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| Number | Title | Issue Date |
| 7976718 | System and method for selective etching of silicon nitride during substrate processing A system (FIG. 5) and methods for selectively etching silicon nitride in the presence of silicon oxide that provide high selectivity while stabilizing silicon oxide etch rates. The invention comprises a processing chamber (10), dispense lines (20, 2... | 07/12/2011 |
| 7964108 | Regeneration method of etching solution, an etching method and an etching system The present invention provides a regeneration process of the etching solution for the silicon nitride film, applying phosphoric acid aqueous solution, wherein multiple numbers of filters are connected to the piping path of etching solution extracted from the etching... | 06/21/2011 |
| 7431861 | Etchant, replenishment solution and method for producing copper wiring using the same An etchant for copper and copper alloys, includes an aqueous solution containing: 14 to 155 g/liter of cupric ion source in terms of a concentration of copper ions; 7 to 180 g/liter of hydrochloric acid; and 0.1 to 50 g/liter of azole, the azole including nitrogen a... | 10/07/2008 |
| 7404904 | Method and apparatus to clean particulate matter from a toxic fluid There is a method of capturing, removing or collecting the particulate matter from a fluid containing a toxic liquid reaction and particulate matter produced from the reaction. The method includes partly or completely disposing a screen into the toxic fluid. Mixing ... | 07/29/2008 |
| 7354523 | Methods for sidewall etching and etching during filling of a trench A method for sidewall etching includes providing a substrate having a trench defined therein, with the trench having fill material disposed over a bottom thereof, along a sidewall thereof, and at the trench opening. The fill material along the sidewall of the trench... | 04/08/2008 |
| 7351343 | Copper metal recovery system The present invention generally relates to a copper metal recovery system, able to integrate with a waste treatment system of a circuit board manufacture plant, includes a stirring unit, a crystallization unit and a pressure filtering unit. More than 2 parts of weig... | 04/01/2008 |
| 7332054 | Etch apparatus In a process using a hot phosphoric acid etchant (12) to etch silicon nitride on a semiconductor wafer (15) submerged in a tank (11) of the etchant (12), a recirculating path is established for the etchant (12). A porous filter ( | 02/19/2008 |
| 7326654 | Monodisperse nanoparticles produced by size-selective photoetching reaction Monodisperse nanoparticles are prepared with a high degree of reproducibility by controlling pH in size-selective photoetching. The nanoparticles have uniform optical properties and other properties. ... | 02/05/2008 |
| 7303691 | Polishing method for semiconductor wafer A polishing method includes a slurry adjusting step for adjusting a polishing slurry containing silica particles so that the number of silica particles having a composition ratio of Si/O of 50–60 wt %/40–50 wt %, a modulus of elasticity of 1.4×1010 P... | 12/04/2007 |
| 7285222 | Method for recycling sludge during waste-water treatment A method for recycling sludge during waste-water treatment firstly utilizes a process of chemical coagulation to produce sludge rich in copper ions. The sludge is then leached in a sulfuric acid storage tank with sulfuric acid of concentration 1-2N, whereby a extrac... | 10/23/2007 |
| 7264677 | Process for treating solid surface and substrate surface Ruthenium, osmium and their oxides can be etched simply and rapidly by supplying an atomic oxygen-donating gas, typically ozone, to the aforementioned metals and their oxides through catalysis between the metals and their oxides, and the ozone without any damages to... | 09/04/2007 |
| 7255749 | Substrate cleaning method and substrate cleaning apparatus In a cleaning treatment of a substrate using an aqueous solution of ammonium fluoride or a mixture of an aqueous solution of ammonium fluoride and hydrofluoric acid as a cleaning liquid, the cleaning liquid is replenished by at least one liquid selected from the gro... | 08/14/2007 |
| 7243700 | Method for casting core removal To destructively remove a refractory metal casting core from a cast part the part is exposed to a combination of nitric acid and sulfuric acid. ... | 07/17/2007 |
| 7238295 | Regeneration process of etching solution, etching process, and etching system A regeneration process is disclosed for an etching solution composed of a phosphoric acid solution and used in etching silicon nitride films in an etch bath. As a result of the etching, the etching solution contains a silicon compound. According to the regeneration ... | 07/03/2007 |
| 7186480 | Method for adjusting dimensions of photomask features A method for adjusting one or more dimensions of a photomask subsequent to etching of a defective pattern in the chrome-containing layer thereof is provided. The method includes subjecting the chrome-containing layer of a photomask to a wet etch process utilizing a ... | 03/06/2007 |
| 7175819 | Regeneration of cupric etchants and recovery of copper sulfate Spent, acidic solutions comprising cupric chloride and hyrdrochloric acid from the copper etching process are regenerated by a process in which the acid is subjected to distillation with sulfuric acid. In one embodiment, the process comprises (a) providing a spent e... | 02/13/2007 |
| 7101517 | Processing solution preparation and supply method and apparatus A processing solution preparation and supply apparatus includes a dissolving preparation bath to which a material powder and ultrapure water are supplied. This dissolving preparation bath is connected to a substrate processing apparatus via a pipe, and a processing ... | 09/05/2006 |
| 7097784 | Etching method and apparatus for semiconductor wafers A method for etching semiconductor wafers in an etching apparatus including an etching bath filled with an etchant and capable of setting liquid temperature and process sequence, comprises selecting a predetermined etching program suitable for etching of the semicon... | 08/29/2006 |
| 7091132 | Ultrasonic assisted etch using corrosive liquids An ultrasonic etching apparatus for chemically-etching a workpiece is disclosed. The apparatus includes an outer tank at least partially filled with an aqueous solution, an inner tank at least partially disposed within the outer tank and in contact with aqueous solu... | 08/15/2006 |
| 7083741 | Process and device for the wet-chemical treatment of silicon A device and process for the wet-chemical treatment of silicon using an etching liquid that contains water, nitric acid and hydrofluoric acid. The etching liquid is activated by introducing nitrogen oxide (NOx) into the etching liquid, before being used f... | 08/01/2006 |
| 7067068 | Method for preventing lead from dissolving from a lead-containing copper-based alloy A lead-containing copper-based alloy is immersed into a weak acidic or neutral etching solution having a buffer effect which is formed by adding an organic acid into a complexing agent having a high ability to form a complexing ion with lead, and lead particles pres... | 06/27/2006 |
| 7056447 | Semiconductor processing methods Embodiments in accordance with the present invention provide for removing organic materials from substrates, for example substrates employed in the fabrication of integrated circuits, liquid crystal displays and the like. Such embodiments also provide for forming se... | 06/06/2006 |
| 7052599 | Method and apparatus for reuse of abrasive fluid used in the manufacture of semiconductors An apparatus and method recycles the abrasive fluid or slurry effluent used in the polishing step in the manufacture of semiconductors. Agglomerations of abrasive grains built up in the slurry effluent are crushed using a mill, ultrasonic oscillation, or pressurized... | 05/30/2006 |
| 7040130 | Method and apparatus for forming discrete microcavities in a filament wire using microparticles A microcavity forming device is provided for making microcavities in a tungsten wire. The microcavity forming device includes a source of particles; a housing for receiving a heated tungsten wire; and a plurality of jet nozzles disposed in the housing for spraying t... | 05/09/2006 |
| 7039288 | Fabrication of optical waveguides for reduction of minimum waveguide spacing A fabrication method reduces minimum waveguide spacing in an integrated optical device. Core regions of the waveguides are etched into cladding material and then filled with core material, instead of etching the spacing between the core material first and then filli... | 05/02/2006 |
| 7026255 | Method and device for photo-electrochemically etching a semiconductor sample, especially gallium nitride In a method for photo-electrochemical etching of a semiconductor sample, the semiconductor sample is brought in contact with an electrolyte liquid. The contact area formed thereby is illuminated through the electrolyte liquid with UV light. The photo-current created... | 04/11/2006 |
| 6953044 | Drained water recovery system and method for operating the same A drained water recovery system of a process device and recovering method thereof is provided. The recovering method includes using a conductivity meter to measure the conductivity of the drained water so that the drained water with different degrees of conductivity... | 10/11/2005 |
| 6949202 | Apparatus and method for flow of process gas in an ultra-clean environment Processes for the addition or removal of a layer or region from a workpiece material by contact with a process gas in the manufacture of a microstructure are enhanced by the use of recirculation of the process gas. Recirculation is effected by a pump that has no sli... | 09/27/2005 |
| 6946055 | Method for recovering an organic solvent from a waste stream containing supercritical CO2 An organic solvent is separated from a waste stream containing supercritical CO2, an organic solvent and etchant contaminants. The process includes separating the supercritical CO2 by subjecting the waste stream to elevated temperature and/or r... | 09/20/2005 |
| 6939472 | Etching method in fabrications of microstructures The present invention teaches a method and apparatus for removing sacrificial materials in fabrications of microstructures using one or more selected spontaneous vapor phase etchants. The selected etchant is fed into an etch chamber containing the microstructure dur... | 09/06/2005 |
| 6936229 | Recovery of lithium compounds from brines Methods and apparatus for the production of low sodium lithium carbonate and lithium chloride from a brine concentrated to about 6.0 wt % lithium are disclosed. Methods and apparatus for direct recovery of technical grade lithium chloride from the concentrated brine... | 08/30/2005 |
| 6878303 | Substrate processing apparatus and substrate processing method A substrate processing apparatus for supplying a treatment liquid onto the surface of a substrate to treat the same. This apparatus is provided with: a spin chuck for holding and rotating a substrate; a nozzle for supplying a treatment liquid to the substrate held b... | 04/12/2005 |
| 6863836 | Method for removal of photoresist using sparger A method of removing photoresist from semiconductor wafers through the use of a sparger plate. According to the inventive method, at least one semiconductor wafer is positioned in a process tank above the sparger plate. A mixture of ozone and deionized water is intr... | 03/08/2005 |
| 6844269 | Etching method for semiconductor silicon wafer An etchant and an etching method that contribute to prevention of metal contamination of a semiconductor silicon wafer, and a semiconductor silicon wafer in which metal contamination is extremely reduced, are provided. The etchant according to the present invention ... | 01/18/2005 |
| 6706121 | Device and method for the treatment of semiconductor wafers In a method of treating substrates a treatment fluid is fed into a collection vessel after treatment, at least a portion of the treatment fluid is withdrawn from the collection vessel and returned to respective reservoir and the collection vessel is rinsed before re... | 03/16/2004 |
| 6699400 | Etch process and apparatus therefor In a process using a hot phosphoric acid etchant (12) to etch silicon nitride on a semiconductor wafer (15) submerged in a tank (11) of the etchant (12), a recirculating path is established for the etchant (12). A porous filter (35) is coated with silicon... | 03/02/2004 |
| 6652658 | Method for machining/cleaning by hydroxide ion in ultrapure water A method for clean processing wherein an object and a high pressure nozzle are disposed a specific distance apart from each other inside a washing tank containing only ultra-pure water, an ion exchange material or catalyst material that increases the amou... | 11/25/2003 |
| 6610213 | Process for the wet chemical treatment of a semiconductor wafer A process for the wet chemical treatment of a semiconductor wafer in a vessel, in which the semiconductor wafer is brought into contact with a liquid in which very small gas bubbles are dispersed. Two circuits are set up for conveying the liquid, with a f... | 08/26/2003 |
| 6527969 | Method and apparatus for rejuvenating polishing slurry A method for rejuvenating a polishing slurry that has been used for a chemical-mechanical polishing process includes the steps of: recovering the polishing slurry; and re-dispersing abrasive grains contained in the polishing slurry recovered. Specifically... | 03/04/2003 |
| 6503363 | System for reducing wafer contamination using freshly, conditioned alkaline etching solution A system for conditioning an alkaline etching solution for reducing contamination in a silicon wafer etching process. The system includes a conditioning tank for mixing a conditioned alkaline etching solution, the conditioned alkaline etching solution inc... | 01/07/2003 |
