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Class 219/56.21 - By microbonding


Subclass of Class 219 - Electric heating
Definition: Subject matter wherein the bonding is produced between miniature
No. of patents: 110
Last issue date: 11/30/2010


1      
NumberTitleIssue Date
7842897Bonding apparatus
A wire bonding apparatus including a joining machine unit for joining a wire to a subject device, a measurement unit for measuring the connection state between the subject device and the wire, and a control unit for controlling the operation of the entire apparatus....
11/30/2010
7411157Electronic flame-off electrode with ball-shaped tip
An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration. ...
08/12/2008
7360675Wire bonder for ball bonding insulated wire and method of using same
An electrical contact device is provided for electrically grounding an uninsulated end-portion of insulated wire stored on a spool driven by a device comprises the following. An electrical connector fixes to the spool and is configured to receive an electrical conne...
04/22/2008
7355841Configurations and methods for making capacitor connections
An exemplary capacitor has a capacitor stack positioned in a case with a conductor positioned between the case and a lid. In one embodiment the conductor is positioned between the lid and an upper rim of the case and is welded to the lid and case. In one aspect, a c...
04/08/2008
7347880Flat capacitor having staked foils and edge-connected connection members
A method of joining a connection member to a capacitor foil using a staking tool having a tip of less than 0.030″ (0.762 mm) in diameter. Another embodiment couples multiple connection members of a capacitor together by edge-connecting each connection member to it...
03/25/2008
7331482Dispense pump with heated pump housing and heated material reservoir
A heated dispense pump overcomes the limitations of conventional systems providing for reliable and efficient heating of the dispensed material in a system that is compact, lightweight, and accurate. A pump housing and cartridge body are formed of a thermally conduc...
02/19/2008
7322507Transducer assembly, capillary and wire bonding method using the same
A transducer assembly and wire bonding method has a vibration unit for generating an ultrasonic wave. A body section is coupled to the vibration unit for transferring the ultrasonic wave. A tapered horn is coupled to the body section for transferring and concentrati...
01/29/2008
7320425Low-profile capillary for wire bonding
A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less tha...
01/22/2008
7282667Welding wire positioning system
An electrode position detection system for a welder having a laser that is projected in a lateral plane to laterally cross a welding wire at a location below a contact tip of a welding gun and a receiver that receive the laser bean after crossing the welding wire, a...
10/16/2007
7249702Multi-part capillary
A bonding tool for bonding a wire to a substrate. The bonding tool has a cylindrical body portion formed from a first material and a conical tip portion separately formed from a second material. The conical tip portion is coupled to one end of the body portion. ...
07/31/2007
7229022Method for producing a contactless chip card and chip card produced according to said method
The invention relates to a method for producing a transponder, especially a contactless chip card (1) comprising at least one electronic component (chip module 2) and at least one antenna (3); the at least one electronic chip component (2...
06/12/2007
7178745Dispense tip with vented outlets
In a fluid pump and cartridge assembly, a cartridge includes a material inlet port, a material outlet port, and a feed screw. The feed screw delivers fluid to be dispensed from the fluid inlet to the outlet port. The fluid inlet is preferably elongated in a directio...
02/20/2007
7177692Capacitor having a feedthrough assembly with a coupling member
A flat capacitor includes a case having a feedthrough hole, a capacitor stack located within the case, a coupling member having a base surface directly attached to the capacitor stack and having a portion extending through the feedthrough hole, the coupling member h...
02/13/2007
7154739Flat capacitor having an active case
A capacitor comprising an aluminum case; a capacitor stack mounted within the aluminum case, the capacitor stack comprising one or more anodes and one or more cathodes, one of the one or more anodes and one or more anodes attached to the aluminum case; wherein the c...
12/26/2006
7137547Process for forming electrical/mechanical connections
A method of making a connection to a surface of an electronic carrier, the method comprising the steps of: providing a mass of malleable material on the surface of the electronic carrier; connecting the mass to said surface; and extruding the mass into a bore of a t...
11/21/2006
7126078Sub-micron adjustable mount for supporting a component and method
An arrangement is provided including an electrode extending to an electrode tip for contacting a workpiece. A welding configuration of the electrode tip is established by exposing the electrode tip to a selected welding environment for use in forming a weld having a...
10/24/2006
7107099Capacitor having a feedthrough assembly with a coupling member
A flat capacitor includes a case having a feedthrough hole, a capacitor stack located within the case, a coupling member having a base surface directly attached to the capacitor stack and having a portion extending through the feedthrough hole, the coupling member h...
09/12/2006
7078644Resistance welding method, resistance welding apparatus, and method for manufacturing electronic component
In a resistance welding method and a resistance welding apparatus which prevent a decrease in bonding strength between a lead wire and a metal member due to a partially formed current flow path and which immediately removes a defective component from a manufacturing...
07/18/2006
7072713Flat capacitor for an implantable medical device
One aspect provides a capacitor feedthrough assembly having an electrically conductive member dimensioned to extend at least partially through a feedthrough hole of a case of the capacitor, the conductive member having a passage therethrough. ...
07/04/2006
7000853System and method for control of fluid dispense pump
In a fluid pump and cartridge assembly, a cartridge includes a material inlet port, a material outlet port, and a feed screw. The feed screw delivers fluid to be dispensed from the fluid inlet to the outlet port. The fluid inlet is preferably elongated in a directio...
02/21/2006
6957783Dispense tip with vented outlets
In a fluid pump and cartridge assembly, a cartridge includes a material inlet port, a material outlet port, and a feed screw. The feed screw delivers fluid to be dispensed from the fluid inlet to the outlet port. The fluid inlet is preferably elongated in a directio...
10/25/2005
6935548Dissipative ceramic bonding tool tip
Methods for making and using dissipative ceramic bonding tool tips for wire bonding electrical connections to bonding pads on integrated circuit chips and packages. The method of using the dissipative ceramic bonding tool tip includes dissipating charge while bondin...
08/30/2005
6936785Welding construction and a welding method using the same
A welding construction (10) includes a weldable portion (11a) formed by bending a leading end of an electrically conductive plate (11). This weldable portion (11a) is formed with a tip (11c). Further, a slit (
08/30/2005
6898849Method for controlling wire balls in electronic bonding
A method for forming a substantially spherical free air ball on a fine non-oxidizable wire in a computerized bonder, which has a computerized flame-off (EFO) apparatus operable to generate pulses of different heights and widths. A train of EFO current pulses is appl...
05/31/2005
6896170Wire bonder for ball bonding insulated wire and method of using same
A wire bonder for bonding an insulated wire to a surface is disclosed. The bonder includes a bond head, having a bonding position adjacent to said surface and a wire preparation position spaced apart from the surface. There is a wire holder on the bond head, the wir...
05/24/2005
6857552Method and apparatus for making smart card solder contacts
A method and apparatus for soldering terminal ends of an antenna embedded in a plastic smart card to contact terminals of an IC module disposed on the card are shown. The enamel coated antenna terminal ends are pre-coated with solder with a heater having horizontal ...
02/22/2005
6818861Discharge electrode for a wire bonding apparatus
A straight rod form discharge electrode used in a wire bonding apparatus. The electrode core material is covered, except for its tip end, by an alumina film that has been subjected to a pore sealing treatment. The alumina film subjected to the pore sealing treatment...
11/16/2004
6784394Ball formation method and ball forming device used in a wire bonding apparatus
A ball forming method and device used in a wire bonding apparatus in which a discharge is caused to occur by applying a high voltage between an electric torch and a tip end of a wire that extends out of a lower end of a capillary so as to form a ball at a tip end of...
08/31/2004
6770833Micro-welding electrode
A micro-welding electrode which is installed in a welding machine and applied to the electronics industry and spot electric welding industry. The micro-welding electrode includes two integrated electrodes which are made from high-temperature-resistant materials and ...
08/03/2004
6737603SW micro welder for directly welding enameled wires
This invention deals with a spot electrical welding machine which is technically applied to the electronics industry and micro-electronic industry. A spot electrical welder optimally directly welds enameled wires, fine wires or relevant thin sheets of metal, and met...
05/18/2004
6715658Ultra fine pitch capillary
A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes i) a tapered section having a predetermined angle with respect to the longitudinal axis...
04/06/2004
6671952Method of lead wire connection
A method of lead wire connection includes mounting a lead wire onto an uppre surface of a land portion, supplying a cover member onto the lead wire, pressing the lead wire via the cover member against the upper surface of the land portion by a first elect...
01/06/2004
6660956Method of and apparatus for monitoring a ball forming process
A method of monitoring a ball forming process in a wire bonder. A glow discharge parameter between an electrode on the wire bonder and an end of a wire mounted on the wire bonder on which the ball is being formed is monitored. The monitored parameter is c...
12/09/2003
6552293Metallic members joining method and reflow soldering method
In each odd-numbered unit current-supplying period of a plurality of unit current-supplying periods making up a set current-supplying time, a control unit subjects only positive switching elements to continuous switching operations at an inverter frequenc...
04/22/2003
6520399Thermosonic bonding apparatus, tool, and method
A thermosonic bonding apparatus including an ultrasonic transducer; a bonding tool including a high resistivity tip, and a low resistivity shaft extending from the tip; a tool support arm interconnecting the bonding tool and the ultrasonic transducer to v...
02/18/2003
6495787Electrical connection system between an electrochemical cell and a printed circuit
An electrical connection system between an electrochemical cell and a printed circuit having a copper layer, the system comprising at least one connection piece welded to the cell, wherein the layer of copper is of a thickness greater than 70 μm and wher...
12/17/2002
6491203Wire bonding apparatus
A wire bonding apparatus equipped with a capillary through which a wire is passed, a torch electrode which is installed in a substantially horizontally movable manner so as to be positioned beneath the capillary, and a torch electrode driver which drives ...
12/10/2002
6354479Dissipative ceramic bonding tip
Dissipative ceramic bonding tips for wire bonding electrical connections to bonding pads on integrated circuits chips and packages are disclosed. In accordance with the principles of the present invention, to avoid damaging delicate electronic devices by ...
03/12/2002
6337453Method and apparatus for arc-forming a bonding wire ball with attenuated electro-magnetic interference
An improved apparatus and method for forming a fusion ball at the end of a wire protruding from an ultrasonic bonding tool preparatory to making a ball bond to a workpiece includes shielding means for attenuating electromagnetic interference (EMI) emissio...
01/08/2002
6215083Welded wire termination device and method
A welded wire termination for use in thermally and mechanically stressful environments is provided by forming a wire termination tab on a conductive pad to define a tubule for receiving a wire, either stranded or solid. The tubule is tweezer welded to for...
04/10/2001
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