Bizarre Patents
A method for inducing cats to exercise consists of directing a beam of invisible light produced by a hand-held laser apparatus onto the floor or wall.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7722779 | Method and etchant for removing glass-coating from metal wires An etchant for and method of removing a glass coating on a metallic wire is provided. The etchant comprises an acid solution having metal ions contained therein. The metal ions prevent the acid solution from pitting or damaging the metallic wire, while allowing the ... | 05/25/2010 |
| 7521001 | Surface treatment of concrete A method of treating a surface for the removal of a surface portion comprising irradiating the surface with laser light, wherein the irradiation is effected by covering said surface in a sequential manner with a plurality of discrete spots of laser light. The spots ... | 04/21/2009 |
| 7442323 | Potassium monopersulfate solutions A composition comprising a solution of potassium monopersulfate having an active oxygen content of from about 3.4% to about 6.8% and a process for its preparation including neutralization with an alkaline material is disclosed. ... | 10/28/2008 |
| 7429337 | Method for removing at least one area of a layer of a component consisting of metal or a metal compound The invention relates to a method for removing an area of a layer of a component consisting of metal or a metal compound. According to prior art, corrosion products of a component are removed in a first step by applying a molten mass or by heating in a voluminous po... | 09/30/2008 |
| 7422696 | Multicomponent nanorods Multicomponent nanorods having segments with differing electronic and/or chemical properties are disclosed. The nanorods can be tailored with high precision to create controlled gaps within the nanorods or to produce diodes or resistors, based upon the identities of... | 09/09/2008 |
| 7416681 | Etching solution for multiple layer of copper and molybdenum and etching method using the same An etching solution for a multiple layer of copper and molybdenum includes: about 5% to about 30% by weight of a hydrogen peroxide; about 0.5% to about 5% by weight of an organic acid; about 0.2% to about 5% by weight of a phosphate; about 0.2% to about 5% by weight... | 08/26/2008 |
| 7399430 | Method for manufacturing phosphor, phosphor and plasma display panel It is an object of the present invention to control damage of a phosphor caused by an etching solution. Disclosed is a method of manufacturing a phosphor having the steps of: (a) crushing phosphor particles via a crushing treatment process, and (b) surface-treating ... | 07/15/2008 |
| 7396477 | Method for manufacturing a thermal interface material An exemplary method for manufacturing a thermal interface material includes the steps of: providing a first substrate having a first surface and an opposite second substrate having an opposite second surface spaced apart a predetermined distance; forming a number of... | 07/08/2008 |
| 7384486 | Chamber cleaning method A method for cleaning a process chamber in such a manner that chamber-cleaning chemicals or agents are incapable of remaining in the chamber after cleaning and chemically interfering with semiconductor fabrication or other processes subsequently carried out in the c... | 06/10/2008 |
| 7368065 | Implants with textured surface and methods for producing the same Compositions and methods are provided for preparing a metal substrate having a uniform textured surface with a plurality of indentations with a diameter in the nanometer and micrometer range. The textured surface is produced by exposing the substrate to an etching f... | 05/06/2008 |
| 7344998 | Wafer recovering method, wafer, and fabrication method In order to use an etching solution of less complicated composition for recovering used wafers, embodiments of the present invention provide a recovering method, and also provide a kind of wafer, which is used as a process control wafer or dummy wafer, and fabricati... | 03/18/2008 |
| 7341681 | Method of manufacturing optical fiber probe and for finishing micro material In a method for manufacturing an optical fiber probe in which an optical fiber is formed as an optical fiber probe by etching a tip section and sharpening a core region of the optical fiber, the optical fiber is a polarization maintaining optical fiber including the... | 03/11/2008 |
| 7329365 | Etchant composition for indium oxide layer and etching method using the same An etchant for removing an indium oxide layer includes sulfuric acid as a main oxidizer, an auxiliary oxidizer such as H3PO4, HNO3, CH3COOH, HClO4, H2O2, and a Compound A that is obtained b... | 02/12/2008 |
| 7309449 | Substrate processing method A substrate processing enables etching of a barrier metal film at around room temperature without application of a mechanical load and without excessive etching of a necessary portion of copper. The substrate processing flattens a copper film and a barrier metal fil... | 12/18/2007 |
| 7303600 | Unexpanded perlite ore polishing composition and methods An unexpanded perlite ore polishing composition is shown. The composition comprises base material having grains of unexpanded perlite ore of a selected distribution of particle sizes which undergo fracturing of the grains as a function of an abrasive force applied t... | 12/04/2007 |
| 7291283 | Combined wet etching method for stacked films and wet etching system used for same A combined wet etching method for stacked films which is capable of performing etching processes in a collective manner while controlling an amount of side-etching on each of stacked films and of making uniform side edges. In the wet etching method, two or more type... | 11/06/2007 |
| 7279765 | Transparent electrode made from indium-zinc-oxide and etchant for etching the same A pixel electrode employs a transparent electrode made from indium-zinc-oxide (IZO) that is capable of preventing damage and bending thereof. In a liquid crystal display device containing pixel electrodes, the transparent electrode is made from indium-zinc-oxide (IZ... | 10/09/2007 |
| 7276181 | Method for preparing decorative glass using glass etching composition A method for preparing a decorative glass using a glass etching composition, wherein a frosting of elaborate patterns and designs is applied on the surface of the glass having an arbitrary shape, such a plane, a curved plane or a tube, by utilizing the silk-screen p... | 10/02/2007 |
| 7276367 | Method of etching islands of cells in a grid pattern An apparatus and process for monitoring migratory cell proliferation with restricted migration on a substrate includes providing a substrate, coating the substrate with extracellular matrix, plating cells suspended in cell culture media on extracellular matrix, and ... | 10/02/2007 |
| 7261827 | Method of processing end portions of optical fibers and optical fibers having their end portions processed An end portion of an optical fiber element 11 is dipped into an etchant to shape that portion of the fiber element immersed in said etchant into a coaxial reduced-diameter portion by etching while causing that portion of the fiber element where the etchant ri... | 08/28/2007 |
| 7254308 | Light guide plate and backlight module using the same A backlight module (2) includes a light source (66) and a light guide plate (20), the light guide plate includes a light incidence surface (25), a light-emitting surface (21) adjacent to the light incidence surface; and a bottom su... | 08/07/2007 |
| 7238295 | Regeneration process of etching solution, etching process, and etching system A regeneration process is disclosed for an etching solution composed of a phosphoric acid solution and used in etching silicon nitride films in an etch bath. As a result of the etching, the etching solution contains a silicon compound. According to the regeneration ... | 07/03/2007 |
| 7226513 | Silicon wafer cleaning method This invention provides a cleaning method of silicon wafer for obtaining a silicon wafer in which micro roughness thereof under spatial frequency of 20/μm is 0.3 to 1.5 nm3 in terms of power spectrum density, by passing a process of oxidizing the silicon... | 06/05/2007 |
| 7192489 | Method for polymer residue removal following metal etching A method for removing polymer containing residues from a semiconductor wafer including metal containing features including providing a semiconductor wafer having a process surface including metal containing features said process surface at least partially covered wi... | 03/20/2007 |
| 7192885 | Method for texturing surfaces of silicon wafers A method for texturing surfaces of silicon wafers comprising the steps of dipping the silicon wafers in an etching solution of water, concentrated hydrofluoric acid and concentrated nitric acid and setting a temperature for the etching solution. The etching solution... | 03/20/2007 |
| 7186657 | Method for patterning HfO2-containing dielectric A wafer has a trench, a STI layer formed in the trench, an HfO2-containing gate dielectric covering the wafer and the STI layer, a gate electrode formed on the HfO2-containing gate dielectric, and at least a spacer formed beside the gate electrode. The wafer is preh... | 03/06/2007 |
| 7169315 | Method of producing an aluminium surface with a high total reflectance A method of producing a reflector sheet, which method comprises treating an Al alloy sheet to increase the total reflectance of a surface of the sheet for use as a lighting reflector by bringing the sheet into contact with an acid or alkaline fluid that dissolves al... | 01/30/2007 |
| 7163897 | Method for assaying elements in a substrate for optics, electronics, or optoelectronics The invention provides a method of assaying at least one element in a material including silicon. The method includes the steps of decomposing a portion of the material with an etching agent to form a solution containing hexafluorosilicic acid and at least one eleme... | 01/16/2007 |
| 7157015 | Method of manufacturing a substrate with concave portions, a substrate with concave portions, a substrate with concave portions for microlenses, a microlens substrate, a transmission screen and a rear projector A method of manufacturing a substrate 5 with a plurality of concave portions 3 according to the invention includes the steps of forming a mask 6 on the substrate 5, forming a plurality of initial holes 61 on the mask 6 by me... | 01/02/2007 |
| 7141179 | Monitoring semiconductor wafer defects below one nanometer The invention describes a method to facilitate the use of low-sensitivity monitoring equipment for detecting and monitoring defects on the surface of semiconductor wafers. The method includes the use of a hydrofluoric acid solution for increasing the dimensions of a... | 11/28/2006 |
| 7138069 | Method of surface-finishing stainless steel after descaling A new surface finishing process for stainless steel where beautiful, bright and milky white coloured surface is obtainable even for such grades as high carbon containing 13 chromium steel and high sulfur containing free cutting stainless steel is disclosed. After re... | 11/21/2006 |
| 7138066 | Gear surface treatment procedure A method of surface treating heat treated members to remove oxide scale. The heat treated members are subjected to a staged series of discrete chemical and physical cleaning steps yielding a substantially scale-free surface readily adaptable for subsequent applicati... | 11/21/2006 |
| 7128843 | Process for fabricating monolithic membrane substrate structures with well-controlled air gaps A process for fabricating monolithic membrane structures having air gaps is disclosed, comprising the steps of: providing a wafer; depositing and patterning a protective layer on the wafer; providing a trench in the wafer; depositing and patterning a metal in the tr... | 10/31/2006 |
| 7115193 | Sputtering target producing very few particles, backing plate or apparatus within sputtering device and roughening method by electric discharge machining Provided is a sputtering target, backing plate or apparatus inside a sputtering device in which an electrical discharge machining mark is formed on the face to which unwanted films during sputtering are deposited, and the electrical discharge machining mark is forme... | 10/03/2006 |
| 7112530 | Method of forming contact hole A method of forming a contact hole in a semiconductor device, by which a PMD layer as an insulating interlayer is prevented from being overetched by wet cleaning for removing polymer and photoresist after forming a contact hole perforating the PMD layer in a manner ... | 09/26/2006 |
| 7108813 | Gas/ion species selective membrane supported by multi-stage nano-hole array metal structure An improved two-step replication process for fabrication of porous metallic membranes is provided. A negative of a porous non-metallic template is made by infiltration of a liquid precursor into the template, curing the precursor to form a solid negative, and removi... | 09/19/2006 |
| 7097783 | Method for inspecting a titanium-based component A process for detecting an aluminum-based material deposited onto a titanium-based gas turbine engine component during engine operation is disclosed. The process comprises immersing at least a portion of the titanium-based component, which has been subjected to engi... | 08/29/2006 |
| 7083741 | Process and device for the wet-chemical treatment of silicon A device and process for the wet-chemical treatment of silicon using an etching liquid that contains water, nitric acid and hydrofluoric acid. The etching liquid is activated by introducing nitrogen oxide (NOx) into the etching liquid, before being used f... | 08/01/2006 |
| 7084072 | Method of manufacturing semiconductor device Disclosed is a method of manufacturing a semiconductor device. The method includes the steps of forming a gate in a cell region and a peripheral region of a substrate, depositing a buffer oxide layer on the gate and the substrate, annealing a resultant structure of ... | 08/01/2006 |
| 7056447 | Semiconductor processing methods Embodiments in accordance with the present invention provide for removing organic materials from substrates, for example substrates employed in the fabrication of integrated circuits, liquid crystal displays and the like. Such embodiments also provide for forming se... | 06/06/2006 |
