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| Number | Title | Issue Date |
| 8178820 | Method and heat treatment apparatus for uniformly heating a substrate during a bake process A heat treatment apparatus and associated method are provided for heating a substrate. The apparatus includes a processing chamber containing a process space, first and second substrate supports, and first and second heating sources. The first substrate support is c... | 05/15/2012 |
| 8164028 | Resistance heater A heater has a smooth heating surface and a recess formed on a second surface opposite to the heating surface. The recess is formed between opposite side walls in a lengthwise direction of the heater. Formation of the recess improves the electrical resistance of the... | 04/24/2012 |
| 8115142 | Plate, apparatus for adjusting temperature of substrate having the plate and apparatus for processing substrate having the plate In a plate for adjusting a temperature of a substrate, a body of the plate supports the substrate. A first channel and a second channel are disposed within the body of the plate. The first channel has a first inlet and a first outlet and passes therethrough a first ... | 02/14/2012 |
| 8106335 | Processing apparatus and heater unit A processing apparatus has a placement stage that prevents generation of a crack due to heating of an embedded heater. The placement stage (32A) on which a wafer (W) is placed has a plurality of areas (32Aa, 32Ab) so that one of the plurality of... | 01/31/2012 |
| 8008602 | Electrostatic chuck heater An electrostatic chuck heater is provided including a base which is formed by applying conductive paste containing a binder to upper and lower surfaces of an alumina sintered body to print an electrostatic electrode and heater electrode, calcining the alumina sinter... | 08/30/2011 |
| 7928343 | Microcantilever heater-thermometer with integrated temperature-compensated strain sensor The present invention provides microcantilever hotplate devices which incorporate temperature compensating strain sensors. The microcantilever hotplate devices of the present invention comprise microcantilevers having temperature compensating strain sensors and resi... | 04/19/2011 |
| 7880122 | Wafer having thermal circuit and power supplier therefor Provided are a wafer having a thermal circuit and power supplier therefor, which enable the wafer to heat or cool itself without using any additional heating or cooling system. The wafer includes the thermal circuit that is installed on one side of the wafer to be c... | 02/01/2011 |
| 7851728 | Heater unit The present invention provides a heater unit which can improve temperature uniformity of a heated object at the time of heating the object. A second heat conductor 32 which is the radial internal part of shaft 22 has a lower heat transfer ratio than a ... | 12/14/2010 |
| 7777160 | Electrode tuning method and apparatus for a layered heater structure A layered heater structure including an electrode layer and a localized tuning method for tuning the electrode layer of a layered heater structure with high precision is provided. The localized tuning method tunes the electrode layer to its proper local resistance t... | 08/17/2010 |
| 7763831 | Heating device A heating device has a ceramic base with a heating surface, and a heating body embedded in the ceramic base. The heating device includes a thermal conductive member positioned between the heating surface and the heating body in the ceramic base. The thermal conducti... | 07/27/2010 |
| 7741585 | Integrated thermal unit having a shuttle with two-axis movement An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfe... | 06/22/2010 |
| 7741584 | Encapsulated graphite heater and process A graphite heater and method of forming a graphite heater comprising a graphite body configured to form an electrical heating circuit for at least one heating zone through the graphite encapsulated in a continuous overcoat layer comprising at least one of a nitride,... | 06/22/2010 |
| 7718930 | Loading table and heat treating apparatus having the loading table A thermal processing system has a processing vessel 4, a support post 30 stood on the bottom wall of the processing vessel 4, and a support table 32 internally provided with a heating means 38 and supported on the support post 3... | 05/18/2010 |
| 7638737 | Ceramic-metal assembly and ceramic heater A ceramic-metal assembly including: a ceramic base; an electrode pad provided on a surface of the ceramic base; a connection terminal for external electrical connection; and a joining portion which joins the connection terminal to the electrode pad. The electrode pa... | 12/29/2009 |
| 7601934 | Integrated thermal unit having a shuttle with a temperature controlled surface An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfe... | 10/13/2009 |
| 7601933 | Heat processing apparatus and heat processing method A heat processing device that bakes a substrate having a resist coating film containing a volatile substance, includes a hot plate 2, a hot plate temperature control unit 3, a box member 1a, 5, 32 that defines a heat space 30 | 10/13/2009 |
| 7576303 | Wafer holder, and wafer prober provided therewith A wafer holder is provided having high rigidity and an enhanced heat-insulating effect that allow positional accuracy and heating uniformity to be improved, a chip to be rapidly heated and cooled, and the manufacturing cost to be reduced, and a wafer prober apparatu... | 08/18/2009 |
| 7564008 | Alumina member and manufacturing method thereof An electrostatic chuck includes a base of a sintered body containing alumina, an electrode as a power-supplied member embedded in the base and supplied with electric power, a bonding member embedded in the base and bonded to the electrode, in which a difference in c... | 07/21/2009 |
| 7560668 | Substrate processing device A substrate processing device is provided, which includes a resistance heating element and a high-frequency electrode, to which a voltage is applied, a power supply member for a resistance heating element, and a power supply member for a high-frequency electrode, wh... | 07/14/2009 |
| 7554059 | Heater unit and semiconductor manufacturing apparatus including the same A ceramic heater attaining more uniform temperature distribution from the start to the end of cooling is provided. Further, in a cooling module used for cooling the heater, liquid leakage during use is prevented, degradation in cooling capability is prevented and th... | 06/30/2009 |
| 7528349 | Temperature stabilization for substrate processing A temperature stabilization system, method, composition of matter and substrate processing system are disclosed. A heat absorbing material is disposed in thermal contact with a substrate. The heat absorbing material is characterized by a solid-liquid phase transitio... | 05/05/2009 |
| 7446284 | Etch resistant wafer processing apparatus and method for producing the same A wafer processing apparatus is fabricated by depositing a film electrode onto the surface of a base substrate, the structure is then overcoated with a protective coating film layer comprising at least one of a nitride, carbide, carbonitride or oxynitride of element... | 11/04/2008 |
| 7432476 | Substrate heat treatment apparatus A substrate heat treatment apparatus for heat-treating a substrate includes a bake plate having projections on an upper surface thereof, a seal unit disposed peripherally of the upper surface of the bake plate for closing a lateral area of a minute space formed betw... | 10/07/2008 |
| 7429718 | Heating and cooling of substrate support A substrate support assembly and method for controlling the temperature of a substrate within a process chamber are provided. A substrate support assembly includes an thermally conductive body comprising a stainless steel material, a substrate support surface on the... | 09/30/2008 |
| 7429720 | Electric heating pipe and electric heating apparatus using it The present invention relates to an electric radiating pipe capable of enhancing a heating efficiency in such a manner that a mixture of a porous operation medium and a volatile operation fluid is filled in a radiation pipe, and a porous operation medium is fast hea... | 09/30/2008 |
| 7427329 | Temperature control for single substrate semiconductor processing reactor A reactor for heat treatment of a substrate having a process chamber within a substrate enclosing structure, and a support structure configured to position a substrate at a predetermined spacing between the upper part and the bottom part within the process chamber d... | 09/23/2008 |
| 7425689 | Inline physical shape profiling for predictive temperature correction during baking of wafers in a semiconductor photolithography process The post exposure bake cycle in a chemically amplified resist process is more precisely controlled by measuring the distance from multiple locations on the bottom of each processed wafer to a reference plane surface while the wafer is supported on a cool plate. Subs... | 09/16/2008 |
| 7420143 | Durable graphite connector and method for manufacturing thereof An article comprising a graphite part coated with a pyrolytic graphite (pG) for increased mechanical strength of at least 25% over an uncoated graphite part. In connector applications for use in a semiconductor processing assembly such as a heater, the pG coated com... | 09/02/2008 |
| 7416793 | Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same An electrostatic chuck comprises a dielectric ceramic layer made of an alumina sintered body having a volume resistivity equal to or greater than about 1×1017Ω·cm at room temperature and a volume resistivity equal to or greater than about 1×1014 | 08/26/2008 |
| 7417206 | Heater, wafer heating apparatus and method for manufacturing heater A heater that is capable of heating an object to a desired temperature in a short period while minimizing the temperature difference the surface of the object is provided. The heater comprising a plate having a first surface and a second surface, the first surface b... | 08/26/2008 |
| 7415312 | Process module tuning A process module tuning method characterizes a process module by gathering data using a process condition measuring device to measure process outputs while inputs are excited. The data is used to identify a dynamic process model. The dynamic process model is then be... | 08/19/2008 |
| 7411161 | Susceptor for deposition process equipment and method of fabricating a heater therein A susceptor for deposition process equipment is provided. The susceptor includes a heater that heats the susceptor. The heater includes a sheath. The sheath surrounds a heating wire and is filled with an insulating ceramic material. An isolation layer is formed oppo... | 08/12/2008 |
| 7408131 | Wafer holder and semiconductor manufacturing apparatus A wafer holder is provided in which local heat radiation in supporting and heating wafers is kept under control and temperature uniformity of the wafer retaining surface is enhanced, and by making use of the wafer holder a semiconductor manufacturing apparatus suita... | 08/05/2008 |
| 7393417 | Semiconductor-manufacturing apparatus On a wafer holding area 50 on the upper surface of a susceptor 22, a wafer W is supported by a wafer support 54 such that a gap with a predetermined distance is formed between the wafer W and a wafer heating surface 52. A projection 58... | 07/01/2008 |
| 7394043 | Ceramic susceptor Ceramic susceptor whose wafer-retaining face has superior isothermal properties, and that is suited to utilization in apparatuses for manufacturing semiconductors and in liquid-crystal manufacturing apparatuses. In plate-shaped sintered ceramic body 1, resist... | 07/01/2008 |
| 7390990 | Heating device A heating device is provided, including an insulating ceramic base having a heating surface for heating an object. A high frequency electrode is embedded in the insulating ceramic base in the vicinity of the heating surface, and a heating body is embedded in the bas... | 06/24/2008 |
| 7372001 | Ceramics heater A ceramics heater comprises a circular heater plate formed of aluminum nitride and a metal foil heater wire formed of a high-melting metal and having a thickness of 100 μm to 175 μm. The heater wire is embedded in the heater plate. The heater wire has an inside po... | 05/13/2008 |
| 7364624 | Wafer handling apparatus and method of manufacturing thereof A wafer processing device or apparatus, i.e., a heater or an electrostatic chuck, comprises a planar support platen, a support shaft having centrally located bore, and a pair of electrical conductors located in the shaft. In one embodiment, the electrical conductors... | 04/29/2008 |
| 7361230 | Substrate processing apparatus In the substrate processing apparatus, a ceramic module for mounting a substrate has a flat plate portion having an electric circuitry and a ceramic base body, and as at least a part of a surface of the flat plate portion other than the surface mounting the substrat... | 04/22/2008 |
| 7361869 | Method for the production of an electrically conductive resistive layer and heating and/or cooling device An electrically conductive resistive layer (26) is produced by thermally spraying an electrically conductive material (18) onto the surface of a non-conductive substrate (12). Initially, the material layer (14) arising therefrom has no de... | 04/22/2008 |
