Did You Know...
...that the Band-Aid Bandage was invented by a Johnson & Johnson employee whose wife had cut herself? Earl Dickson's wife was rather accident prone, so he set out to develop a bandage that she could apply without help. He placed a small piece of gauze in the center of a small piece of surgical tape, and what we know today as the Band Aid bandage was born!
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| Number | Title | Issue Date |
| 8101883 | Laser-based material processing systems and methods for using such systems Laser-based material processing systems and methods for using such systems are disclosed herein. In one embodiment, for example, a laser-based material processing system includes a workpiece support, a positioning assembly over at least a portion of the workpiece su... | 01/24/2012 |
| 8084711 | Apparatuses for breaking a glass panel unified with a process table Disclosed herein are apparatuses for breaking a glass panel unified with a process table which break the glass panel formed with scribing lines along the scribing lines by irradiating laser beams. The apparatuses for breaking a glass panel unified with a process tab... | 12/27/2011 |
| 8076609 | Apparatus and method for machining tubing An apparatus for machining tubing includes a weighted base, an upright frame attached to the weighted base, and a laser light source attached to the weighted base. The apparatus also includes a guide bushing tooling attached to the upright frame which holds a guide ... | 12/13/2011 |
| 8071909 | Three-dimensional laser beam machining apparatus for long workpiece There is provided a three-dimensional laser beam machining apparatus for a long workpiece, which includes an automatic loading device for a large variety of materials that feeds materials to a three-dimensional laser beam machine. The automatic loading device 100... | 12/06/2011 |
| 8044322 | Vertical stent cutting process A system and method for processing a tubular member for producing a medical device, wherein the tubular member is oriented in a longitudinally vertical position during processing. ... | 10/25/2011 |
| 8044321 | Beam-catching device for a processing machine A processing machine for workpiece processing includes a cutting head that produces a cutting beam directed toward a workpiece, and a beam-catching device for receiving a discharge of the cutting beam from an underside of the workpiece during processing of the workp... | 10/25/2011 |
| 8026458 | Mechanical arrangement for processing pipes by cutting using a cutting beam A mechanical arrangement for processing pipes by cutting using a cutting beam has a cutting head, a pipe holder, a catching lance and a stripper. The stripper is transferable relative to a processing axis of the cutting head in the longitudinal direction of the pipe... | 09/27/2011 |
| 8013272 | Sheet processing apparatus and image forming apparatus A sheet processing apparatus having a laser processing unit, a collecting portion, and a detecting portion. The collecting portion is disposed below a laser processing position of the laser processing unit. The collecting portion collects a scrap of the sheet produc... | 09/06/2011 |
| 8008597 | Sheet post-processing apparatus A sheet post-processing apparatus which is capable of reliably producing desired labels and suppressing increases in user office expenses, job time, and environmental load. A laser cutting unit cuts a sheet being conveyed along a sheet conveying path or a sheet disc... | 08/30/2011 |
| 7968819 | Microdissection apparatus and method A microdissection apparatus includes a laser light source to emit laser light, and a laser light irradiation optical system to irradiate a sample with the laser light from the laser light source. The laser light irradiation optical system includes an active optical ... | 06/28/2011 |
| 7947919 | Laser-based material processing exhaust systems and methods for using such systems Laser-based material processing systems, exhaust systems, and methods for using such systems are disclosed herein. One embodiment of a laser-based material processing system can include an exhaust assembly configured to remove contaminants from a material processing... | 05/24/2011 |
| 7919723 | Apparatus and method for cutting lawns using lasers The laser lawn cutting system of the present invention consists of an array or grid of laser heads distributed across a lawn. The laser heads may be permanently fixed above the surface of the lawn, or preferably mounted underneath the surface of the lawn and designe... | 04/05/2011 |
| 7919724 | Cutting device for cutting hard-brittle material A cutting device for cutting a hard-brittle material along a cutting path is provided. The cutting device includes a cooling source having a first output terminal for providing a first cooling effect along the cutting path, and a heating source having a second outpu... | 04/05/2011 |
| 7910856 | Hybrid laser processing apparatus A processing table 3 holding a workpiece 2 is accommodated in a chamber 4 with a gas-tight condition kept, and a liquid column W is jetted to an upper surface of this chamber 4, and a processing head 9 that guides laser beam L to t... | 03/22/2011 |
| 7897893 | Method for drilling holes in a substrate, in particular an electrical circuit substrate, by means of a laser beam Disclosed is a valve having a housing with a valve seat for a two-piece flap which is rotatably mounted on a drive shaft. An annular piston seal and an adjacent cover disk are disposed between the first part and the second part of the two-piece flap so as to revolve... | 03/01/2011 |
| 7880116 | Laser head for irradiation and removal of material from a surface of a structure A laser head is adapted to irradiate an interaction region of an inhabitable structure with laser light to remove material from the structure. The laser head includes a housing. The laser head further includes a connector coupled to the housing and optically coupled... | 02/01/2011 |
| 7847215 | Jet trapping in a cutting beam processing machine A beam-catching device is provided for a cutting-beam processing machine configured to deliver a cutting beam to a workpiece. The beam-catching device includes a housing which has a line-like opening pointing toward the cutting beam, the cutting beam discharging fro... | 12/07/2010 |
| 7842901 | Device for drilling and for removing material using a laser beam A device for drilling and for removing material using a laser beam comprises: a rotating image rotator (2); a beam manipulator (1) which, when viewed in the beam direction, is arranged in front of the image rotator and which serves to adjust the angle ... | 11/30/2010 |
| 7807940 | Laser processing apparatus and laser processing method A laser processing apparatus, in accordance with at least one exemplary embodiment, is configured to contemporaneously perform the functions of observing a surface of a substrate and concentrating laser light to a given position inside the substrate. The laser proce... | 10/05/2010 |
| 7804043 | Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser The present invention relates to the apparatus, system and method for dicing of semiconductor wafers using an ultrafast laser pulse of femtosecond and picosecond pulse widths directly from the ultrafast laser oscillator without an amplifier. Thin and ultrathin semic... | 09/28/2010 |
| 7772520 | Hand-held laser cutting apparatus and method using same A hand-held apparatus is disclosed, where that hand-held apparatus comprises a hand piece having an output end, a switch disposed on that hand piece, wherein that switch includes “on” position and an “off” position, and wherein a laser beam is directed outwa... | 08/10/2010 |
| 7750269 | Laser for forming bags from a web of material A fastener includes first and second tracks. The first track includes a first profile, and the second track includes a second profile for interlocking with the first profile. The fastener extends between opposing ends. The first and second profiles at each of the op... | 07/06/2010 |
| 7705266 | Hybrid laser processing apparatus A hybrid laser processing apparatus 1 includes a laser oscillator 4 which oscillates a laser beam L, a high-pressure pump 5 which supplies liquid, wherein liquid supplied from the high-pressure pump 5 is injected from an injection nozzle ... | 04/27/2010 |
| 7696450 | Cutter with laser generator that irradiates cutting position on workpiece to facilitate alignment of blade with cutting position A cutter including a base, a holder, a cutter blade portion, and a laser generator. The holder is supported on the base portion in an upright posture. The cutter blade portion supports a moving blade. The cutter blade portion is supported on the holder movable betwe... | 04/13/2010 |
| 7675000 | System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology A substrate processing system includes a first, movable surface tension gradient device, a dicing device and a system controller. The first, movable surface tension gradient device is capable of supporting a first process within a first meniscus. The first meniscus ... | 03/09/2010 |
| 7659490 | Systems for processing plate-like workpieces A system for processing plate-like workpieces, especially metal sheets, comprises a first processing device in the form of a cutting device and also a second processing device, on which a processing line is defined. By means of a workpiece bed of a longitudinal guid... | 02/09/2010 |
| 7638729 | Apparatus for cutting substrate and method using the same An apparatus for cutting a substrate includes a laser oscillator generating a femtosecond laser beam, a first beam splitter splitting the femtosecond laser beam into first and second femtosecond laser beams, a first condenser lens receiving the first femtosecond las... | 12/29/2009 |
| 7605342 | Laser processing head A laser processing head includes a first housing region associated with a beam guidance of a laser processing machine, a second housing region associated with the laser processing head, and an aperture in a wall separating the first and second housing regions. The h... | 10/20/2009 |
| 7592567 | Apparatus and method for disassembling containers having thermoplastic joining surfaces An apparatus and method for disassembling a container having sections joined at sealed thermoplastic joining surfaces, such as toner cartridges, by cutting between the joined sections with a computer controlled laser beam, the beam being variable in intensity and/or... | 09/22/2009 |
| 7589297 | Apparatus and method for cutting flat stent precursors An apparatus for cutting a planar medical component having a first surface and a second surface, comprising a clamp for fixing the component and applying a tensile force, a support having a surface having a hole therein, the upper surface disposed proximate the seco... | 09/15/2009 |
| 7569793 | Sequential lateral solidification device and method of crystallizing silicon using the same A sequential lateral solidification (SLS) device and a method of crystallizing silicon using the same is disclosed, wherein alignment keys are formed on a substrate with one mask having a plurality of different patterns, and a crystallization process is progressed i... | 08/04/2009 |
| 7560660 | Laser irradiation method and apparatus An objective of the present invention is to provide a laser crystallizing method capable of suppressing a thermal damage on a substrate as well as enhancing a substrate processing efficiency, and a laser irradiation apparatus using the laser crystallizing method. La... | 07/14/2009 |
| 7528341 | Scribing apparatus, substrate cutting apparatus equipped with the scribing apparatus, and substrate cutting method using the substrate cutting apparatus A scribing apparatus simultaneously performs scribing processes for a TFT substrate and a C/F substrate in the same location, thereby efficiently utilizing equipment spaced and achieving enhanced productivity. A substrate cutting apparatus is equipped with the scrib... | 05/05/2009 |
| 7521650 | Laser machining apparatus A laser machining apparatus in which three or more beam splits are made incident on one machining lens so that high speed machining can be achieved, and the machining quality (shapes, dimensions, accuracy and straightness of machined holes) is excellent. The optical... | 04/21/2009 |
| 7479617 | Monitoring slot formation in substrates A light beam is used to cut a slot in a first side of substrate. An optical sensor monitors a surface of a second side of the substrate that is opposite the first side while cutting the slot. If the light beam breaks through the surface of the second side, the senso... | 01/20/2009 |
| 7429034 | Apparatus and method for thermal cutting of a workpiece An apparatus for thermal cutting of workpieces includes a cutting means for separating a workpiece into a finished part and a residual part, a workpiece support, and support elements for supporting the workpiece. Separate first and second support elements are provid... | 09/30/2008 |
| 7420298 | Water cooled high precision z-theta stage A high precision z-theta stage having a horizontal translation axis (z-axis) and a rotary axis (theta-axis) parallel with the translation axis comprises parallel spaced apart linear translation stages, a carriage supported between the parallel translation stages, an... | 09/02/2008 |
| 7412762 | Method and device for introducing weakened lines into a component rigid per se For introducing a weakened line into a component 10, which is rigid per se and does not conform to a supporting mold or a receiving means in correspondence with the true shape, especially into an injection-molded part such as an instrument panel of an automob... | 08/19/2008 |
| 7407861 | Method and system for high-speed, precise micromachining an array of devices A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The number of resistance measurements are limited by using non-measuremen... | 08/05/2008 |
| 7402773 | Laser beam processing machine Disclosed herein is a laser beam processing machine having a chuck table for holding a workpiece, a laser beam applicator for applying a laser beam capable of passing through the workpiece to the workpiece held on the chuck table, and a processing-feeder for moving ... | 07/22/2008 |
