |
| 6784394 | Ball formation method and ball forming device used in a wire bonding apparatus A ball forming method and device used in a wire bonding apparatus in which a discharge is caused to occur by applying a high voltage between an electric torch and a tip end of a wire that extends out of a lower end of a capillary so as to form a ball at a tip end of... | 08/31/2004 |
| 6762391 | Welding electrode with replaceable tip A resistance welding electrode that is particularly suited for resistance spot welding a workpiece to a substrate without cross-contaminating specific portions of the workpiece is described. This is done by sheathing an internal surface of the welding electrode with... | 07/13/2004 |
| 6759618 | Method for connecting a current supply wire with a contact patch of an electrical lamp The invention relates to a method for connecting a contact plate (2) a lamp cap to the supply conductor wire (4) which is passed through an aperture (2a) in the contact plate (2). With the aid of a wire (5) which serves as f... | 07/06/2004 |
| 6715658 | Ultra fine pitch capillary A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes i) a tapered section having a predetermined angle with respect to the longitudinal axis... | 04/06/2004 |
| 6671952 | Method of lead wire connection A method of lead wire connection includes mounting a lead wire onto an uppre surface of a land portion, supplying a cover member onto the lead wire, pressing the lead wire via the cover member against the upper surface of the land portion by a first elect... | 01/06/2004 |
| 6660956 | Method of and apparatus for monitoring a ball forming process A method of monitoring a ball forming process in a wire bonder. A glow discharge parameter between an electrode on the wire bonder and an end of a wire mounted on the wire bonder on which the ball is being formed is monitored. The monitored parameter is c... | 12/09/2003 |
| 6651864 | Dissipative ceramic bonding tool tip Methods for making and using dissipative ceramic bonding tool tips for wire bonding electrical connections to bonding pads on integrated circuit chips and packages. The method of using the dissipative ceramic bonding tool tip includes dissipating charge w... | 11/25/2003 |
| 6639171 | Method for joining coil wire having heat resistant coating to coil terminal An end portion of a coil wire is wound around a coil terminal to form a wound portion. Then, air is supplied to the wound portion. While the air is supplied to the wound portion, heat is supplied in a first stage to the coil terminal, and thus a heat resi... | 10/28/2003 |
| 6637636 | Apparatus of clamping semiconductor devices using sliding finger supports An apparatus and method of supporting lead fingers during a wire bonding process and method of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a porti... | 10/28/2003 |
| 6595405 | Connection structure and method for connecting printed circuit and metal terminal, and reinforcing structure and method for reinforcing junction therebetween A junction between the portion of wiring of an FPC, which is not covered with a cover layer, is directly connected to a connection plate tip incorporated in a terminal attachment by one of resistance welding, ultrasonic welding and laser welding.... | 07/22/2003 |
| 6586698 | Method of operating a welding machine and a welding machine A method of operating a welding machine as well as to a welding machine comprising a frame, a first electrode (33) having a fixed position in the frame and a second electrode (35) which is mounted in the frame so as to be movable with respect to the frame... | 07/01/2003 |
| 6553667 | Apparatus and method for manufacturing composite articles including wear resistant jewelry and medical and industrial devices and components thereof System, apparatus, and method for making composite articles. Jewelry items such as finger rings, bracelets, earrings, body jewelry, and the like, are examples of such articles. Medical, dental, and industrial devices or components are other examples. Meth... | 04/29/2003 |
| 6552293 | Metallic members joining method and reflow soldering method In each odd-numbered unit current-supplying period of a plurality of unit current-supplying periods making up a set current-supplying time, a control unit subjects only positive switching elements to continuous switching operations at an inverter frequenc... | 04/22/2003 |
| 6545243 | Dynamic weld power termination for hot-staking armature commutators The method of the present invention involves setting a penetration threshold as well as a maximum weld time when hot staking armature conductors to the slots of a commutator. To perform each weld, an electrode is forcibly contacted with the top conductor ... | 04/08/2003 |
| 6528750 | Heat/pressure fusing wire to terminal apparatus and method A method and apparatus of making an electrical bobbin including applying to the wire/terminal assembly fusing pressure and heat. Sensing the temperature of an electrode zone near one of its fusing surfaces, and controlling the application and cessation of... | 03/04/2003 |